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公开(公告)号:US07250637B2
公开(公告)日:2007-07-31
申请号:US11277952
申请日:2006-03-30
IPC分类号: H01L33/00
CPC分类号: F21V29/70 , F21K9/23 , F21L4/00 , F21L4/005 , F21L4/027 , F21S2/00 , F21S6/00 , F21S6/003 , F21V7/0083 , F21V19/003 , F21V19/045 , F21Y2103/33 , F21Y2105/00 , F21Y2105/10 , F21Y2115/10 , F21Y2115/15 , F21Y2115/20 , H01L24/97 , H01L25/0753 , H01L33/20 , H01L33/64 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/16225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/49107 , H01L2924/00014 , H01L2924/01004 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/07811 , H01L2924/09701 , H01L2924/12041 , H01L2924/15787 , H01L2924/181 , H01R12/714 , H01R33/225 , H05B33/0803 , H05B33/0821 , H05B33/0842 , H05B33/0863 , H05K1/05 , H05K1/112 , H05K1/117 , H05K2201/10106 , H01L2924/00 , H01L2224/05599
摘要: An LED illumination source comprises a heat dissipating substrate which includes a metal plate and at least two insulating layers thereon. LEI) bare chips are mounted on a surface of the substrate. An optical reflector with holes surrounds the LED bare chips. The optical reflector is provided on the surface of the substrate on which the LED bare chips are mounted. A resin encapsulates the entire optical reflector on the substrate, the resin molding each of the LED bare chips and functioning as an optical lens for each of the LED bare chips.
摘要翻译: LED照明源包括散热基板,其包括金属板和其上至少两个绝缘层。 LEI)裸芯片安装在基板的表面上。 具有孔的光学反射器围绕LED裸芯片。 光反射器设置在其上安装有LED裸芯片的基板的表面上。 树脂将整个光学反射器封装在基板上,树脂模制每个LED裸芯片,并且用作每个LED裸芯片的光学透镜。
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公开(公告)号:US07045828B2
公开(公告)日:2006-05-16
申请号:US11158836
申请日:2005-06-22
IPC分类号: H01L33/00
CPC分类号: F21V29/70 , F21K9/23 , F21L4/00 , F21L4/005 , F21L4/027 , F21S2/00 , F21S6/00 , F21S6/003 , F21V7/0083 , F21V19/003 , F21V19/045 , F21Y2103/33 , F21Y2105/00 , F21Y2105/10 , F21Y2115/10 , F21Y2115/15 , F21Y2115/20 , H01L24/97 , H01L25/0753 , H01L33/20 , H01L33/64 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/16225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/49107 , H01L2924/00014 , H01L2924/01004 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/07811 , H01L2924/09701 , H01L2924/12041 , H01L2924/15787 , H01L2924/181 , H01R12/714 , H01R33/225 , H05B33/0803 , H05B33/0821 , H05B33/0842 , H05B33/0863 , H05K1/05 , H05K1/112 , H05K1/117 , H05K2201/10106 , H01L2924/00 , H01L2224/05599
摘要: An LED illumination source is disclosed. The illumination source includes a metal base substrate including a line pattern and an insulating layer including a composite material with an inorganic filler and a resin composition. LED bare chips are mounted on one surface of the metal base substrate An optical reflector with holes to surround the bare chips is provided on the surface of the metal base substrate on which the LED bare chips are mounted. Stress relaxing means is provided between the metal base substrate and the optical reflector.
摘要翻译: 公开了一种LED照明源。 照明源包括包括线图案的金属基底基板和包括具有无机填料和树脂组合物的复合材料的绝缘层。 LED裸芯片安装在金属基板的一个表面上在安装有LED裸芯片的金属基底基板的表面上设置有用于包围裸芯片的具有孔的光学反射器。 金属基底基板和光反射体之间设有应力缓和装置。
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公开(公告)号:US20050237747A1
公开(公告)日:2005-10-27
申请号:US11158646
申请日:2005-06-22
IPC分类号: F21K99/00 , F21V9/00 , H01L25/075 , H01L33/64 , H01R33/22
CPC分类号: F21V29/70 , F21K9/23 , F21L4/00 , F21L4/005 , F21L4/027 , F21S2/00 , F21S6/00 , F21S6/003 , F21V7/0083 , F21V19/003 , F21V19/045 , F21Y2103/33 , F21Y2105/00 , F21Y2105/10 , F21Y2115/10 , F21Y2115/15 , F21Y2115/20 , H01L24/97 , H01L25/0753 , H01L33/20 , H01L33/64 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/16225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/49107 , H01L2924/00014 , H01L2924/01004 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/07811 , H01L2924/09701 , H01L2924/12041 , H01L2924/15787 , H01L2924/181 , H01R12/714 , H01R33/225 , H05B33/0803 , H05B33/0821 , H05B33/0842 , H05B33/0863 , H05K1/05 , H05K1/112 , H05K1/117 , H05K2201/10106 , H01L2924/00 , H01L2224/05599
摘要: An LED illumination apparatus includes at least one connector and a lighting drive circuit. The connector is connected to an insertable and removable card-type LED illumination source, which includes multiple LEDs that have been mounted on one surface of a substrate. The lighting drive circuit is electrically connected to the card-type LED illumination source by way of the connector. The card-type LED illumination source preferably includes a metal base substrate and the multiple LEDs that have been mounted on one surface of the metal base substrate. The back surface of the metal base substrate, including no LEDs thereon, thermally contacts with a portion of the illumination apparatus. A feeder terminal to be electrically connected to the connector is provided on the surface of the metal base substrate on which the LEDs are provided.
