公开(公告)号：US08828769B2

公开(公告)日：2014-09-09

申请号：US12592695

申请日：2009-12-01

Applicant: Nathaniel R. Quick ,  Aravinda Kar

Inventor： Nathaniel R. Quick ,  Aravinda Kar

IPC: H01L21/00

CPC classification number: H01L31/1876 ,  F24S10/755 ,  F24S50/40 ,  H01L21/4846 ,  H01L21/67115 ,  H01L31/02325 ,  H01L31/03042 ,  H01L31/03125 ,  H01L31/0392 ,  H01L31/03926 ,  H01L31/0547 ,  H01L31/068 ,  H01L31/0693 ,  H01L31/112 ,  H01L31/1812 ,  H01L31/184 ,  H02S40/44 ,  Y02E10/52 ,  Y02E10/544 ,  Y02E10/547 ,  Y02E10/60 ,  Y02P70/521

Abstract: A solid-state energy conversion device and method of making is disclosed wherein the solid-state energy conversion device is formed through the conversion of an insulating material. In one embodiment, the solid-state energy conversion device operates as a photovoltaic device to provide an output of electrical energy upon an input of electromagnetic radiation. In another embodiment, the solid-state energy conversion device operates as a light emitting device to provide an output of electromagnetic radiation upon an input of electrical energy. In one example, the photovoltaic device is combined with a solar liquid heater for heating a liquid. In another example, the photovoltaic device is combined with a solar liquid heater for treating water.

Abstract translation: 公开了一种固态能量转换装置及其制造方法，其中通过绝缘材料的转换形成固体能量转换装置。 在一个实施例中，固态能量转换装置用作光电装置，以在电磁辐射的输入上提供电能的输出。 在另一个实施例中，固态能量转换装置用作发光装置，以在电能输入上提供电磁辐射的输出。 在一个示例中，光伏器件与用于加热液体的太阳能液体加热器组合。 在另一个实例中，光伏器件与用于处理水的太阳能液体加热器组合。

公开(公告)号：US07951632B1

公开(公告)日：2011-05-31

申请号：US11340883

申请日：2006-01-26

Applicant: Nathaniel R. Quick ,  Aravinda Kar ,  Islam A. Salama

Inventor： Nathaniel R. Quick ,  Aravinda Kar ,  Islam A. Salama

IPC: H01L21/268

CPC classification number: H01L21/268 ,  G01J5/08 ,  G01J5/0809 ,  G01J5/58 ,  G01K11/125 ,  H01L21/02678

Abstract: An optical device and method is disclosed for forming the optical device within the wide-bandgap semiconductor substrate. The optical device is formed by directing a thermal energy beam onto a selected portion of the wide-bandgap semiconductor substrate for changing an optical property of the selected portion to form the optical device in the wide-bandgap semiconductor substrate. The thermal energy beam defines the optical and physical properties of the optical device. The optical device may take the form of an electro-optical device with the addition of electrodes located on the wide-bandgap semiconductor substrate in proximity to the optical device for changing the optical property of the optical device upon a change of a voltage applied to the optional electrodes. The invention is also incorporated into a method of using the optical device for remotely sensing temperature, pressure and/or chemical composition.

公开(公告)号：US07811914B1

公开(公告)日：2010-10-12

申请号：US11407738

申请日：2006-04-20

Applicant: Nathaniel R. Quick ,  Aravinda Kar

Inventor： Nathaniel R. Quick ,  Aravinda Kar

IPC: H01L21/26

CPC classification number: H01L21/268 ,  H01L21/02381 ,  H01L21/0242 ,  H01L21/02529 ,  H01L21/0254 ,  H01L21/02612 ,  H01L21/02675 ,  H01L21/02689 ,  H01L21/0405 ,  H01L21/0445 ,  H01L23/3738 ,  H01L2924/0002 ,  H01L2924/12044 ,  H01L2924/00

Abstract: An apparatus and method is disclosed for increasing the thermal conductivity in a substrate of a non-wide bandgap material comprising the steps of directing a thermal energy beam onto the substrate in the presence of a first doping gas for converting a region of the substrate into a wide bandgap material to enhance the thermal conductivity of the substrate for cooling the non-wide bandgap material. In one example, the invention is incorporated into a carbon rich layer formed within the wide bandgap material. In another example, the invention is incorporated into a carbon rich layer formed within the wide bandgap material having basal planes disposed to extend generally outwardly relative to an external surface of the substrate to enhance the cooling of the substrate.

