Nonvolatile semiconductor memory device
    31.
    发明授权
    Nonvolatile semiconductor memory device 有权
    非易失性半导体存储器件

    公开(公告)号:US08076709B2

    公开(公告)日:2011-12-13

    申请号:US12873679

    申请日:2010-09-01

    CPC classification number: G11C16/0466 H01L21/28282 H01L29/66833 H01L29/792

    Abstract: In a situation where a memory cell includes an ONO film, which comprises a silicon nitride film for charge storage and oxide films positioned above and below the silicon nitride film; a memory gate above the ONO film; a select gate, which is adjacent to a lateral surface of the memory gate via the ONO film; a gate insulator positioned below the select gate; a source region; and a drain region, an erase operation is performed by injecting holes generated by BTBT into the silicon nitride film while applying a positive potential to the source region, applying a negative potential to the memory gate, applying a positive potential to the select gate, and flowing a current from the drain region to the source region, thus improving the characteristics of a nonvolatile semiconductor memory device.

    Abstract translation: 在存储单元包括ONO膜的情况下,其包括用于电荷存储的氮化硅膜和位于氮化硅膜上方和下方的氧化膜; 在ONO电影上方的记忆门; 选择栅极,其经由ONO膜与存储栅的侧表面相邻; 位于选择门下方的栅极绝缘体; 源区; 和漏极区域,通过将BTBT产生的空穴注入氮化硅膜,同时向源极区域施加正电位,向存储栅极施加负电位,向选择栅极施加正电位,进行擦除操作,以及 使电流从漏极区域流向源极区域,从而改善非易失性半导体存储器件的特性。

    Semiconductor nonvolatile memory device
    32.
    发明授权
    Semiconductor nonvolatile memory device 有权
    半导体非易失性存储器件

    公开(公告)号:US08064261B2

    公开(公告)日:2011-11-22

    申请号:US12787158

    申请日:2010-05-25

    Abstract: An operation scheme for operating stably a semiconductor nonvolatile memory device is provided.When hot-hole injection is conducted in the semiconductor nonvolatile memory device of a split gate structure, the hot-hole injection is verified using a crossing point that does not change with time. Thus, an erased state can be verified without being aware of any time-varying changes.Also, programming or programming/erasure is conducted by repeating pulse voltage or multi-step voltage application to a gate section multiple times.

    Abstract translation: 提供一种稳定运行半导体非易失性存储器件的操作方案。 当在分裂栅结构的半导体非易失性存储器件中进行热孔注入时,使用不随时间变化的交叉点来验证热孔注入。 因此,可以验证擦除状态,而不知道任何时变变化。 此外,通过将多次脉冲电压或多级电压施加到栅极部分进行编程或编程/擦除。

    Semiconductor device and manufacturing method for semiconductor device to reduce the lithography masks
    33.
    发明授权
    Semiconductor device and manufacturing method for semiconductor device to reduce the lithography masks 有权
    用于半导体器件的半导体器件和制造方法来减少光刻掩模

    公开(公告)号:US07863131B2

    公开(公告)日:2011-01-04

    申请号:US11189078

    申请日:2005-07-26

    Abstract: Semiconductor device and manufacturing method for reducing the number of required lithography masks added to the nonvolatile memory in the standard CMOS process to shorten the production period and reduce costs. In a split-gate memory cell with silicided gate electrodes utilizing a sidewall structure, a separate auxiliary pattern is formed adjoining the selected gate electrodes. A contact is set on a wiring layer self-aligned by filling side-wall gates of polysilicon in the gap between the electrodes and auxiliary pattern. The contact may overlap onto the auxiliary pattern and device isolation region, in an optimal design considering the size of the occupied surface area. If the distance to the selected gate electrode is x, the ONO film deposit thickness is t, and the polysilicon film deposit thickness is d, then the auxiliary pattern may be separated just by a distance x such that x

    Abstract translation: 用于减少在标准CMOS工艺中添加到非易失性存储器中的所需光刻掩模的数量的半导体器件和制造方法,以缩短生产周期并降低成本。 在具有利用侧壁结构的硅化栅电极的分裂栅极存储单元中,形成邻接所选择的栅电极的单独辅助图案。 通过填充电极和辅助图案之间的间隙中的多晶硅的侧壁栅极,将接触设置在自对准的布线层上。 考虑到占用的表面积的大小,接触可以以最佳设计重叠在辅助图案和设备隔离区域上。 如果与选定的栅电极的距离为x,则ONO膜沉积厚度为t,多晶硅膜沉积厚度为d,则辅助图案可以仅分开距离x,使得x <2×(t + d )。

    Fabrication method and structure of semiconductor non-volatile memory device
    34.
    发明授权
    Fabrication method and structure of semiconductor non-volatile memory device 有权
    半导体非易失性存储器件的制造方法和结构

    公开(公告)号:US07671404B2

    公开(公告)日:2010-03-02

    申请号:US11589095

    申请日:2006-10-30

    Abstract: A non-volatile semiconductor memory device with good write/erase characteristics is provided. A selection gate is formed on a p-type well of a semiconductor substrate via a gate insulator, and a memory gate is formed on the p-type well via a laminated film composed of a silicon oxide film, a silicon nitride film, and a silicon oxide film. The memory gate is adjacent to the selection gate via the laminated film. In the regions on both sides of the selection gate and the memory gate in the p-type well, n-type impurity diffusion layers serving as the source and drain are formed. The region controlled by the selection gate and the region controlled by the memory gate located in the channel region between said impurity diffusion layers have the different charge densities of the impurity from each other.

