公开(公告)号：US20130200529A1

公开(公告)日：2013-08-08

申请号：US13369126

申请日：2012-02-08

Applicant: Jing-Cheng Lin ,  Szu Wei Lu ,  I-Hsuan Peng

Inventor： Jing-Cheng Lin ,  Szu Wei Lu ,  I-Hsuan Peng

IPC: H01L23/28 ,  H01L21/56

CPC classification number: H01L23/18 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/49827 ,  H01L23/5384 ,  H01L24/17 ,  H01L24/94 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/1712 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2924/181 ,  H01L2224/81 ,  H01L2924/00

Abstract: Semiconductor device packaging methods and structures thereof are disclosed. In one embodiment, a method of packaging semiconductor devices includes coupling a plurality of second dies to a top surface of a first die, and determining a distance between each of the plurality of second dies and the first die. The method also includes determining an amount of underfill material to dispose between the first die and each of the plurality of second dies based on the determined distance, and disposing the determined amount of the underfill material under each of the plurality of second dies.

Abstract translation: 公开了半导体器件封装方法及其结构。 在一个实施例中，封装半导体器件的方法包括将多个第二管芯耦合到第一管芯的顶表面，以及确定多个第二管芯和第一管芯之间的距离。 该方法还包括基于确定的距离来确定在第一模具和第一模具中的每一个之间配置的底部填充材料的量，以及将确定量的底部填充材料设置在多个第二模具的每一个下。

公开(公告)号：US20120040626A1

公开(公告)日：2012-02-16

申请号：US12953412

申请日：2010-11-23

Applicant: Yen-Wen CHEN ,  I-Hsuan PENG

Inventor： Yen-Wen CHEN ,  I-Hsuan PENG

IPC: H04B7/00

CPC classification number: H04B7/086 ,  H04B7/0426 ,  H04B7/0617

Abstract: A wireless transmission system includes several candidate devices, a wireless transmission interface and a wireless transmission device. The wireless transmission device includes a storage unit, a transmission direction information generating unit -and a processing unit. The processing unit receives the device information of each of the candidate devices from each of the candidate devices respectively through the wireless transmission interface. The processing unit calculates transmission direction range according to the transmission direction information, which is generated through the transmission direction information generating unit. The processing unit selects at least one of the candidate devices, which matches the transmission direction range. Wherein, the selected at least one candidate device is taken as at least one transmission target device. The processing unit transmits the information to be transmitted, which is stored in the storage unit, to the transmission target device through the wireless transmission interface.

Abstract translation: 无线传输系统包括若干候选设备，无线传输接口和无线传输设备。 无线传输装置包括存储单元，传输方向信息生成单元和处理单元。 处理单元通过无线传输接口分别从每个候选设备接收每个候选设备的设备信息。 处理单元根据通过发送方向信息生成单元生成的发送方向信息来计算发送方向范围。 处理单元选择与传输方向范围相匹配的候选设备中的至少一个。 其中，将所选择的至少一个候选设备作为至少一个传输目标设备。 处理单元通过无线传输接口将存储在存储单元中的要发送的信息发送到发送目标设备。

公开(公告)号：USD624069S1

公开(公告)日：2010-09-21

申请号：US29351453

申请日：2009-12-05

Applicant: Po-Hsuan Peng ,  Cheng-Chen Lee

Designer： Po-Hsuan Peng ,  Cheng-Chen Lee

公开(公告)号：US20090155988A1

公开(公告)日：2009-06-18

申请号：US12353072

申请日：2009-01-13

Applicant: I-Hsuan PENG ,  Chin-jen HUANG ,  Liang-Tang WANG ,  Jung-Fang CHANG ,  Te-Chi WONG

Inventor： I-Hsuan PENG ,  Chin-jen HUANG ,  Liang-Tang WANG ,  Jung-Fang CHANG ,  Te-Chi WONG

IPC: H01L21/20

CPC classification number: C30B25/105 ,  C23C16/24 ,  C23C16/507 ,  C30B29/06 ,  H01L21/02532 ,  H01L21/02595 ,  H01L21/0262 ,  H01L21/02667 ,  H01L27/1281 ,  H01L27/1285

Abstract: A low temperature poly-silicon thin film element, method of making poly-silicon thin film by direct deposition at low temperature, and the inductively-coupled plasma chemical vapor deposition equipment utilized, wherein the poly-silicon material is induced to crystallize into a poly-silicon thin film at low temperature by means of high density plasma and substrate bias voltage. Furthermore, the atom structure of the poly-silicon thin film is aligned in regular arrangement by making use of the induction layer having optimal orientation and lattice constant close to that of the silicon, thus raising the crystallization quality of the poly-silicon thin film and reducing the thickness of the incubation layer.

