公开(公告)号：US20120061879A1

公开(公告)日：2012-03-15

申请号：US13064111

申请日：2011-03-07

Applicant: Shu-Chen Lin

Inventor： Shu-Chen Lin

IPC: B29C45/14 ,  B06B1/02

CPC classification number: B29C45/14795 ,  B29C2045/14155 ,  B29C2045/14803 ,  B29L2031/3481 ,  G01D11/245

Abstract: A manufacturing method of housing of electronic device comprises following steps: providing a metal member; forming a plurality of micro anchored apertures on a surface of the metal member; placing the metal member in a plastic injection mold, wherein the plastic injection mold is set at a first temperature; and providing a molten plastic material in the plastic injection mold for integrating with the surface of the metal member with an injection molding manner, wherein the plastic injection mold is set at a second temperature, and the second temperature is higher than the first temperature.

Abstract translation: 电子设备的外壳的制造方法包括以下步骤：提供金属构件; 在所述金属构件的表面上形成多个微锚定孔; 将金属构件放置在塑料注射模具中，其中塑料注射模具设置在第一温度; 以及在所述塑料注射模具中提供熔融塑性材料，用于与所述金属构件的表面一体地注塑成型，其中所述塑料注射模具被设定在第二温度，并且所述第二温度高于所述第一温度。

公开(公告)号：US20110140310A1

公开(公告)日：2011-06-16

申请号：US12801771

申请日：2010-06-24

Applicant: Shu-Chen Lin

Inventor： Shu-Chen Lin

IPC: B29C45/73

CPC classification number: B29C45/73 ,  B29C33/06 ,  B29C2035/0811

Abstract: An injection mold having pre-heating device, the pre-heating device, and method for pre-heating injection mold are provided. The pre-heating device includes a high frequency coil member and a transportation device having a Z axle servo motor, a Z axle linear sliding rail, an annular transportation belt and a lifting rack. The annular transportation belt is driven by the Z axle servo motor. The high frequency coil member is hung on the lifting rack. The lifting rack is moveably connected to the Z axle linear sliding rail, coupled to the annular transportation belt and is driven by the annular transportation belt to perform an ascent or descent movement along the Z axle linear sliding rail.

Abstract translation: 提供了具有预热装置的注射模具，预热装置和用于预热注射模具的方法。 预热装置包括高频线圈构件和具有Z轴伺服电动机，Z轴线性滑轨，环形输送带和提升架的运输装置。 环形输送带由Z轴伺服电机驱动。 高频线圈构件悬挂在起重架上。 起重架可移动地连接到Z轴线性滑轨，联接到环形输送带，并由环形输送带驱动，以沿着Z轴线性滑轨进行上升或下降运动。

公开(公告)号：US20090156577A1

公开(公告)日：2009-06-18

申请号：US12268529

申请日：2008-11-11

Applicant: Benjamin Davis ,  Eugene B. Grant, III ,  Shu-Chen Lin ,  Mark J. Macielag ,  Michele Ann Weidner-Wells ,  Xiaoqing Xu ,  Xiaodong Xu ,  Bin Zhu

Inventor： Benjamin Davis ,  Eugene B. Grant, III ,  Shu-Chen Lin ,  Mark J. Macielag ,  Michele Ann Weidner-Wells ,  Xiaoqing Xu ,  Xiaodong Xu ,  Bin Zhu

IPC: A61K31/5365 ,  C07D471/04 ,  A61K31/4375 ,  C07D401/04 ,  A61K31/4709 ,  C07D498/16

CPC classification number: C07D471/04 ,  C07D401/04 ,  C07D401/14 ,  C07D498/04 ,  C07D498/14 ,  C07D519/00

Abstract: The present invention relates to compounds having a structure according to Formula (I) wherein n, m, z, R, R2, R3, R4, R5, R6, A, E, X, Y, a and b are as defined above; or an optical isomer, diastereomer or enantiomer thereof; a pharmaceutically acceptable salt, hydrate, or prodrug thereof.

Abstract translation: 本发明涉及具有式（I）结构的化合物，其中n，m，z，R，R 2，R 3，R 4，R 5，R 6，A，E，X，Y，a和b如上所定义; 或其光学异构体，非对映异构体或对映异构体; 其药学上可接受的盐，水合物或前药。

公开(公告)号：US20090029980A1

公开(公告)日：2009-01-29

申请号：US12180641

申请日：2008-07-28

Applicant: Mark J. Macielag ,  Michele A. Weidner-Wells ,  Shu-Chen Lin

Inventor： Mark J. Macielag ,  Michele A. Weidner-Wells ,  Shu-Chen Lin

IPC: A61K31/5383 ,  A61K31/4375 ,  C07D471/04 ,  A61P31/04 ,  C07D498/04 ,  A61K31/4709

CPC classification number: C07D498/04 ,  C07D519/00

Abstract: The present invention relates to C-7 isoxazolyl quinoline/naphthyridine derivatives useful as antimicrobial compounds, pharmaceutical compositions comprising said derivatives and the use of said derivatives and pharmaceutical compositions as antimicrobial agents against pathogenic microorganisms, particularly against resistant microbes.