    Abstract translation: 提供具有良好写入/擦除特性的非易失性半导体存储器件。 通过栅极绝缘体在半导体衬底的p型阱上形成选择栅极,并且通过由氧化硅膜,氮化硅膜和氮化硅膜构成的层叠膜在p型阱上形成存储栅极 氧化硅膜。 存储器栅极通过层叠膜与选择栅极相邻。 在p型阱中的选择栅极和存储栅极的两侧的区域中,形成用作源极和漏极的n型杂质扩散层。 由选择栅极控制的区域和由位于所述杂质扩散层之间的沟道区域中的存储栅极控制的区域具有彼此不同的杂质的电荷密度。

    NONVOLATILE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
    36.
    发明申请
    NONVOLATILE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME 失效
    非挥发性半导体器件及其制造方法

    公开(公告)号:US20090050955A1

    公开(公告)日:2009-02-26

    申请号:US12188412

    申请日:2008-08-08

    Abstract: A charge storage layer interposed between a memory gate electrode and a semiconductor substrate is formed shorter than a gate length of the memory gate electrode or a length of insulating films so as to make the overlapping amount of the charge storage layer and a source region to be less than 40 nm. Therefore, in the write state, since the movement in the transverse direction of the electrons and the holes locally existing in the charge storage layer decreases, the variation of the threshold voltage when holding a high temperature can be reduced. In addition, the effective channel length is made to be 30 nm or less so as to reduce an apparent amount of holes so that coupling of the electrons with the holes in the charge storage layer decreases; therefore, the variation of the threshold voltage when holding at room temperature can be reduced.

    Abstract translation: 插入在存储栅电极和半导体衬底之间的电荷存储层形成为比存储栅电极的栅极长度或绝缘膜的长度短,以使电荷存储层和源极区域的重叠量成为 小于40nm。 因此,在写入状态下,由于在电荷存储层中局部存在的电子和空穴的横向的移动减少,因此可以降低保持高温时的阈值电压的变化。 此外,有效沟道长度为30nm以下,以减少空穴的表观量,使得电子与电荷存储层中的空穴的耦合减小; 因此,可以降低在室温下保持时的阈值电压的变化。

    Method for working semiconductor wafer
    38.
    发明授权
    Method for working semiconductor wafer 有权
    半导体晶圆工作方法

    公开(公告)号:US06221773B1

    公开(公告)日:2001-04-24

    申请号:US09254431

    申请日:1999-03-09

    Abstract: A method for processing semiconductor wafers, which provides planarized surface in a well controllable manner and with high accuracy by processing a film with uneven surface, formed over a semiconductor wafer, within the area of a working surface with a diameter larger than that of said semiconductor wafer by not more than two times, and by processing the film with a polishing liquid supplied from a supply unit disposed on a vertically arranged working surface is disclosed. Additionally, high quality dressing of the working surface can be easily performed by virtue of the smaller diameter of the working surface. Furthermore, the vertical arrangement of the working surface makes possible ready compatibility with semiconductor wafers of enlarged diameters.

    Abstract translation: 一种用于处理半导体晶片的方法,其在工作表面的直径大于所述半导体的直径的区域内,以半导体晶片形成在半导体晶片上,通过处理具有不平坦表面的膜,以良好可控的方式并且以高精度提供平坦化表面 晶片不超过两次,并且通过用设置在垂直布置的工作表面上的供应单元供应的抛光液处理该膜。 此外,通过工作表面的较小直径,可以容​​易地进行工作表面的高质量的修整。 此外,工作表面的垂直布置使得可以准确地兼容扩大直径的半导体晶片。

    Fabrication method and structure of semiconductor non-volatile memory device
    40.
    发明授权
    Fabrication method and structure of semiconductor non-volatile memory device 有权
    半导体非易失性存储器件的制造方法和结构

    公开(公告)号:US08084810B2

    公开(公告)日:2011-12-27

    申请号:US12648796

    申请日:2009-12-29

    Abstract: A non-volatile semiconductor memory device with good write/erase characteristics is provided. A selection gate is formed on a p-type well of a semiconductor substrate via a gate insulator, and a memory gate is formed on the p-type well via a laminated film composed of a silicon oxide film, a silicon nitride film, and a silicon oxide film. The memory gate is adjacent to the selection gate via the laminated film. In the regions on both sides of the selection gate and the memory gate in the p-type well, n-type impurity diffusion layers serving as the source and drain are formed. The region controlled by the selection gate and the region controlled by the memory gate located in the channel region between said impurity diffusion layers have the different charge densities of the impurity from each other.

    Abstract translation: 提供具有良好写入/擦除特性的非易失性半导体存储器件。 通过栅极绝缘体在半导体衬底的p型阱上形成选择栅极,并且通过由氧化硅膜,氮化硅膜和氮化硅膜构成的层叠膜在p型阱上形成存储栅极 氧化硅膜。 存储器栅极通过层叠膜与选择栅极相邻。 在p型阱中的选择栅极和存储栅极的两侧的区域中,形成用作源极和漏极的n型杂质扩散层。 由选择栅极控制的区域和由位于所述杂质扩散层之间的沟道区域中的存储栅极控制的区域具有彼此不同的杂质的电荷密度。

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