公开(公告)号：US07413076B2

公开(公告)日：2008-08-19

申请号：US10496202

申请日：2002-11-21

Applicant: Jason Kwok Cheung

Inventor： Jason Kwok Cheung

IPC: B65D85/57

CPC classification number: G11B33/0494 ,  G11B33/0422

Abstract: A storage case for a generally planar item such as a compact disc. The case (10) has a pair of faces (12) adapted to distort when a compressive force is applied parallel to the plane of the disc (34). The case (10) also includes a retaining mechanism (14, 30) between the faces (12) that is adapted to hold the disc (34) in the case (10) when relaxed and adapted to urge the disc (34) out of the case (10) when the faces (12) are distorted by a force applied thereacross. Thus, the case (10) is easy to open and close and in the closed position protects the disc (34) from shock. Furthermore, a single action both opens the case (10) and offers the disc (34) out of the case for easy retrieval. The case (10) can also be adapted to clean the disc (34) as it is inserted into or withdrawn from the case.

Abstract translation: 用于大致平面的物品（例如光盘）的储存盒。 壳体（10）具有一对面（12），适于当压缩力平行于盘（34）的平面施加时变形。 壳体（10）还包括在面（12）之间的保持机构（14,30），其适于在松弛时将盘（34）保持在壳体（10）中并适于将盘（34）推出 当面（12）由施加在其上的力扭曲时，壳体（10）。 因此，壳体（10）容易打开和关闭，并且在关闭位置保护盘（34）不受冲击。 此外，单个动作都打开壳体（10）并且将盘（34）提供出外壳以便于检索。 壳体（10）还可以适于在盘（34）插入壳体或从壳体中取出时清洁盘（34）。

公开(公告)号：US07270867B1

公开(公告)日：2007-09-18

申请号：US11022130

申请日：2004-12-22

Applicant: Kin Pui Kwan ,  Wing Him Lau ,  Kwok Cheung Tsang ,  Chun Ho Fan ,  Neil McLellan

Inventor： Kin Pui Kwan ,  Wing Him Lau ,  Kwok Cheung Tsang ,  Chun Ho Fan ,  Neil McLellan

IPC: H01L21/48

CPC classification number: H01L23/49582 ,  H01L21/4821 ,  H01L21/4832 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/85001 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85455 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  Y10T428/24107 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A process for fabricating a leadless plastic chip carrier includes selectively depositing a plurality of base layers on a first surface of a base of a leadframe strip to at least partially define a die attach pad and at least one row of contact pads. At least one further layer is selectively deposited on portions of the plurality of layers to further define at least the contact pads. The leadframe strip is then treated with a surface preparation. A semiconductor die is mounted to the die attach pad, followed by wire bonding the semiconductor die to at least the contact pads. Molding the semiconductor die, the wire bonds, the die attach pad and the contact pads on the surface of the leadframe strip, in a molding compound follows. The leadframe strip is etched to expose the contact pads and the die attach pad and the leadless plastic chip carrier is singulated from a remainder of the leadframe strip.

Abstract translation: 一种用于制造无引线塑料芯片载体的方法包括在引线框架条的基底的第一表面上选择性地沉积多个基层以至少部分地限定管芯附着垫和至少一排接触垫。 至少一个另外的层选择性地沉积在多个层的部分上以进一步限定至少接触焊盘。 然后用表面处理处理引线框条。 将半导体管芯安装到管芯附接焊盘，然后将半导体管芯引线接合至少于接触焊盘。 在模制化合物中，模制半导体管芯，引线接合，引线框架条的表面上的焊盘和接触焊盘。 蚀刻引线框条以暴露接触焊盘和管芯附接焊盘，并且引线框架条的其余部分分离无引线塑料芯片载体。

