公开(公告)号：US20090084584A1

公开(公告)日：2009-04-02

申请号：US12230700

申请日：2008-09-03

Applicant: Han-Seo Cho ,  Je-Gwang Yoo ,  Joon-Sung Kim ,  Sang-Hoon Kim

Inventor： Han-Seo Cho ,  Je-Gwang Yoo ,  Joon-Sung Kim ,  Sang-Hoon Kim

IPC: H05K1/00

CPC classification number: G02B6/4246 ,  G02B6/4214 ,  H05K1/0274 ,  H05K3/429 ,  H05K3/4691 ,  H05K2201/10121

Abstract: A printed circuit board is disclosed. The printed circuit board includes a first board unit and a second board unit disposed with a gap in-between, and a flexible optical board configured to transmit optical signals, which has one side stacked on the first board unit and the other side stacked on the second board unit, where the flexible optical board includes a core through which the optical signals travel, a cladding surrounding the core, and a circuit pattern buried in the cladding which transmits electrical signals. By forming the rigid boards and the flexible optical board as an integrated structure, the need for separate connectors is obviated, and thus the cost of the product can be lowered.

Abstract translation: 公开了印刷电路板。 印刷电路板包括第一板单元和设置在其间的间隙的第二板单元和被配置为传输光信号的柔性光板，所述光信号具有堆叠在第一板单元上的一侧，而另一侧堆叠在 第二板单元，其中柔性光学板包括光信号行进的芯，围绕芯的包层以及掩埋在包层中的传输电信号的电路图案。 通过将刚性板和柔性光学板形成为一体结构，可以避免对单独的连接器的需要，从而可以降低产品的成本。

公开(公告)号：US20090028494A1

公开(公告)日：2009-01-29

申请号：US12078948

申请日：2008-04-08

Applicant: Han-Seo Cho ,  Je-Gwang Yoo ,  Joon-Sung Kim ,  Sang-Hoon Kim

Inventor： Han-Seo Cho ,  Je-Gwang Yoo ,  Joon-Sung Kim ,  Sang-Hoon Kim

IPC: G02B6/12 ,  H05K3/00 ,  B29D11/00

CPC classification number: B29D11/00663 ,  G02B6/136 ,  G02B6/43 ,  H05K1/0274 ,  H05K3/3436 ,  H05K2201/10121 ,  Y10T29/49155

Abstract: An optical waveguide, a package board having the optical waveguide, and manufacturing methods thereof are disclosed. The method of manufacturing an optical waveguide includes: forming a first reflective bump and a second reflective bump, which have inclined surfaces formed on sides opposite to each other and which are disposed with a predetermined distance in-between, on one side of a first cladding; forming a core between the first reflective bump and the second reflective bump; and stacking a second cladding over the one side of the first cladding such that the second cladding covers the first reflective bump, the second reflective bump, and the core. With this method, inclined surfaces can be formed by stacking a metal layer on the lower cladding and then selectively etching the metal layer, which can reduce lead time and enable a high degree of freedom in design.

公开(公告)号：US07136551B2

公开(公告)日：2006-11-14

申请号：US11069870

申请日：2005-03-01

Applicant: Mu Hee Cho ,  Han Seo Cho ,  Hyo Hoon Park ,  Jong Ho Lee ,  Kyung Rok Kim

Inventor： Mu Hee Cho ,  Han Seo Cho ,  Hyo Hoon Park ,  Jong Ho Lee ,  Kyung Rok Kim

IPC: G02B6/42 ,  G02B6/26

CPC classification number: G02B6/06 ,  G02B6/43 ,  H05K1/0274

Abstract: Disclosed is an optical printed circuit board (PCB) having a multi-channel optical waveguide, which comprises: an optical waveguide having an optical path for transmitting light beams; a groove for penetrating the optical waveguide; and an optical interconnection block inserted in the groove and connected to the optical waveguide to transmit the light beams, wherein the optical interconnection block includes an optical fiber bundle bent by the angle of 90°. The optical interconnection block connects a plurality of multi-layered optical waveguides to transmit light beams to the optical waveguides. The optical fiber bundle is installed as a medium of the multi-channel optical waveguide in the optical PCB.

