公开(公告)号：US20090048047A1

公开(公告)日：2009-02-19

申请号：US12087202

申请日：2005-12-28

Applicant: Masahiro Nagae ,  Nobuyuki Matsui

Inventor： Masahiro Nagae ,  Nobuyuki Matsui

IPC: F16G13/04 ,  F16G13/06 ,  B21L9/02

CPC classification number: F16G13/04

Abstract: In an inner link rank 9 of a silent chain before pre-stress is applied, hole pitches of outer link plates 37 are shortened as compared to those of inner link plates 38 and 39 (P 17

Abstract translation: 在施加预应力之前的无声链的内链节中，与内链板38和39相比，外链板37的孔间距缩短（P17

公开(公告)号：USD581886S1

公开(公告)日：2008-12-02

申请号：US29320730

申请日：2008-07-02

Applicant: Satoshi Shida ,  Nobuyuki Matsui ,  Yoshihiko Kanayama ,  Makoto Morikawa

Designer： Satoshi Shida ,  Nobuyuki Matsui ,  Yoshihiko Kanayama ,  Makoto Morikawa

公开(公告)号：USD576575S1

公开(公告)日：2008-09-09

申请号：US29296803

申请日：2007-10-29

Applicant: Yoshihiko Kanayama ,  Nobuyuki Matsui ,  Toshifumi Ogata ,  Masumi Abe

Designer： Yoshihiko Kanayama ,  Nobuyuki Matsui ,  Toshifumi Ogata ,  Masumi Abe

公开(公告)号：US07344296B2

公开(公告)日：2008-03-18

申请号：US10543635

申请日：2004-02-02

Applicant: Nobuyuki Matsui ,  Masanori Shimizu ,  Kazuhisa Matsuo ,  Eiji Kawabe

Inventor： Nobuyuki Matsui ,  Masanori Shimizu ,  Kazuhisa Matsuo ,  Eiji Kawabe

IPC: H01R33/00 ,  F21V21/00 ,  F21V29/00

CPC classification number: F21V29/004 ,  F21K9/00 ,  F21K9/20 ,  F21V17/107 ,  F21V19/0045 ,  F21V19/0055 ,  F21V19/045 ,  F21V23/06 ,  F21V29/73 ,  F21V29/763 ,  F21Y2105/10 ,  F21Y2115/10 ,  Y10S362/80

Abstract: A socket fixed to a heat sink holds a card-type LED module formed by integrating LED elements. The socket (6) includes: a frame structure for holding the LED module (1000) with its light source unit exposed through the frame opening; and a pressing member positioned around the opening for pressing the back surface of the LED module against the heat sink (2122). The socket may include a structure including a lower member (61) placed on a heat sink and an upper frame member (62) holding the LED module with its light source unit (1002) exposed through the frame opening. The upper member supported by the lower member via a hinge can open/close, and includes a pressing unit pressing the LED module set in the open state, against the lower member (61). The lower member (61) includes, in its main part, a lock unit (63) directly or indirectly lock the upper member (62) when the upper member is closed.

Abstract translation: 固定在散热器上的插座支持通过集成LED元件形成的卡型LED模块。 插座（6）包括：用于保持LED模块（1000）的框架结构，其光源单元通过框架开口露出; 以及围绕所述开口定位的按压构件，用于将所述LED模块的后表面压靠在所述散热器（2122）上。 插座可以包括包括放置在散热器上的下部构件（61）和保持LED模块的上部框架构件（62）的结构，其中其光源单元（1002）通过框架开口露出。 由下部构件通过铰链支撑的上部构件可以打开/关闭，并且包括将打开状态的LED模块按压在下部构件（61）上的按压单元。 下部构件（61）在其主要部分中包括当上部构件关闭时直接或间接地锁定上部构件（62）的锁定单元（63）。

公开(公告)号：US20070192005A1

公开(公告)日：2007-08-16

申请号：US11700956

申请日：2007-02-01

Applicant: Hiroshi Ishikawa ,  Noriyuki Ido ,  Jirou Hayashi ,  Kazuhiro Ichikawa ,  Hiroyuki Ukai ,  Yoshifumi Morita ,  Makoto Iwasaki ,  Nobuyuki Matsui ,  Kentaro Torii

Inventor： Hiroshi Ishikawa ,  Noriyuki Ido ,  Jirou Hayashi ,  Kazuhiro Ichikawa ,  Hiroyuki Ukai ,  Yoshifumi Morita ,  Makoto Iwasaki ,  Nobuyuki Matsui ,  Kentaro Torii

IPC: B62D6/00

CPC classification number: B62D5/0472 ,  B62D5/008

Abstract: In a steering system having a variable gear transmission system and an electrical power steering system, respective compensation amounts for first and second electric motors are produced by a first mathematical model. The compensation amounts are added to command values (v1, v2) to generate final command signals (igref, ipref) to the respective electric motors. According to the above structure and operation, a mutual interference between two control systems can be suppressed.

