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公开(公告)号:US20250088348A1
公开(公告)日:2025-03-13
申请号:US18889148
申请日:2024-09-18
Applicant: Intel Corporation
Inventor: Shay GUERON , Vlad KRASNOV
Abstract: A processor includes a decode unit to decode an SM3 two round state word update instruction. The instruction is to indicate one or more source packed data operands. The source packed data operand(s) are to have eight 32-bit state words Aj, Bj, Cj, Dj, Ej, Fj, Gj, and Hj that are to correspond to a round (j) of an SM3 hash algorithm. The source packed data operand(s) are also to have a set of messages sufficient to evaluate two rounds of the SM3 hash algorithm. An execution unit coupled with the decode unit is operable, in response to the instruction, to store one or more result packed data operands, in one or more destination storage locations. The result packed data operand(s) are to have at least four two-round updated 32-bit state words Aj+2, Bj+2, Ej+2, and Fj+2, which are to correspond to a round (j+2) of the SM3 hash algorithm.
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公开(公告)号:US20250087542A1
公开(公告)日:2025-03-13
申请号:US18466019
申请日:2023-09-13
Applicant: Intel Corporation
Inventor: Man Chun OOH , Wei Chung LEE , Yean Ling SOON , Kor Oon LEE , Jackson Chung Peng KONG , Azniza ABD AZIZ , Piyush BHATT
IPC: H01L23/24 , H01L23/498
Abstract: The present disclosure is directed to an improved stiffener that has a body that has extension members positioned proximally to the corners of a semiconductor package substrate, and the extension members have bottom extension surfaces that extend beyond a periphery of a bottom surface of the semiconductor package substrate, and the bottom extension surfaces and the bottom surface of the semiconductor package substrate are co-planar. The present disclosure is also directed to a method for forming the improved stiffener with the extension members for a semiconductor package.
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公开(公告)号:US20250087530A1
公开(公告)日:2025-03-13
申请号:US18463436
申请日:2023-09-08
Applicant: Intel Corporation
Inventor: Chiao-Ti Huang , Tao Chu , Guowei Xu , Robin Chao , Feng Zhang , Yang Zhang , Ting-Hsiang Hung , Anand Murthy
IPC: H01L21/762 , H01L21/768 , H01L23/48 , H01L27/088 , H01L27/12
Abstract: Techniques are provided to form semiconductor devices where portions of the gate structure (e.g., foot structures) adjacent to the subfins have been removed. A semiconductor device includes a gate structure around or otherwise on a semiconductor region. The gate structure includes a gate dielectric and a gate electrode. The gate structure may be interrupted, for example, between two transistors with a gate cut that extends through an entire thickness of the gate structure and includes dielectric material to electrically isolate the portions of the gate structure on either side of the gate cut. The gate cut includes dielectric lobe structures that extend outwards from the sidewalls of the gate cut. The lobe structures effectively replace foot structures of the gate structure between the gate cut and subfin portions of the semiconductor fins. Removing the gate foot structures contributes to the reduction of the parasitic capacitance in the semiconductor device.
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公开(公告)号:US20250085969A1
公开(公告)日:2025-03-13
申请号:US18462832
申请日:2023-09-07
Applicant: Intel Corporation
Inventor: Shuai Mu , Supratim Pal , Pradeep Golconda , Srilakshmi Jammula , Jiasheng Chen
Abstract: An apparatus to facilitate unblocking the integer pipeline during math pipeline phases in a graphics environment is disclosed. The apparatus includes an execution resource comprising: a thread arbiter; a plurality of execution pipeline hardware circuitry comprising a math execution pipeline and an integer execution pipeline to share resources of the thread arbiter; arbitration hardware circuitry to determine whether the math execution pipeline is available for loading math operand data of a math instruction; and a math instruction staging buffer to store the math operand data responsive to the math execution pipeline not being available; wherein the integer execution pipeline is to receive integer operand data for an integer instruction while bypassing the math operand data in the math instruction staging buffer; and wherein the math execution pipeline is to receive, responsive to the math execution pipeline becoming available, the math operand data from the math instruction staging buffer.
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公开(公告)号:US20250085753A1
公开(公告)日:2025-03-13
申请号:US18367038
申请日:2023-09-12
Applicant: Intel Corporation
Inventor: Brandon COURTNEY , Greg LA TOUR , Wei-Yi SUNG
IPC: G06F1/26
Abstract: Disclosed are techniques for implementing power monitoring in computing systems using current sense devices.