Abstract translation: 公开了用于增加非宽带隙材料的衬底中的导热性的装置和方法，包括以下步骤：在第一掺杂气体存在下将热能束引导到衬底上，以将衬底的区域转换成 宽带隙材料，以增强用于冷却非宽带隙材料的衬底的导热性。 在一个实例中，本发明被并入形成在宽带隙材料内的富碳层中。 在另一个实例中，本发明被并入形成在宽带隙材料内的富碳层中，其具有设置成相对于衬底的外表面大致向外延伸的基面，以增强衬底的冷却。

公开(公告)号：US20080156059A1

公开(公告)日：2008-07-03

申请号：US11821640

申请日：2007-06-25

Applicant: Nathaniel R. Quick ,  Aravinda Kar ,  Yonggang Li ,  Raymond R. McNeice

Inventor： Nathaniel R. Quick ,  Aravinda Kar ,  Yonggang Li ,  Raymond R. McNeice

IPC: B21C1/02 ,  B21C1/04

CPC classification number: B21C37/042 ,  B21C1/003 ,  B21C1/02 ,  B21C1/12 ,  B21C37/047 ,  Y10S72/70

Abstract: An apparatus and method is disclosed for drawing continuous metallic wire having a first diameter to a metallic fiber having a reduced second diameter. A feed mechanism moves the wire at a first linear velocity. A laser beam heats a region of the wire to an elevated temperature. A draw mechanism draws the heated wire at a second and greater linear velocity for providing a drawn metallic fiber having the reduced second diameter.

Abstract translation: 公开了一种用于将具有第一直径的连续金属丝拉制成具有减小的第二直径的金属纤维的装置和方法。 进给机构以第一线速度移动线。 激光束将导线的区域加热到升高的温度。 牵引机构以第二和更大的线速度牵引加热的线，以提供具有减小的第二直径的拉伸金属纤维。

公开(公告)号：US06930009B1

公开(公告)日：2005-08-16

申请号：US10716366

申请日：2003-11-18

Applicant: Nathaniel R. Quick

Inventor： Nathaniel R. Quick

IPC: H01L21/20 ,  H01L21/268 ,  H01L21/428

CPC classification number: H01L21/268 ,  H01L21/02527 ,  H01L21/02529 ,  H01L21/0254 ,  H01L21/02675 ,  H01L21/2026

Abstract: A laser apparatus and methods are disclosed for synthesizing areas of wide-bandgap semiconductor substrates or thin films, including wide-bandgap semiconductors such as silicon carbide, aluminum nitride, gallium nitride and diamond to produce electronic devices and circuits such as integral electronic circuit and components thereof.

Abstract translation: 公开了用于合成宽带隙半导体衬底或薄膜的区域的激光装置和方法，所述宽带隙半导体衬底或薄膜包括诸如碳化硅，氮化铝，氮化镓和金刚石的宽带隙半导体，以产生电子器件和诸如集成电子电路和部件 其中。

公开(公告)号：US06435861B1

公开(公告)日：2002-08-20

申请号：US09630032

申请日：2000-08-01

Applicant: Nathaniel R. Quick ,  Tao Li ,  Robert Malanga

Inventor： Nathaniel R. Quick ,  Tao Li ,  Robert Malanga

IPC: F23D1412

CPC classification number: B22F7/002 ,  B01D29/111 ,  B01D29/21 ,  B22F3/002

Abstract: An improved gas burner for a gas burner assembly and method of making is disclosed comprising a porous burner element extending between a first and a second end. The porous burner element comprises a sintered matrix of metallic fibers. A first end cap is formed from a rigid metallic material and is secured to the first end of the porous burner element. A second end cap comprises a sintered matrix of metallic fibers. The second end cap is secured to the second end of the porous burner element solely by the metallic fibers of the porous burner element bonding with the metallic fibers of the second end cap. In another embodiment of the invention, the porous burner element has a plurality of pleats for increasing the surface area of the porous burner element.

Abstract translation: 公开了一种用于气体燃烧器组件的改进的气体燃烧器和制造方法，其包括在第一和第二端之间延伸的多孔燃烧器元件。 多孔燃烧器元件包括金属纤维的烧结基体。 第一端帽由刚性金属材料形成并且固定到多孔燃烧器元件的第一端。 第二端盖包括金属纤维的烧结基体。 第二端盖仅由多孔燃烧器元件的金属纤维固定到多孔燃烧器元件的第二端，该多孔燃烧器元件与第二端盖的金属纤维结合。 在本发明的另一个实施例中，多孔燃烧器元件具有多个用于增加多孔燃烧器元件的表面积的褶皱。