Abstract translation: 在具有可变齿轮传动系统和电动助力转向系统的转向系统中，通过第一数学模型产生用于第一和第二电动机的相应补偿量。 补偿量被添加到命令值（v 1，...，V 2），以产生最终命令信号（i> SUB， ）到相应的电动机。 根据上述结构和操作，可以抑制两个控制系统之间的相互干扰。

公开(公告)号：US20070187708A1

公开(公告)日：2007-08-16

申请号：US11691743

申请日：2007-03-27

Applicant: Tatsumi SETOMOTO ,  Nobuyuki MATSUI ,  Tetsushi TAMURA

Inventor： Tatsumi SETOMOTO ,  Nobuyuki MATSUI ,  Tetsushi TAMURA

IPC: H01L33/00

CPC classification number: F21V29/70 ,  F21K9/23 ,  F21L4/00 ,  F21L4/005 ,  F21L4/027 ,  F21S2/00 ,  F21S6/00 ,  F21S6/003 ,  F21V7/0083 ,  F21V19/003 ,  F21V19/04 ,  F21Y2103/33 ,  F21Y2105/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  F21Y2115/15 ,  F21Y2115/20 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/20 ,  H01L33/64 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49107 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/15787 ,  H01L2924/181 ,  H01R12/714 ,  H01R33/225 ,  H05B33/0803 ,  H05B33/0821 ,  H05B33/0842 ,  H05B33/0863 ,  H05K1/05 ,  H05K1/112 ,  H05K1/117 ,  H05K2201/10106 ,  H01L2924/00 ,  H01L2224/05599

Abstract: An LED illumination includes an insertable and removable LED illumination source having a feeder terminal on one surface of a substrate on which an LED has been mounted; a thermal conductor member, which contacts with a back surface of the substrate on which the LED is not present; at least one connector to be connected to the feeder terminal; and a lighting drive circuit to be electrically connected to the LED illumination source by way of the connector, wherein, in the LED illumination source, a center of the substrate is shifted from a center of a light outgoing region of the substrate where the mounted LED is located.

Abstract translation: LED照明包括可插入和可移除的LED照明源，其具有在其上安装有LED的基板的一个表面上的馈电端子; 热导体构件，其与不存在所述LED的所述基板的背面接触; 至少一个要连接到馈线端子的连接器; 以及通过所述连接器与所述LED照明源电连接的照明驱动电路，其中，在所述LED照明源中，所述基板的中心从所述基板的光出射区域的中心偏移， 位于。

公开(公告)号：USD532148S1

公开(公告)日：2006-11-14

申请号：US29219413

申请日：2004-12-16

Applicant: Nobuyuki Matsui ,  Hideo Nagai ,  Kenji Mukai ,  Masanori Shimizu

Designer： Nobuyuki Matsui ,  Hideo Nagai ,  Kenji Mukai ,  Masanori Shimizu

公开(公告)号：USD532142S1

公开(公告)日：2006-11-14

申请号：US29219414

申请日：2004-12-16

Applicant: Nobuyuki Matsui ,  Hideo Nagai ,  Kenji Mukai ,  Masanori Shimizu

Designer： Nobuyuki Matsui ,  Hideo Nagai ,  Kenji Mukai ,  Masanori Shimizu

公开(公告)号：US07045828B2

公开(公告)日：2006-05-16

申请号：US11158836

申请日：2005-06-22

Applicant: Masanori Shimizu ,  Tadashi Yano ,  Tatsumi Setomoto ,  Nobuyuki Matsui ,  Tetsushi Tamura

Inventor： Masanori Shimizu ,  Tadashi Yano ,  Tatsumi Setomoto ,  Nobuyuki Matsui ,  Tetsushi Tamura

IPC: H01L33/00

CPC classification number: F21V29/70 ,  F21K9/23 ,  F21L4/00 ,  F21L4/005 ,  F21L4/027 ,  F21S2/00 ,  F21S6/00 ,  F21S6/003 ,  F21V7/0083 ,  F21V19/003 ,  F21V19/045 ,  F21Y2103/33 ,  F21Y2105/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  F21Y2115/15 ,  F21Y2115/20 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/20 ,  H01L33/64 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49107 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/15787 ,  H01L2924/181 ,  H01R12/714 ,  H01R33/225 ,  H05B33/0803 ,  H05B33/0821 ,  H05B33/0842 ,  H05B33/0863 ,  H05K1/05 ,  H05K1/112 ,  H05K1/117 ,  H05K2201/10106 ,  H01L2924/00 ,  H01L2224/05599

Abstract: An LED illumination source is disclosed. The illumination source includes a metal base substrate including a line pattern and an insulating layer including a composite material with an inorganic filler and a resin composition. LED bare chips are mounted on one surface of the metal base substrate An optical reflector with holes to surround the bare chips is provided on the surface of the metal base substrate on which the LED bare chips are mounted. Stress relaxing means is provided between the metal base substrate and the optical reflector.

Abstract translation: 公开了一种LED照明源。 照明源包括包括线图案的金属基底基板和包括具有无机填料和树脂组合物的复合材料的绝缘层。 LED裸芯片安装在金属基板的一个表面上在安装有LED裸芯片的金属基底基板的表面上设置有用于包围裸芯片的具有孔的光学反射器。 金属基底基板和光反射体之间设有应力缓和装置。

公开(公告)号：USD514530S1

公开(公告)日：2006-02-07

申请号：US29219438

申请日：2004-12-16

Applicant: Nobuyuki Matsui ,  Hideo Nagai ,  Kenji Mukai ,  Masanori Shimizu

Designer： Nobuyuki Matsui ,  Hideo Nagai ,  Kenji Mukai ,  Masanori Shimizu