Abstract translation: 公开了一种具有多通道光波导的光学印刷电路板（PCB），其包括：具有用于透射光束的光路的光波导; 用于穿透光波导的凹槽; 以及插入在所述槽中并连接到所述光波导以传输所述光束的光学互连块，其中所述光学互连块包括以90°的角度弯曲的光纤束。 光互连块连接多个多层光波导以将光束传输到光波导。 光纤束作为多路光波导的介质安装在光学PCB中。

公开(公告)号：US20050220437A1

公开(公告)日：2005-10-06

申请号：US10959884

申请日：2004-10-06

Applicant: Dong-Su Kim ,  Hyo-Hun Park ,  Byung-Sup Rho ,  Han-Seo Cho ,  Sun-Tae Jung

Inventor： Dong-Su Kim ,  Hyo-Hun Park ,  Byung-Sup Rho ,  Han-Seo Cho ,  Sun-Tae Jung

IPC: G02B6/26 ,  G02B6/30 ,  G02B6/36 ,  G02B6/42 ,  G02B6/43

CPC classification number: G02B6/4214 ,  G02B6/30 ,  G02B6/3636 ,  G02B6/3652 ,  G02B6/3676 ,  G02B6/3692 ,  G02B6/421 ,  G02B6/43

Abstract: An optical module is disclosed. The optical module includes a substrate, and at least one planar optical waveguide that includes a plurality of waveguides and at least one groove vertically penetrating the upper surface of the substrate and which is successively laminated on the substrate. The optical module also includes at least one PCB having at least one integrated photoelectric conversion device that is positioned on the planar optical waveguide facing a corresponding groove, and at least one optical connection block including a body and optical fibers embedded in the body in such a manner that both ends thereof are exposed to the lateral and upper surfaces of the body. The optical connection block is inserted into the corresponding groove of the planar optical waveguide in such a manner that both ends of the optical fibers, which have been exposed, face the waveguides and the PCBs, respectively.

Abstract translation: 公开了一种光学模块。 光学模块包括基板和至少一个平面光波导，其包括多个波导和至少一个垂直地穿过基板的上表面并且依次层压在基板上的凹槽。 该光学模块还包括至少一个PCB，其具有位于面对相应凹槽的平面光波导上的至少一个集成光电转换装置，以及包括主体的至少一个光学连接块和嵌入在主体中的光纤 使其两端暴露于身体的侧表面和上表面。 将光连接块插入到平面光波导的相应凹槽中，使得已经暴露的光纤的两端分别面对波导和PCB。

公开(公告)号：US20050100264A1

公开(公告)日：2005-05-12

申请号：US10795612

申请日：2004-03-08

Applicant: Dong-Su Kim ,  Hyo-Hoon Park ,  Han-Seo Cho ,  Byung-Sup Rho ,  Sun-Tae Jung

Inventor： Dong-Su Kim ,  Hyo-Hoon Park ,  Han-Seo Cho ,  Byung-Sup Rho ,  Sun-Tae Jung

IPC: G02B6/12 ,  G02B6/42 ,  H05K1/02

CPC classification number: G02B6/42 ,  G02B6/4214 ,  H05K1/0274

Abstract: A packaging apparatus for optical interconnection on an optical PCB includes a first substrate with a via hole formed therethrough and in which an optical waveguide is formed, an optical interconnection block having a reflective plane on its lower end inserted into the via hole, a second substrate flip-bonded to an upper surface of the first substrate, and an optically active element flip-bonded to a lower surface of the second substrate and aligned for optical communication.