Abstract translation: 低温多晶硅薄膜元件，通过在低温下直接沉积制造多晶硅薄膜的方法，以及所用的电感耦合等离子体化学气相沉积设备，其中所述多晶硅材料被诱导结晶成聚 硅薄膜在低温下通过高密度等离子体和衬底偏置电压。 此外，通过利用具有接近于硅的最佳取向和晶格常数的感应层，多数硅薄膜的原子结构以规则的排列排列，从而提高多晶硅薄膜的结晶质量， 减少孵育层的厚度。

公开(公告)号：US07521341B2

公开(公告)日：2009-04-21

申请号：US11270862

申请日：2005-11-09

Applicant: Liang-Tang Wang ,  Chi-Lin Chen ,  I-Hsuan Peng ,  Jung-Fang Chang ,  Chin-Jen Huang

Inventor： Liang-Tang Wang ,  Chi-Lin Chen ,  I-Hsuan Peng ,  Jung-Fang Chang ,  Chin-Jen Huang

IPC: H01L21/36

CPC classification number: H01L21/02532 ,  C23C16/0272 ,  C23C16/24 ,  C23C16/5096 ,  H01L21/02422 ,  H01L21/0262 ,  H01L27/1214

Abstract: A method for forming a polysilicon film in a plasma-assisted chemical vapor deposition (CVD) system including a chamber in which a first electrode and a second electrode spaced apart from the first electrode are provided comprises providing a substrate on the second electrode, the substrate including a surface exposed to the first electrode, applying a first power to the first electrode for generating a plasma in the chamber, applying a second power to the second electrode during a nucleation stage of the polysilicon film for ion bombarding the surface of the substrate, and flowing an erosive gas into the chamber.

Abstract translation: 一种在等离子体辅助化学气相沉积（CVD）系统中形成多晶硅膜的方法，包括：设置有与第一电极间隔开的第一电极和第二电极的腔室，包括在第二电极上设置衬底， 包括暴露于第一电极的表面，向第一电极施加第一功率以在腔室中产生等离子体，在用于离子轰击衬底表面的多晶硅膜的成核阶段期间，向第二电极施加第二功率， 并将侵蚀性气体流入室内。

公开(公告)号：US20060093738A1

公开(公告)日：2006-05-04

申请号：US10979880

申请日：2004-11-01

Applicant: Yung-Jen Lin ,  Jung-Chang Hu ,  Chien-Ming Tseng ,  Hsuan-Peng Lin ,  Chih-Chao Hsu

Inventor： Yung-Jen Lin ,  Jung-Chang Hu ,  Chien-Ming Tseng ,  Hsuan-Peng Lin ,  Chih-Chao Hsu

IPC: B05D3/02 ,  B05D1/36 ,  B05D3/00

CPC classification number: C30B29/20

Abstract: A transparent ceramic structure and a method of surface treatment thereof are disclosed. A glass powder is applied over an unpolished surface of an intrinsically transparent ceramic structure. The ceramic structure is then placed in high temperature which is higher than the melting temperature of the glass powder and lower than 1,700° C. for about 1 minute to about 5 minutes. The transparent ceramic structure is removed from the environment and cooled down so as to obtain the desired transparency and strength of the ceramic structure.

Abstract translation: 公开了透明陶瓷结构及其表面处理方法。 将玻璃粉末涂覆在本体透明陶瓷结构的未抛光表面上。 然后将陶瓷结构放置在高于玻璃粉末的熔融温度的高温下，低于1,700℃约1分钟至约5分钟。 将透明陶瓷结构从环境中除去并冷却，以获得所需的陶瓷结构的透明度和强度。

公开(公告)号：US20050243512A1

公开(公告)日：2005-11-03

申请号：US10834081

申请日：2004-04-29

Applicant: Po-Hsuan Peng

Inventor： Po-Hsuan Peng

IPC: G06F1/16 ,  G06F1/18 ,  G06F1/20 ,  H05K5/00 ,  H05K5/02

CPC classification number: G06F1/1656 ,  G06F1/1613 ,  G06F1/182 ,  G06F1/203 ,  H05K5/0213

Abstract: A portable industrial computer includes a host having an aperture located on a bottom side leading to the interior of the host and a movable heat dissipation panel pivotally coupled on the aperture in a movable manner to open or close the aperture. The movable heat dissipation panel has a top end extended outside the bottom side of the host and the aperture when the movable heat panel closes the aperture so when the portable industrial computer rested on a loading object generating a reaction force towards the interior of the host to push the movable heat dissipation panel to open the aperture for dispersing heat from the interior of the host. When the portable industrial computer removed from the loading object, the movable heat dissipation panel closes the aperture to prevent water or dust from entering the interior of the host avoiding damage.