公开(公告)号：US06381826B1

公开(公告)日：2002-05-07

申请号：US09950466

申请日：2001-09-10

Applicant: Nathaniel R. Quick ,  Michael Liberman

Inventor： Nathaniel R. Quick ,  Michael Liberman

IPC: B23P1700

CPC classification number: D04C1/02 ,  B21C37/047 ,  B60C9/0007 ,  Y10T29/49801 ,  Y10T29/4981 ,  Y10T29/49812

Abstract: The process for making fine metallic mesh is disclosed comprising the steps of cladding an array of metallic wires with an array cladding material to provide an array cladding. The array cladding is drawn for reducing the diameter thereof and for reducing the corresponding diameters of each of the metallic wires for producing a clad array of fine metallic fibers within the array cladding. The array cladding is fashioned into a mesh by weaving, braiding, crocheting and the like thereby forming a series of bends in the clad array for reducing interaction between adjacent portions of the array cladding. The array cladding material is removed for producing fine metallic mesh from the array of the fine metallic fibers.

Abstract translation: 公开了用于制造精细金属网的方法，包括以下步骤：用阵列包层材料包覆金属线阵列以提供阵列包层。 绘制阵列包层以减小其直径并减少每个金属线的相应直径，以在阵列包层内产生精细金属纤维的包层阵列。 阵列包层通过编织，编织，钩编等形成网格，从而在包层阵列中形成一系列弯曲，以减少阵列包层的相邻部分之间的相互作用。 去除阵列包覆材料以从细金属纤维的阵列制造精细的金属网。

公开(公告)号：US06271576B1

公开(公告)日：2001-08-07

申请号：US09088044

申请日：1998-06-01

Applicant: Nathaniel R. Quick

Inventor： Nathaniel R. Quick

IPC: H01L21331

CPC classification number: H01L21/02675 ,  C23C16/047 ,  H01L21/02378 ,  H01L21/02389 ,  H01L21/0445 ,  H01L21/2022 ,  H01L21/2026 ,  H01L21/4846 ,  H01L21/76888 ,  H01L21/76894 ,  H01L21/8213 ,  H01L23/525 ,  H01L23/5258 ,  H01L29/66068 ,  H01L2224/48463 ,  H01L2224/49107 ,  H01L2224/4918 ,  H01L2924/0002 ,  H05K3/105 ,  H01L2924/00

Abstract: Laser apparatus and methods are provided for synthesizing areas of ceramic substrates or thin films, such ceramics as Silicon Carbide and Aluminum Nitride, to produce electronic devices and circuits such as sensors as integral electro circuit components thereof. Circuit components such as conductive tabs, interconnects, wiring patterns, resistors, capacitors, insulating layers and semiconductors synthesized on the surfaces and within the body of such ceramics. Selected groupings and arrangements of these electronic circuit components within the substrates or thin films provide a wide range of circuits for applications such as digital logic elements and circuits, transistors, sensors for measurements and monitoring effects of chemical and/or physical reactions and interactions of materials, gases, devices or circuits that may utilize sensors. The electronic elements and components offer the advantages of providing thermal compatibilities with the substrate, since they are an integral part thereof and consequently are compatible therewith regarding thermal coefficients of expansion and thermal dissipation.

Abstract translation: 提供激光装置和方法来合成陶瓷基板或薄膜（诸如碳化硅和氮化铝）的陶瓷的区域，以制造电子器件和诸如作为其整体电路部件的传感器的电路。 诸如导电突片，互连，布线图案，电阻器，电容器，绝缘层和半导体的电路部件，在这些陶瓷的表面和体内合成。 这些电子电路组件在衬底或薄膜内的选择分组和布置为应用提供了广泛的电路，例如数字逻辑元件和电路，晶体管，用于测量和监测化学和/或物理反应和材料相互作用的传感器 ，可能利用传感器的气体，设备或电路。 电子元件和组件提供了提供与基底的热相容性的优点，因为它们是其组成部分，因此与热膨胀系数和散热系数相容。