Abstract translation: 本发明涉及可用作抗微生物化合物的C-7异恶唑基喹啉/萘啶衍生物，包含所述衍生物的药物组合物以及所述衍生物和药物组合物作为抗病原微生物，特别是抗性微生物的抗微生物剂的用途。

公开(公告)号：US5948923A

公开(公告)日：1999-09-07

申请号：US183854

申请日：1998-10-30

Applicant: Kung-Lung Cheng ,  Woan-Shiow Tzeng ,  Shu-Chen Lin

Inventor： Kung-Lung Cheng ,  Woan-Shiow Tzeng ,  Shu-Chen Lin

IPC: C07D303/22 ,  C07D303/24 ,  C08G59/24 ,  C08G59/32 ,  H05K1/03 ,  C08G59/00

CPC classification number: C07D303/22 ,  C07D303/24 ,  C08G59/245 ,  C08G59/3218 ,  H05K1/0326

Abstract: A number of new phenolepoxy resins are prepared by reacting polyphenol, epihalohydrin and imidazole in a homogeneous reaction medium. These include the following compounds: ##STR1##

Abstract translation: 通过使多酚，表卤代醇和咪唑在均相反应介质中反应来制备许多新的苯酚环氧树脂。 这些包括以下化合物：

公开(公告)号：US5844062A

公开(公告)日：1998-12-01

申请号：US841728

申请日：1997-04-29

Applicant: Kung-Lung Cheng ,  Woan-Shiow Tzeng ,  Shu-Chen Lin

Inventor： Kung-Lung Cheng ,  Woan-Shiow Tzeng ,  Shu-Chen Lin

IPC: C07D303/22 ,  C07D303/24 ,  C08G59/24 ,  C08G59/32 ,  H05K1/03 ,  C08G59/06 ,  C08G59/08

CPC classification number: C07D303/22 ,  C07D303/24 ,  C08G59/245 ,  C08G59/3218 ,  H05K1/0326

Abstract: A process for preparing phenolepoxy resin represented by the following formula: ##STR1## wherein: (a) R.sup.1, R.sup.2, R.sup.3, and R.sup.4, which can be the same or different, are hydrogen, C.sub.1 to C.sub.6 alkyl groups, C.sub.6 to C.sub.10 aromatic groups, or C.sub.1 to C.sub.6 alkyl group-substituted C.sub.6 to C.sub.10 aromatic groups; (b) R.sup.5 and R.sup.6, which can be the same or different, are hydrogen, C.sub.1 to C.sub.6 alkyl groups, C.sub.6 to C.sub.10 aromatic groups, or C.sub.1 to C.sub.6 alkyl group-substituted C.sub.6 to C.sub.10 aromatic groups; ##STR2## (c) R.sup.7 is hydrogen, C.sub.1 to C.sub.6 alkyl groups, C.sub.6 to C.sub.10 aromatic groups, or C.sub.1 to C.sub.6 alkyl group-substituted C.sub.6 to C.sub.10 aromatic groups; (d) R.sup.8 and R.sup.9, which can be the same of different, are hydrogen, C.sub.1 to C.sub.6 alkyl groups, C.sub.6 to C.sub.10 aromatic groups, or C.sub.1 to C.sub.6 alkyl group-substituted C.sub.6 to C.sub.10 aromatic groups; and (e) n is an integer of 0 or 1. The phenolepoxy resin can be advantageously used in making packaging materials for ICs, as a substrate additive for printed circuit boards, and as adhesive for the electronic industry. The process includes the steps of preparing a reaction medium which contains only polyphenol, epihalohydrinl and an imidazole catalyst, and then causing the reaction medium to react in the absence of an aqueous phase.

Abstract translation: 一种制备由下式表示的苯氧基树脂的方法：其中：（a）可以相同或不同的R 1，R 2，R 3和R 4为氢，C 1至C 6烷基，C 6至C 10芳族 或C 1〜C 6烷基取代的C 6〜C 10芳香族基团; （b）R5和R6可以相同或不同，为氢，C1至C6烷基，C6至C10芳族基团或C1至C6烷基取代的C6至C10芳族基团; （c）R7是氢，C1至C6烷基，C6至C10芳族基团或C1至C6烷基取代的C6至C10芳族基团; （d）可以相同不同的R 8和R 9为氢，C 1至C 6烷基，C 6至C 10芳族基团或C 1至C 6烷基取代的C 6至C 10芳族基团; 和（e）n为0或1的整数。苯酚环氧树脂可以有利地用于制造用于IC的包装材料，作为印刷电路板的基材添加剂和作为电子工业的粘合剂。 该方法包括制备仅含有多酚，表卤代醇和咪唑催化剂的反应介质，然后使反应介质在不存在水相的情况下反应的步骤。