公开(公告)号：US20060259565A1

公开(公告)日：2006-11-16

申请号：US11452115

申请日：2006-06-12

Applicant: Kwok Cheung ,  Peter Tong ,  C. Thomas

Inventor： Kwok Cheung ,  Peter Tong ,  C. Thomas

IPC: G06F15/16

CPC classification number: H04W4/14 ,  G06Q10/10 ,  H04M3/436 ,  H04M3/4365 ,  H04M2201/60 ,  H04M2203/2011 ,  H04M2203/651 ,  H04M2207/18 ,  H04W4/12 ,  H04W4/16

Abstract: A computer-implemented system and method to manage the communication of a user are disclosed. In one embodiment, when a person tries to electronically convey a message to the user, the status of the user, the identity of the person, and the urgency of the message can be identified. The access priority of the person can be determined based on the person's identity. Then, the message can be managed using one or more rules and in view of the status of the user, the access priority of the person and the urgency of the message.

公开(公告)号：US06781242B1

公开(公告)日：2004-08-24

申请号：US10307279

申请日：2002-12-02

Applicant: Chun Ho Fan ,  Kwok Cheung Tsang ,  William Lap Keung Chow

Inventor： Chun Ho Fan ,  Kwok Cheung Tsang ,  William Lap Keung Chow

IPC: H01L2348

CPC classification number: H01L23/3128 ,  H01L23/36 ,  H01L23/4334 ,  H01L24/45 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An integrated circuit package is provided. The package includes a substrate having first and second surfaces and a plurality of conductive traces therebetween. The substrate further has a cavity therein and a heat slug is fixed to the substrate and spans the cavity. A semiconductor die is mounted to the heat slug such that at least a portion of the semiconductor die is disposed in the cavity. A plurality of wire bonds connect the semiconductor die to ones of the conductive traces of the substrate and an encapsulating material encapsulates the wire bonds and the semiconductor die. A ball grid array is disposed on the first surface of the substrate. Bumps of the ball grid array are in electrical connection with ones of the conductive traces.

Abstract translation: 提供集成电路封装。 该封装包括具有第一和第二表面的基板和它们之间的多个导电迹线。 基板还在其中具有空腔，并且热块固定到基板并跨越空腔。 将半导体管芯安装到散热块上，使半导体管芯的至少一部分设置在空腔中。 多个引线接合将半导体管芯与衬底的导电迹线连接，并且封装材料封装引线接合和半导体管芯。 球栅阵列设置在基板的第一表面上。 球栅阵列的凸起与导电迹线中的一个导电连接。

公开(公告)号：US09558250B2

公开(公告)日：2017-01-31

申请号：US12830011

申请日：2010-07-02

Applicant: David Sun ,  Kwok Cheung ,  But-Chung Chiu ,  Xing Wang ,  Ying Xiao ,  Kee Mok ,  Mike Yao

Inventor： David Sun ,  Kwok Cheung ,  But-Chung Chiu ,  Xing Wang ,  Ying Xiao ,  Kee Mok ,  Mike Yao

IPC: G06Q10/06 ,  G06F17/30 ,  G06Q10/04

CPC classification number: G06F17/30557 ,  G06Q10/04 ,  G06Q10/06 ,  Y04S10/54 ,  Y04S10/60

Abstract: A decision-support tool is provided to evaluate operational and financial performance for dispatchers in power grid control centers associated with utility systems. A scheduler engine is coupled to a comprehensive operating plan that applies after the fact analysis for performance metrics, root-cause impacts and process re-engineering. A relational database is coupled to a data archiver that captures actual system and resource conditions and then supplies the system and resource conditions to the relational database. The scheduler engine receives the actual system and resource conditions from the relational database and processes it to calculate system performance. A user interface is configured to display at least one of, transmission evaluation application displays, reference and scenario cases and associations between them, results presented with a graphical or tabular displays, comparison results between scenario cases and a reference case, a family of curves where each curve is a performance metric, comparison of scenario input data, study results and statistical analysis and historical data.

