METHOD FOR MANUFACTURING PRESS-MOLDED BODY

    公开(公告)号:US20220009180A1

    公开(公告)日:2022-01-13

    申请号:US17484190

    申请日:2021-09-24

    Applicant: Teijin Limited

    Inventor: Keizo Yokoyama

    Abstract: The present invention provides a method for manufacturing a press-molded body, the method having a step for disposing an X material inside a mold, a step for closing the mold and extruding a Y material, which is a kneaded material, into the mold after pressure has begun to be applied to part of the X material, and a step for cold-pressing and integrally molding the X material and the Y material inside the mold, wherein: the X material includes reinforcing fibers FA, having a weight-average fiber length LwA, and a thermoplastic resin RX; the Y material includes reinforcing fibers FB, having a weight-average fiber length LwB, and a thermoplastic resin RY; LwB t2.

    METHOD FOR PRODUCING PRESS-MOLDED BODY

    公开(公告)号:US20220009179A1

    公开(公告)日:2022-01-13

    申请号:US17484082

    申请日:2021-09-24

    Applicant: Teijin Limited

    Inventor: Keizo Yokoyama

    Abstract: The present invention provides a method for producing a press-molded body, the method having: a step for placing a material X in a mold, a step for closing the mold and injecting a material Y, which is a kneaded material, into the mold after pressure has begun to be applied to part of the material X; and a step for cold-pressing the material X and the material Y in the mold to integrally mold these materials, wherein the material X is cut from a composite material M that includes reinforcing fibers FA having a weight-average fiber length LwA and a thermoplastic resin RX, the material Y includes carbon fibers B having a weight-average fiber length LwB and a thermoplastic resin RY, LwB

    Method for producing composite material

    公开(公告)号:US20210347096A1

    公开(公告)日:2021-11-11

    申请号:US17241640

    申请日:2021-04-27

    Applicant: TEIJIN LIMITED

    Abstract: A prepreg consisting cf a fiber reinforcement material and a resin composition containing a bismaleimide resin is molded through a first heating step in which the prepreg is held at a temperature (T1) equal to or higher than a temperature at which the resin composition exhibits a viscosity of 100 (Pa·s) and equal to or lower than a temperature at which the resin composition exhibits the minimum viscosity for 30 minutes or more, followed by being held at a temperature equal to or higher than a curing temperature of the bismaleimide resin.

    COMMUNICATION SYSTEM
    37.
    发明申请

    公开(公告)号:US20210328688A1

    公开(公告)日:2021-10-21

    申请号:US17271953

    申请日:2018-12-12

    Applicant: TEIJIN LIMITED

    Abstract: A communication circuit generates a clock signal that is a digital signal corresponding to a serial clock, and a data signal that is a digital signal corresponding to serial data to be sent. A modulation circuit generates a first modulated signal obtained by digital modulating a first carrier wave having a first frequency with the clock signal and second modulated signal obtained by modulating the second carrier wave having a second frequency different than the first frequency with the data signal, and applies the first modulated signal and the second modulated signal between a first conductor and a second conductor. A demodulation circuit includes a buffer amplifier that has high input impedance, demodulates the first modulated signal and the second modulated signal, and generates the clock signal and the data signal. The communication circuit acquires serial data on the basis of the clock signal and the data signal.

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