Abstract translation: 一种便携式工业计算机包括主机，该主机具有位于主机内部的底侧上的孔，以及以可移动方式可枢转地联接在孔上的可移动散热板，以打开或关闭该孔。 可移动散热面板的顶端延伸到主体底部的外侧，当可移动热面板关闭孔时，当便携式工业计算机搁置在加载对象上时，该端部产生朝向主机内部的反作用力 推动可移动散热板打开用于分散主机内部热量的孔。 当便携式工业计算机从装载物体移除时，可移动散热板关闭孔径，以防止水或灰尘进入主机内部，避免损坏。

公开(公告)号：US08232684B2

公开(公告)日：2012-07-31

申请号：US12204973

申请日：2008-09-05

Applicant: Tung-Jung Yeh ,  Sheng-Hsuan Peng ,  Horng-Shinn Ko ,  Wen-Te Hung

Inventor： Tung-Jung Yeh ,  Sheng-Hsuan Peng ,  Horng-Shinn Ko ,  Wen-Te Hung

IPC: H01H47/00

CPC classification number: H02J3/14 ,  G05B2219/2639 ,  H02J2003/146 ,  Y02B70/3225 ,  Y02B70/3266 ,  Y04S20/222 ,  Y04S20/224 ,  Y04S20/242 ,  Y10T307/461 ,  Y10T307/469 ,  Y10T307/832

Abstract: A method for power load management is provided in the present invention, wherein two different standard values are determined to be a basis for regulating power consumption. When power consumption exceeds a first standard value, a monitoring procedure is started to monitor consumption status. If the power consumption exceeds a second standard value, an unloading procedure is processed to reduce the power consumption of electrical devices under operation. In another embodiment, the present invention also provides a system for power load management comprising a control unit coupled to at least one electrical device and a power meter. By means of real-time recording of power consumption in the power meter, the control unit is capable of determining the power consumption status and determining whether it is necessary to unload or reload the at least one electrical device.

公开(公告)号：US08232675B2

公开(公告)日：2012-07-31

申请号：US12769513

申请日：2010-04-28

Applicant: Tung-Jung Yeh ,  Sheng-Hsuan Peng ,  Horng-Shinn Ko ,  Wen-Te Hung

Inventor： Tung-Jung Yeh ,  Sheng-Hsuan Peng ,  Horng-Shinn Ko ,  Wen-Te Hung

IPC: H01H47/00

CPC classification number: H02J3/14 ,  G05B2219/2639 ,  H02J2003/146 ,  Y02B70/3225 ,  Y02B70/3266 ,  Y04S20/222 ,  Y04S20/224 ,  Y04S20/242 ,  Y10T307/461 ,  Y10T307/469 ,  Y10T307/832

Abstract: A method for power load management is provided in the present invention, wherein two different standard values are determined to be a basis for regulating power consumption. When power consumption exceeds a first standard value, a monitoring procedure is started to monitor consumption status. If the power consumption exceeds a second standard value, an unloading procedure is processed to reduce the power consumption of electrical devices under operation. In another embodiment, the present invention also provides a system for power load management comprising a control unit coupled to at least one electrical device and a power meter. By means of real-time recording of power consumption in the power meter, the control unit is capable of determining the power consumption status and determining whether it is necessary to unload or reload the at least one electrical device.

Abstract translation: 在本发明中提供了一种用于功率负载管理的方法，其中两个不同的标准值被确定为用于调节功耗的基础。 当功耗超过第一标准值时，监控程序开始监控消费状态。 如果功率消耗超过第二标准值，则处理卸载程序以降低正在运行的电气设备的功率消耗。 在另一个实施例中，本发明还提供一种用于功率负载管理的系统，其包括耦合到至少一个电气设备和功率计的控制单元。 通过实时记录功率计中的功率消耗，控制单元能够确定功耗状态并确定是否需要卸载或重新加载至少一个电气设备。

公开(公告)号：US20120152054A1

公开(公告)日：2012-06-21

申请号：US13243997

申请日：2011-09-23

Applicant: Po-Hsuan Peng

Inventor： Po-Hsuan Peng

IPC: G05G5/04

CPC classification number: G06F1/187 ,  G06F1/1658 ,  G11B33/124 ,  Y10T74/20636

Abstract: A stopping mechanism is disposed on a machine body and a removable device. The stopping mechanism includes a rectilinearly moving action member, a rotationally moving clipping member, and a stopping member fixedly disposed on the machine body, in which the action member pushes and presses against the clipping member so that the clipping member rotates to a holder position. The action member presses against the stopping member fixedly disposed on the machine body through a tilt angle relation at the holder position, so that an accelerating force generated by the removable device under impact is transferred to the machine body, thus dispersing the impact force.

Abstract translation: 在机体和可移动装置上设置止动机构。 该止动机构包括直线移动作用部件，旋转移动的夹持部件和固定地设置在机体上的止动部件，动作部件推压并压靠在夹持部件上，使得夹持部件转动到保持器位置。 动作构件通过在保持器位置处的倾斜角关系压靠固定地设置在机体上的止动构件，使得由冲击下的可移除装置产生的加速力传递到机体，从而分散冲击力。