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公开(公告)号:US12250800B2
公开(公告)日:2025-03-11
申请号:US17482244
申请日:2021-09-22
Applicant: Intel Corporation
Inventor: Yew San Lim , Jeff Ku , Boon Ping Koh , Min Suet Lim , Tin Poay Chuah
Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a radiation shield that includes a zipper. The radiation shield can include a wall that extends from a support structure of the electronic device, a first portion that is coupled to a cold plate over a radiation source, a second portion that is coupled to the wall, and a zipper that can zip the first portion to the second portion together and can unzip to separate the first portion from the second portion.
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公开(公告)号:US12250233B2
公开(公告)日:2025-03-11
申请号:US18105580
申请日:2023-02-03
Applicant: INTEL CORPORATION
Inventor: Marcio Juliato , Javier Perez-Ramirez , Manoj Sastry , Dave Cavalcanti , Christopher Gutierrez , Vuk Lesi , Shabbir Ahmed
IPC: H04L9/40
Abstract: Techniques include a method, apparatus, system and computer-readable medium to detect, quantify and localize attacks to enhance security for time-synchronized networking. Embodiments include a diagnostic stream producer to produce diagnostic information providing evidence of a timing attack on a node of a time-synchronized network. Embodiments include a diagnostic stream consumer to consume diagnostic information, analyze the diagnostic information, and determine whether a node is under a timing attack. Other embodiments are described and claimed.
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公开(公告)号:US12249997B2
公开(公告)日:2025-03-11
申请号:US17338497
申请日:2021-06-03
Applicant: Intel Corporation
Inventor: Somnath Kundu , Hao Luo , Brent Carlton
IPC: H03L7/099
Abstract: An apparatus and method are provided to re-configure an existing low-jitter phase locked loop (PLL) circuit for fast start-up during system wake-up. During system start-up, a feed-back path of the PLL is disconnected to independently control the VCO frequency. This independently controlled VCO then injects energy into a resonator (e.g., a crustal oscillator) for its fast start-up. Once a resonance frequency of the resonator is detected and an oscillation builds up in the resonator, a VCO control voltage is stored. The PLL feedback is then restored and the stored VCO control voltage is applied to perform phase-locking operation. Since the PLL control voltage is already set to the desired operating point, the PLL lock time is very small.
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39.
公开(公告)号:US12249622B2
公开(公告)日:2025-03-11
申请号:US16713684
申请日:2019-12-13
Applicant: Intel Corporation
Inventor: Tanuj Trivedi , Rahul Ramaswamy , Jeong Dong Kim , Ting Chang , Walid M. Hafez , Babak Fallahazad , Hsu-Yu Chang , Nidhi Nidhi
IPC: H01L29/786 , H01L21/8234 , H01L27/088 , H01L29/06 , H01L29/423 , H01L29/66 , H01L29/78 , B82Y40/00
Abstract: Embodiments disclosed herein include nanowire and nanoribbon devices with non-uniform dielectric thicknesses. In an embodiment, the semiconductor device comprises a substrate and a plurality of first semiconductor layers in a vertical stack over the substrate. The first semiconductor layers may have a first spacing. In an embodiment, a first dielectric surrounds each of the first semiconductor layers, and the first dielectric has a first thickness. The semiconductor device may further comprise a plurality of second semiconductor layers in a vertical stack over the substrate, where the second semiconductor layers have a second spacing that is greater than the first spacing. In an embodiment a second dielectric surrounds each of the second semiconductor layers, and the second dielectric has a second thickness that is greater than the first thickness.
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公开(公告)号:US12248800B2
公开(公告)日:2025-03-11
申请号:US17561433
申请日:2021-12-23
Applicant: Intel Corporation
Inventor: Gilbert Neiger , Rajesh Sankaran , Hisham Shafi
Abstract: Embodiments of apparatuses, methods, and systems for virtualization of interprocessor interrupts are disclosed. In an embodiment, an apparatus includes a plurality of processor cores; an interrupt controller register; and logic to, in response to a write from a virtual machine to the interrupt controller register, record an interprocessor interrupt in a first data structure configured by a virtual machine monitor and send a notification of the interprocessor interrupt to at least one of the plurality of processor cores.
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