摘要翻译: LED照明装置包括至少一个连接器和照明驱动电路。 连接器连接到可插入和可拆卸的卡式LED照明源,其包括已经安装在基板的一个表面上的多个LED。 照明驱动电路通过连接器电连接到卡型LED照明源。 卡式LED照明光源优选地包括金属基底基板和已经安装在金属基底基板的一个表面上的多个LED。 金属基底基板的不包括LED的背面与照明装置的一部分热接触。 与设置有LED的金属基底基板的表面上设置与连接器电连接的馈电端子。
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公开(公告)号:US06949772B2
公开(公告)日:2005-09-27
申请号:US10374614
申请日:2003-02-26
CPC分类号: F21V29/70 , F21K9/23 , F21L4/00 , F21L4/005 , F21L4/027 , F21S2/00 , F21S6/00 , F21S6/003 , F21V7/0083 , F21V19/003 , F21V19/045 , F21Y2103/33 , F21Y2105/00 , F21Y2105/10 , F21Y2115/10 , F21Y2115/15 , F21Y2115/20 , H01L24/97 , H01L25/0753 , H01L33/20 , H01L33/64 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/16225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/49107 , H01L2924/00014 , H01L2924/01004 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/07811 , H01L2924/09701 , H01L2924/12041 , H01L2924/15787 , H01L2924/181 , H01R12/714 , H01R33/225 , H05B33/0803 , H05B33/0821 , H05B33/0842 , H05B33/0863 , H05K1/05 , H05K1/112 , H05K1/117 , H05K2201/10106 , H01L2924/00 , H01L2224/05599
摘要: An LED illumination apparatus according to the present invention includes at least one connector and a lighting drive circuit. The connector is connected to an insertable and removable card-type LED illumination source, which includes multiple LEDs that have been mounted on one surface of a substrate. The lighting drive circuit is electrically connected to the card-type LED illumination source by way of the connector. The card-type LED illumination source preferably includes a metal base substrate and the multiple LEDs that have been mounted on one surface of the metal base substrate. The back surface of the metal base substrate, including no LEDs thereon, thermally contacts with a portion of the illumination apparatus. A feeder terminal to be electrically connected to the connector is provided on the surface of the metal base substrate on which the LEDs are provided.
摘要翻译: 根据本发明的LED照明装置包括至少一个连接器和照明驱动电路。 连接器连接到可插入和可拆卸的卡式LED照明源,其包括已经安装在基板的一个表面上的多个LED。 照明驱动电路通过连接器电连接到卡型LED照明源。 卡式LED照明光源优选地包括金属基底基板和已经安装在金属基底基板的一个表面上的多个LED。 金属基底基板的不包括LED的背面与照明装置的一部分热接触。 与设置有LED的金属基底基板的表面上设置与连接器电连接的馈电端子。
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公开(公告)号:US07259403B2
公开(公告)日:2007-08-21
申请号:US11158646
申请日:2005-06-22
IPC分类号: H01L31/024
CPC分类号: F21V29/70 , F21K9/23 , F21L4/00 , F21L4/005 , F21L4/027 , F21S2/00 , F21S6/00 , F21S6/003 , F21V7/0083 , F21V19/003 , F21V19/045 , F21Y2103/33 , F21Y2105/00 , F21Y2105/10 , F21Y2115/10 , F21Y2115/15 , F21Y2115/20 , H01L24/97 , H01L25/0753 , H01L33/20 , H01L33/64 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/16225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/49107 , H01L2924/00014 , H01L2924/01004 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/07811 , H01L2924/09701 , H01L2924/12041 , H01L2924/15787 , H01L2924/181 , H01R12/714 , H01R33/225 , H05B33/0803 , H05B33/0821 , H05B33/0842 , H05B33/0863 , H05K1/05 , H05K1/112 , H05K1/117 , H05K2201/10106 , H01L2924/00 , H01L2224/05599
摘要: An LED illumination apparatus includes at least one connector and a lighting drive circuit. The connector is connected to an insertable and removable card-type LED illumination source, which includes multiple LEDs that have been mounted on one surface of a substrate. The lighting drive circuit is electrically connected to the card-type LED illumination source by way of the connector. The card-type LED illumination source preferably includes a metal base substrate and the multiple LEDs that have been mounted on one surface of the metal base substrate. The back surface of the metal base substrate, including no LEDs thereon, thermally contacts with a portion of the illumination apparatus. A feeder terminal to be electrically connected to the connector is provided on the surface of the metal base substrate on which the LEDs are provided.