公开(公告)号：US5391841A

公开(公告)日：1995-02-21

申请号：US987017

申请日：1992-12-08

Applicant: Nathaniel R. Quick

Inventor： Nathaniel R. Quick

IPC: H01L21/48 ,  H01L23/13 ,  H05K1/03

CPC classification number: H01L21/4807 ,  H01L23/13 ,  H01L2924/0002

Abstract: Enhanced thermal and electrical properties of ceramic for high-power integrating substrates are provided by focused thermal energy sources such as by laser processing. A thin ceramic layer, such as alumina, is plasma spray deposited on a relative thick metal substrate, such as copper or alloy thereof, as a heat sink for improved dielectric and thermal properties which are produced by laser-reflow and recrystallization so as to convert and provide a different ceramic of higher dielectric and denser structure. Laser-reflow and recrystallization causes a purification or purging and conversion process that vaporizes deleterious impurities and changes the crystalline structure while densifying the resulting structure of the ceramic layer. After conversion of the ceramic layer a metal coating may be plasma spray deposited thereon and electrical circuit elements and wiring patterns may be formed thereon by laser etching for high power applications, such as heat-sinks, electronic control modules, or heating panels. As another aspect, ceramic coated metal substrates with recesses or cavities formed therein contiguous with its surfaces, may be laser-reflow processed for containing microelectronic circuit chips and devices in multilayer chip module (MCM) applications. Alternatively, ceramic substrates with cavities formed in the surfaces thereof may be laser-reflow processed for such multilayer applications.

Abstract translation: 用于大功率集成基板的陶瓷的增强的热和电特性由聚焦热能源（例如通过激光加工）提供。 诸如氧化铝的薄陶瓷层是等离子体喷涂沉积在诸如铜或其合金的相对厚的金属基底上，作为用于改善电介质和热性能的散热器，其通过激光回流和重结晶产生以便转化 并提供更高介电性和更致密结构的不同陶瓷。 激光回流和重结晶导致净化或净化和转化过程，其蒸发有害杂质并改变晶体结构，同时致密化陶瓷层的结构。 在陶瓷层转化之后，金属涂层可以是其上沉积的等离子体喷涂，并且可以通过激光蚀刻在诸如散热器，电子控制模块或加热板之类的高功率应用上形成电路元件和布线图案。 作为另一方面，其中与其表面形成的凹部或空腔的陶瓷涂覆的金属基底可以被激光回流处理以在多层芯片模块（MCM）应用中包含微电子电路芯片和器件。 或者，在其表面形成有空腔的陶瓷基板可以被激光回流处理用于这种多层应用。

公开(公告)号：US5070591A

公开(公告)日：1991-12-10

申请号：US468250

申请日：1990-01-22

Applicant: Nathaniel R. Quick ,  James C. Kenney

Inventor： Nathaniel R. Quick ,  James C. Kenney

IPC: B22F1/00 ,  B22F1/02 ,  H05K1/09

CPC classification number: H05K1/092 ,  B22F1/0096 ,  B22F1/025 ,  B22F2009/041 ,  B22F2998/10 ,  Y10T29/49986

Abstract: Metal and ceramic particles of various morphologies are clad with a coating from the transition metal group consisting of silver, gold, copper, nickel, iron, cobalt, aluminum etc., or combinations thereof, to provide improved coated particles for microelectronics or metal matrix composites or other uses. Refractory metal precursor core particles, such as tungsten, molybdenum, niobium and zirconium, as examples, are provided from a composite of tungsten and copper, for example, made by pressurizing and infiltrating or liquid phase sintering of molten copper into a porous tungsten skeleton. Precursor chip particles derived from a tungsten impregnated billet are used as starter particles which may be further enhanced by cogrinding in an attritor ball mill with smaller copper particles to thereby produce an enhanced copper clad-coating of tungsten particles with predetermined percent by weight of copper and tungsten content. The resulting particles exhibit improved electrical and thermal expansion coefficient matching properties for use on microelectronic ceramic substrates and when used for metal matrix composition, provides more uniform distribution of the dispersed strengthening particulate phase in the matrix. In another embodiment, ceramic particles are clad-coated with selected metals so that they can be used in ceramic-metal matrices, thereby producing systems wherein the components are uniformily didpersed throughout the system.

Abstract translation: 各种形态的金属和陶瓷颗粒用来自由银，金，铜，镍，铁，钴，铝等组成的过渡金属组合的涂层或其组合包覆，以提供用于微电子学或金属基质复合材料的改进的涂层颗粒 或其他用途。 例如钨，钼，铌和锆等耐火金属前体核心颗粒由例如钨和铜的复合物提供，例如通过将熔融铜加压渗透或液相烧结成多孔钨骨架制成。 来自钨浸渍坯料的前体芯片颗粒被用作起始颗粒，其可以通过在具有较小铜颗粒的磨碎机球磨机中共研磨进一步增强，从而产生具有预定重量百分比的铜的钨颗粒的增强的铜包层， 钨含量。 所得到的颗粒表现出改善的用于微电子陶瓷衬底的电和热膨胀系数匹配性质，并且当用于金属基质组成时，分散的强化颗粒相在基体中的分布更均匀。 在另一个实施方案中，陶瓷颗粒用选定的金属包覆涂覆，使得它们可以用于陶瓷​​ - 金属基质中，由此产生其中组分在整个系统中均匀分散的系统。