Abstract translation: 一种用于光学PCB上的光学互连的封装装置，包括：第一基板，其具有形成在其中的通孔，并且其中形成有光波导;光学互连块，其下端插入通孔的反射平面;第二基板 翻转接合到第一基板的上表面，以及光学活性元件，其被翻转接合到第二基板的下表面并对准以进行光通信。

公开(公告)号：US20120171624A1

公开(公告)日：2012-07-05

申请号：US13419826

申请日：2012-03-14

Applicant: Joon Sung KIM ,  Sang Hoon Kim ,  Jae Hyun Jung ,  Han Seo Cho

Inventor： Joon Sung KIM ,  Sang Hoon Kim ,  Jae Hyun Jung ,  Han Seo Cho

IPC: G03F7/20

CPC classification number: G02B6/1221 ,  G02B2006/1219 ,  H05K1/0274

Abstract: Disclosed herein is a printed circuit board for an optical waveguide, including a base board, and an optical waveguide formed on the base board. The optical waveguide includes a lower clad layer formed on the base board, an insulation layer formed on the lower clad layer and having a core-forming through-hole, a core part formed on a region of the lower clad layer, which is exposed through the through-hole, and an upper clad layer formed in the through-hole and on the insulation layer.

Abstract translation: 这里公开了一种用于光波导的印刷电路板，包括基板和形成在基板上的光波导。 光波导包括形成在基板上的下包层，形成在下包层上并具有芯形成通孔的绝缘层，形成在下包层的区域上的芯部，其暴露于 所述通孔和形成在所述通孔中和所述绝缘层上的上覆层。

公开(公告)号：US08056220B2

公开(公告)日：2011-11-15

申请号：US12314450

申请日：2008-12-10

Applicant: Sang-Hoon Kim ,  Je-Gwang Yoo ,  Joon-Sung Kim ,  Han Seo Cho

Inventor： Sang-Hoon Kim ,  Je-Gwang Yoo ,  Joon-Sung Kim ,  Han Seo Cho

IPC: H05K3/00 ,  G02B6/12

CPC classification number: G02B6/43 ,  G02B6/4214 ,  H05K1/0274 ,  H05K3/4691 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A printed circuit board is disclosed. A printed circuit board, which includes a first board part, a flexible board part which has one side coupled with the first board part and which includes an electrical wiring layer and an optical waveguide to transmit both electrical signals and optical signals, and a second board part coupled with the other side of the flexible board part, where the electrical wiring layer and the optical waveguide are disposed with a gap in-between, can provide greater bendability and reliability, by having the optical waveguide and electrical wiring layer separated with a gap in-between at the flexible portion of the board, and the optical waveguide can be manufactured with greater precision for even higher reliability, by having the optical waveguide manufactured separately and then inserted during the manufacturing process of the board.

Abstract translation: 公开了印刷电路板。 一种印刷电路板，包括第一板部分，柔性板部分，其一侧与第一板部分耦合并且包括电布线层和光波导以传输电信号和光信号;以及第二板 与柔性基板部分的另一侧耦合的部分，其中电布线层和光波导在其间具有间隙设置，可以通过使光波导和电布线层间隔开来提供更大的弯曲性和可靠性 在板的柔性部分之间，通过使光波导分别制造，然后在板的制造过程中插入，可以以更高的精度制造光波导以获得更高的可靠性。

公开(公告)号：US08036501B2

公开(公告)日：2011-10-11

申请号：US12588453

申请日：2009-10-15

Applicant: Sang Hoon Kim ,  Han Seo Cho ,  Jae Hyun Jung ,  Joon Sung Kim

Inventor： Sang Hoon Kim ,  Han Seo Cho ,  Jae Hyun Jung ,  Joon Sung Kim

IPC: G02B6/12

CPC classification number: G02B6/43 ,  B32B2307/51 ,  B32B2457/08 ,  C07D301/06 ,  G02B6/138 ,  H05K1/0274 ,  H05K1/028 ,  H05K3/281 ,  H05K3/4635 ,  H05K2203/063 ,  Y10T29/49126 ,  Y10T156/10

Abstract: The present invention relates to a printed circuit board for optical waveguides and a method of manufacturing the same. The present invention provides a printed circuit board for optical waveguides includes: a base substrate; an optical waveguide that is formed on an upper middle of the base substrate and includes a lower clad, a core formed on an upper middle of the lower clad, and an upper clad formed on the lower clad to surround an upper surface and a side surface of the core; and a side substrate that is formed on the base substrate and has a through hole, through which the optical waveguide penetrates, provided at the middle thereof and a circuit pattern formed therein and a method of manufacturing a printed circuit board for optical waveguides.