摘要翻译: LED照明装置包括至少一个连接器和照明驱动电路。 连接器连接到可插入和可拆卸的卡式LED照明源,其包括已经安装在基板的一个表面上的多个LED。 照明驱动电路通过连接器电连接到卡型LED照明源。 卡式LED照明光源优选地包括金属基底基板和已经安装在金属基底基板的一个表面上的多个LED。 金属基底基板的不包括LED的背面与照明装置的一部分热接触。 与设置有LED的金属基底基板的表面上设置与连接器电连接的馈电端子。
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公开(公告)号:US20050207165A1
公开(公告)日:2005-09-22
申请号:US11125392
申请日:2005-05-09
CPC分类号: F21V29/70 , F21K9/23 , F21L4/00 , F21L4/005 , F21L4/027 , F21S2/00 , F21S6/00 , F21S6/003 , F21V7/0083 , F21V19/003 , F21V19/045 , F21Y2103/33 , F21Y2105/00 , F21Y2105/10 , F21Y2115/10 , F21Y2115/15 , F21Y2115/20 , H01L24/97 , H01L25/0753 , H01L33/20 , H01L33/64 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/16225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/49107 , H01L2924/00014 , H01L2924/01004 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/07811 , H01L2924/09701 , H01L2924/12041 , H01L2924/15787 , H01L2924/181 , H01R12/714 , H01R33/225 , H05B33/0803 , H05B33/0821 , H05B33/0842 , H05B33/0863 , H05K1/05 , H05K1/112 , H05K1/117 , H05K2201/10106 , H01L2924/00 , H01L2224/05599
摘要: An LED illumination apparatus according to the present invention includes at least one connector and a lighting drive circuit. The connector is connected to an insertable and removable card-type LED illumination source, which includes multiple LEDs that have been mounted on one surface of a substrate. The lighting drive circuit is electrically connected to the card-type LED illumination source by way of the connector. The card-type LED illumination source preferably includes a metal base substrate and the multiple LEDs that have been mounted on one surface of the metal base substrate. The back surface of the metal base substrate, including no LEDs thereon, thermally contacts with a portion of the illumination apparatus. A feeder terminal to be electrically connected to the connector is provided on the surface of the metal base substrate on which the LEDs are provided.
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公开(公告)号:US20050263777A1
公开(公告)日:2005-12-01
申请号:US11193939
申请日:2005-07-29
CPC分类号: H01L33/505 , H01L25/0753 , H01L33/508 , H01L33/54 , H01L33/60 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/49107 , H01L2224/8592 , H01L2924/181 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
摘要: An LED lamp includes a substrate, an LED chip, and a resin portion. The LED chip is flip-chip bonded to the substrate. The resin portion covers the LED chip and includes at least one type of phosphor that transforms the emission of the LED chip into light having a longer wavelength than the emission. In this LED lamp, the resin portion has at least one side surface. The side surface is separated from another surface that can reflect the outgoing light of the resin portion, surrounds the side surfaces of the LED chip and is curved at least partially.