公开(公告)号：USD700597S1

公开(公告)日：2014-03-04

申请号：US29409032

申请日：2011-12-20

Applicant: Shan-Yao Chen ,  Shu-Chen Lin ,  Jung-Pin Chen

Designer： Shan-Yao Chen ,  Shu-Chen Lin ,  Jung-Pin Chen

公开(公告)号：US08646818B2

公开(公告)日：2014-02-11

申请号：US13304447

申请日：2011-11-25

Applicant: Jung-Pin Chen ,  Shu-Chen Lin ,  Shan-Yao Chen

Inventor： Jung-Pin Chen ,  Shu-Chen Lin ,  Shan-Yao Chen

IPC: E05C3/06 ,  E05C3/16 ,  E05C3/02

CPC classification number: H04M1/026 ,  Y10T292/1043 ,  Y10T292/1044 ,  Y10T292/1047 ,  Y10T292/1051

Abstract: A locking device includes a body, a first part, an engaging assembly, a link and a locking member. The body has an installation area and the engaging assembly is installed in the installation area and includes a first engaging member and a first resilient member which provides a force to the first engaging member to connect the engaging member to the first part. The link is movably located in the installation area to push the first engaging member to move relative to the first part to release the locked status. The locking member is located in the installation area and has a first recess and an operation end. When the first recess is located corresponding to the first engaging member, the first engaging member is movable in the first recess. When the first recess is located away from the first engaging member, the first part is secured to the body.

Abstract translation: 锁定装置包括主体，第一部分，接合组件，连杆和锁定构件。 主体具有安装区域，并且接合组件安装在安装区域中，并且包括第一接合构件和向第一接合构件提供力以将接合构件连接到第一部件的第一弹性构件。 连杆可移动地位于安装区域中，以推动第一接合构件相对于第一部分移动以释放锁定状态。 锁定构件位于安装区域中，并且具有第一凹部和操作端。 当第一凹部对应于第一接合构件定位时，第一接合构件可在第一凹部中移动。 当第一凹部位于远离第一接合构件时，第一部分被固定到主体。

公开(公告)号：US20130214407A1

公开(公告)日：2013-08-22

申请号：US13398081

申请日：2012-02-16

Applicant: Cheng-Hung Shih ,  Shu-Chen Lin ,  Cheng-Fan Lin ,  Yung-Wei Hsieh ,  Bo-Shiun Jiang

Inventor： Cheng-Hung Shih ,  Shu-Chen Lin ,  Cheng-Fan Lin ,  Yung-Wei Hsieh ,  Bo-Shiun Jiang

IPC: H01L23/488 ,  H01L21/60

CPC classification number: H01L21/50 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16225 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29393 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81903 ,  H01L2224/83192 ,  H01L2224/83851 ,  H01L2224/9211 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00

Abstract: A semiconductor packaging method includes providing a substrate having a plurality of pads, each of the pads comprises a first coupling surface having a plurality of first conductive contact areas and a plurality of first non-conductive contact areas; forming a conductible gel with anti-dissociation function on the substrate, said conductible gel includes a plurality of conductive particles and a plurality of anti-dissociation substances; mounting a chip on the substrate, said chip comprises a plurality of copper-containing bumps, each of the copper-containing bumps comprises a ring surface and a second coupling surface having a plurality of second conductive contact areas and a plurality of second non-conductive contact areas, wherein the conductive particles are electrically connected with the first conductive contact areas and the second conductive contact areas, said anti-dissociation substances are in contact with the second non-conductive contact area, and the ring surfaces are covered with the anti-dissociation substances.

公开(公告)号：US08477930B2

公开(公告)日：2013-07-02

申请号：US12699372

申请日：2010-02-03

Applicant: Jung-Pin Chen ,  Shu-Chen Lin ,  Shan-Yao Chen

Inventor： Jung-Pin Chen ,  Shu-Chen Lin ,  Shan-Yao Chen

IPC: H04M9/00

CPC classification number: H04M1/0252 ,  F16B21/065

Abstract: A case assembly for electronic appliance includes a first case having a plurality of engaging members and each engaging member includes two clamping protrusions. Each clamping protrusion includes a supporting portion and a protruding portion. A space is defined between the two clamping protrusions. A second case includes multiple ports and each port has a shoulder defined in an inside thereof and the shoulder is located corresponding to the protruding portions of the clamping protrusions. Multiple positioning members each have an insertion portion and a head. A transverse width of the opening of the space is smaller than a width of the insertion portion. When the insertion portion of each of the positioning members is inserted into the space corresponding thereto, the clamping protrusions are expanded outward by the positioning member, and the protruding portions are engaged on the shoulder of the second case.

Abstract translation: 电子设备的壳体组件包括具有多个接合构件的第一壳体，并且每个接合构件包括两个夹紧突起。 每个夹紧突起包括支撑部分和突出部分。 在两个夹紧突起之间限定一个空间。 第二种情况包括多个端口，并且每个端口具有限定在其内部的肩部，并且肩部位于对应于夹紧突起的突出部分。 多个定位构件各自具有插入部分和头部。 空间的开口的横向宽度小于插入部的宽度。 当每个定位构件的插入部分插入与其对应的空间中时，夹持突起通过定位构件向外扩展，并且突出部分接合在第二壳体的肩部上。