公开(公告)号：US20110103737A1

公开(公告)日：2011-05-05

申请号：US12761752

申请日：2010-04-16

Applicant: Joon-Sung KIM ,  Han-Seo Cho ,  Jae-Hyun Jung ,  Sang-Hoon Kim

Inventor： Joon-Sung KIM ,  Han-Seo Cho ,  Jae-Hyun Jung ,  Sang-Hoon Kim

IPC: G02B6/12 ,  B32B37/00

CPC classification number: G02B6/138 ,  B32B38/06 ,  B32B2038/047 ,  B32B2457/08 ,  G02B6/1221 ,  H05K1/0274

Abstract: An optical wiring board and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, the method includes providing a base substrate having a wiring groove formed therein, forming a first clad layer by filling a first clad substance in the wiring groove, stacking an intermediate insulating layer on the base substrate, in which the intermediate insulating layer has a through-hole formed therein and the through-hole corresponds to the wiring groove, forming a core unit on the first clad layer, forming a second clad layer by filling a second clad substance in the through-hole, in which the second clad layer covers the core unit, and stacking a cover insulting layer on the intermediate insulating layer, in which the cover insulating layer covers the second clad layer.

Abstract translation: 公开了一种光布线板及其制造方法。 根据本发明的一个实施例，该方法包括提供其中形成有布线槽的基底基板，通过在布线槽中填充第一包层物质形成第一覆盖层，在基底基板上堆叠中间绝缘层， 其中中间绝缘层具有形成在其中的通孔，并且通孔对应于布线槽，在第一包层上形成芯单元，通过在通孔中填充第二包层物质形成第二包层 其中第二覆盖层覆盖芯单元，并且在覆盖绝缘层覆盖第二覆层的中间绝缘层上堆叠覆盖绝缘层。

公开(公告)号：US20110007999A1

公开(公告)日：2011-01-13

申请号：US12923143

申请日：2010-09-03

Applicant: Sang-Hoon Kim ,  Je-Gwang Yoo ,  Joon-Sung Kim ,  Jae-Hyun Jung ,  Han-Seo Cho

Inventor： Sang-Hoon Kim ,  Je-Gwang Yoo ,  Joon-Sung Kim ,  Jae-Hyun Jung ,  Han-Seo Cho

IPC: G02B6/12

CPC classification number: G02B6/12002 ,  G02B6/13 ,  G02B6/43 ,  H05K1/0274 ,  H05K3/4652 ,  H05K3/4691

Abstract: A printed circuit board including a first optical waveguide having a circuit pattern and a pad buried in one side thereof, a first insulation layer stacked over one side of the first optical waveguide, a first insulating material stacked over the first insulation layer, a first electrical wiring layer stacked over the first insulating material, a second optical waveguide having a circuit pattern and a pad buried in one side thereof, a second insulation layer stacked over one side of the second optical waveguide, a second insulating material stacked over the second insulation layer, a second electrical wiring layer stacked over the second insulating material, an intermediate layer interposed between the other side of the first optical waveguide and the other side of the second optical waveguide such that the first optical waveguide and the second optical waveguide are attached, and a via penetrating the first optical waveguide and the second optical waveguide.

Abstract translation: 一种印刷电路板，包括具有电路图案的第一光波导和埋在其一侧的焊盘，堆叠在所述第一光波导的一侧上的第一绝缘层，堆叠在所述第一绝缘层上的第一绝缘材料， 布线层堆叠在第一绝缘材料上，具有电路图案和埋在其一侧的焊盘的第二光波导，堆叠在第二光波导的一侧上的第二绝缘层，堆叠在第二绝缘层上的第二绝缘材料 层叠在所述第二绝缘材料上的第二电布线层，插入在所述第一光波导的另一侧和所述第二光波导的另一侧之间的中间层，使得附接所述第一光波导和所述第二光波导;以及 穿过第一光波导和第二光波导的通孔。