Abstract translation: 提供了一个决策支持工具，用于评估与公用事业系统相关的电网控制中心的调度员的运营和财务绩效。 调度器引擎被耦合到综合运行计划之后，在针对性能指标，根本原因影响和流程重新设计的事实分析之后应用。 关系数据库被耦合到数据归档器，其捕获实际的系统和资源条件，然后将系统和资源条件提供给关系数据库。 调度器引擎从关系数据库接收实际的系统和资源条件，并处理它以计算系统性能。 用户界面被配置为显示以下中的至少一个：传输评估应用显示，参考和场景情况以及它们之间的关联，以图形或表格显示呈现的结果，情景案例与参考案例之间的比较结果，曲线族 每个曲线是绩效指标，场景输入数据的比较，研究结果和统计分析和历史数据。

公开(公告)号：US09251479B2

公开(公告)日：2016-02-02

申请号：US12830019

申请日：2010-07-02

Applicant: David Sun ,  Kwok Cheung ,  Xing Wang ,  But-Chung Chiu ,  Ying Xiao

Inventor： David Sun ,  Kwok Cheung ,  Xing Wang ,  But-Chung Chiu ,  Ying Xiao

IPC: G06Q99/00 ,  G06Q10/06 ,  G06Q50/06 ,  H02J3/00

CPC classification number: H02J3/00 ,  G05B15/02 ,  G06Q10/06 ,  G06Q50/06 ,  Y04S10/54

Abstract: A method is provided that enables dispatchers in power grid control centers to manage changes by applying multi-interval dispatch. A multi-stage resource scheduling engine and a comprehensive operating plan are used. Multiple system parameter scenarios are coordinated.

Abstract translation: 提供了一种方法，使得电网控制中心的调度员能够通过应用多间隔调度来管理变更。 使用多阶段资源调度引擎和综合运行计划。 协调多个系统参数场景。

公开(公告)号：US08716948B2

公开(公告)日：2014-05-06

申请号：US13419317

申请日：2012-03-13

Applicant: Andrew Kwok-Cheung Lee ,  Chuanyang Wang ,  Jiang Chen ,  Liang Yan

Inventor： Andrew Kwok-Cheung Lee ,  Chuanyang Wang ,  Jiang Chen ,  Liang Yan

IPC: H05B37/02 ,  G05B24/02

CPC classification number: H05B33/0812 ,  H05B33/0815 ,  Y02B20/343 ,  Y02B20/345 ,  Y02B20/346 ,  Y02B20/347 ,  Y02B20/348

Abstract: The embodiments disclosed herein describe the dynamic control of a switching power converter between different operation modes of the switching power converter. In one embodiment, the operation modes of the switching power converter include a switching mode and a linear mode. The switching power converter may be included in a LED lamp system according to one embodiment.

Abstract translation: 本文公开的实施例描述了在开关功率转换器的不同操作模式之间的开关功率转换器的动态控制。 在一个实施例中，开关功率转换器的操作模式包括开关模式和线性模式。 根据一个实施例，开关功率转换器可以包括在LED灯系统中。

公开(公告)号：US08610262B1

公开(公告)日：2013-12-17

申请号：US11061895

申请日：2005-02-18

Applicant: Neil McLellan ,  Ming Wang Sze ,  Kwok Cheung Tsang ,  Wing Keung Lam ,  Wai Kit Tam

Inventor： Neil McLellan ,  Ming Wang Sze ,  Kwok Cheung Tsang ,  Wing Keung Lam ,  Wai Kit Tam

IPC: H01L23/10

CPC classification number: H01L23/49568 ,  H01L21/56 ,  H01L23/10 ,  H01L23/24 ,  H01L23/3128 ,  H01L23/36 ,  H01L23/42 ,  H01L23/4334 ,  H01L23/49816 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An integrated circuit package includes a substrate having first and second surfaces and a plurality of conductive traces therebetween and a semiconductor die mounted on the first surface of the substrate. A plurality of wire bonds connect the semiconductor die to ones of the conductive traces of the substrate and an encapsulant encapsulates the wirebonds and the semiconductor die. A heat spreader has a cap, at least a portion of the cap extending inwardly toward and being spaced from the semiconductor die. The encapsulant fills the space between the portion of the cap and the semiconductor die. The heat spreader further has at least one sidewall extending from the cap, the at least one sidewall disposed on the substrate. A ball grid array is disposed on the second surface of the substrate, bumps of the ball grid array being in electrical connection with ones of the conductive traces.