摘要翻译: LED灯包括基板,LED芯片和树脂部分。 LED芯片倒装芯片结合到基板上。 树脂部分覆盖LED芯片,并且包括将LED芯片的发射转换成具有比发射更长波长的光的至少一种类型的荧光体。 在该LED灯中,树脂部具有至少一个侧面。 侧表面与可以反射树脂部分的出射光的另一表面分离,包围LED芯片的侧表面并且至少部分弯曲。
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公开(公告)号:US07375381B2
公开(公告)日:2008-05-20
申请号:US11125392
申请日:2005-05-09
IPC分类号: H01L29/22
CPC分类号: F21V29/70 , F21K9/23 , F21L4/00 , F21L4/005 , F21L4/027 , F21S2/00 , F21S6/00 , F21S6/003 , F21V7/0083 , F21V19/003 , F21V19/045 , F21Y2103/33 , F21Y2105/00 , F21Y2105/10 , F21Y2115/10 , F21Y2115/15 , F21Y2115/20 , H01L24/97 , H01L25/0753 , H01L33/20 , H01L33/64 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/16225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/49107 , H01L2924/00014 , H01L2924/01004 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/07811 , H01L2924/09701 , H01L2924/12041 , H01L2924/15787 , H01L2924/181 , H01R12/714 , H01R33/225 , H05B33/0803 , H05B33/0821 , H05B33/0842 , H05B33/0863 , H05K1/05 , H05K1/112 , H05K1/117 , H05K2201/10106 , H01L2924/00 , H01L2224/05599
摘要: An LED illumination apparatus according to the present invention includes at least one connector and a lighting drive circuit. The connector is connected to an insertable and removable card-type LED illumination source, which includes multiple LEDs that have been mounted on one surface of a substrate. The lighting drive circuit is electrically connected to the card-type LED illumination source by way of the connector. The card-type LED illumination source preferably includes a metal base substrate and the multiple LEDs that have been mounted on one surface of the metal base substrate. The back surface of the metal base substrate, including no LEDs thereon, thermally contacts with a portion of the illumination apparatus. A feeder terminal to be electrically connected to the connector is provided on the surface of the metal base substrate on which the LEDs are provided.
摘要翻译: 根据本发明的LED照明装置包括至少一个连接器和照明驱动电路。 连接器连接到可插入和可拆卸的卡式LED照明源,其包括已经安装在基板的一个表面上的多个LED。 照明驱动电路通过连接器电连接到卡型LED照明源。 卡式LED照明光源优选地包括金属基底基板和已经安装在金属基底基板的一个表面上的多个LED。 金属基底基板的不包括LED的背面与照明装置的一部分热接触。 与设置有LED的金属基底基板的表面上设置与连接器电连接的馈电端子。
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公开(公告)号:US07282853B2
公开(公告)日:2007-10-16
申请号:US11193939
申请日:2005-07-29
IPC分类号: H01J1/62
CPC分类号: H01L33/505 , H01L25/0753 , H01L33/508 , H01L33/54 , H01L33/60 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/49107 , H01L2224/8592 , H01L2924/181 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
摘要: An LED lamp includes a substrate, an LED chip, and a resin portion. The LED chip is flip-chip bonded to the substrate. The resin portion covers the LED chip and includes at least one type of phosphor that transforms the emission of the LED chip into light having a longer wavelength than the emission. In this LED lamp, the resin portion has at least one side surface. The side surface is separated from another surface that can reflect the outgoing light of the resin portion, surrounds the side surfaces of the LED chip and is curved at least partially.
摘要翻译: LED灯包括基板,LED芯片和树脂部分。 LED芯片倒装芯片结合到基板上。 树脂部分覆盖LED芯片,并且包括将LED芯片的发射转换成具有比发射更长波长的光的至少一种类型的荧光体。 在该LED灯中,树脂部具有至少一个侧面。 侧表面与可以反射树脂部分的出射光的另一表面分离,包围LED芯片的侧表面并且至少部分弯曲。
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公开(公告)号:US06963166B2
公开(公告)日:2005-11-08
申请号:US10704005
申请日:2003-11-07
IPC分类号: H01L25/075 , H01L33/50 , H01L33/54 , H01L33/60 , H01J1/62
CPC分类号: H01L33/505 , H01L25/0753 , H01L33/508 , H01L33/54 , H01L33/60 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/49107 , H01L2224/8592 , H01L2924/181 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
摘要: An LED lamp includes a substrate, an LED chip, and a resin portion. The LED chip is flip-chip bonded to the substrate. The resin portion covers the LED chip and includes at least one type of phosphor that transforms the emission of the LED chip into light having a longer wavelength than the emission. In this LED lamp, the resin portion has at least one side surface. The side surface is separated from another surface that can reflect the outgoing light of the resin portion, surrounds the side surfaces of the LED chip and is curved at least partially.
摘要翻译: LED灯包括基板,LED芯片和树脂部分。 LED芯片倒装芯片结合到基板上。 树脂部分覆盖LED芯片,并且包括将LED芯片的发射转换成具有比发射更长波长的光的至少一种类型的荧光体。 在该LED灯中,树脂部具有至少一个侧面。 侧表面与可以反射树脂部分的出射光的另一表面分离,包围LED芯片的侧表面并且至少部分弯曲。
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