Abstract translation: 一种集成电路封装，包括具有第一和第二表面的衬底以及它们之间的多个导电迹线以及安装在衬底的第一表面上的半导体管芯。 多个引线键将半导体管芯与衬底的导电迹线连接，并且密封剂封装了引线键和半导体管芯。 散热器具有帽，帽的至少一部分向内朝向半导体管芯并且与半导体管芯间隔开。 密封剂填充盖的部分和半导体管芯之间的空间。 散热器还具有从盖延伸的至少一个侧壁，该至少一个侧壁设置在基板上。 球栅阵列设置在基板的第二表面上，球栅阵列的凸块与导电迹线电连接。

公开(公告)号：US20130107584A1

公开(公告)日：2013-05-02

申请号：US13568976

申请日：2012-08-07

Applicant: Yong Li ,  Fuqiang Shi ,  Andrew Kwok-Cheung Lee ,  David Nguyen ,  Jiang Chen

Inventor： Yong Li ,  Fuqiang Shi ,  Andrew Kwok-Cheung Lee ,  David Nguyen ,  Jiang Chen

IPC: H02M3/335

CPC classification number: H03K17/166 ,  H02M1/08 ,  H02M3/335 ,  H02M3/33523 ,  H03K17/163

Abstract: The embodiments herein describe a dynamic metal-oxide-semiconductor field-effect transistor (MOSFET) gate driver system architecture and control scheme. The MOSFET gate driver system dynamically adjusts both the gate driver turn-on-resistance and the gate driver turn-off resistance within a single (i.e., one) switching cycle to reduce electromagnetic interference (EMI) in the system and to minimize the conduction loss of a power MOSFET during operation.

Abstract translation: 本文的实施例描述了动态金属氧化物半导体场效应晶体管（MOSFET）栅极驱动器系统架构和控制方案。 MOSFET栅极驱动器系统在单个（即一个）开关周期内动态地调节栅极驱动器导通电阻和栅极驱动器关断电阻，以减少系统中的电磁干扰（EMI）并使传导损耗最小化 的功率MOSFET。

公开(公告)号：US20130001791A1

公开(公告)日：2013-01-03

申请号：US13170820

申请日：2011-06-28

Applicant: Fan YEUNG ,  Raymond (Kwok Cheung) TSANG ,  Edward LAW

Inventor： Fan YEUNG ,  Raymond (Kwok Cheung) TSANG ,  Edward LAW

IPC: H01L23/52 ,  H01L21/50

CPC classification number: H01L21/6835 ,  H01L21/4857 ,  H01L23/145 ,  H01L23/49827 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2221/68345 ,  H01L2221/68381 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Embodiments described herein provide a method of manufacturing integrated circuit (IC) devices. The method includes coupling a first surface of a first intermediate substrate to a first surface of a second intermediate substrate, forming a first plurality of patterned metal layers on a second surface of the first intermediate substrate to form a first substrate and a second plurality of patterned metal layers on a second surface of the second intermediate substrate to form a second substrate, and separating the first and second substrates. Each of the first substrate and the second substrate is configured to facilitate electrical interconnection between a respective IC die and a respective printed circuit board (PCB).

Abstract translation: 本文描述的实施例提供了一种制造集成电路（IC）装置的方法。 该方法包括将第一中间衬底的第一表面耦合到第二中间衬底的第一表面，在第一中间衬底的第二表面上形成第一多个图案化金属层以形成第一衬底和第二多个图案化 在第二中间基板的第二表面上的金属层，以形成第二基板，并分离第一和第二基板。 第一基板和第二基板中的每一个被配置为便于相应的IC管芯和相应的印刷电路板（PCB）之间的电互连。