公开(公告)号：US20150364390A1

公开(公告)日：2015-12-17

申请号：US14832997

申请日：2015-08-21

Applicant: APPLIED MATERIALS, INC.

Inventor： Dominic J. Benvegnu ,  Jeffrey Drue David ,  Boguslaw A. Swedek

IPC: H01L21/66 ,  H01L21/3105 ,  H01L21/321 ,  H01L21/306

CPC classification number: H01L22/26 ,  B24B37/013 ,  B24B37/205 ,  B24B49/08 ,  B24B49/12 ,  B24D7/14 ,  H01L21/30625 ,  H01L21/31053 ,  H01L21/31055 ,  H01L21/3212 ,  H01L21/67075 ,  H01L21/67092 ,  H01L21/67253

Abstract: Methods and apparatus for spectrum-based endpointing. An endpointing method includes selecting a reference spectrum. The reference spectrum is a spectrum of white light reflected from a film of interest on a first substrate and has a thickness greater than a target thickness. The reference spectrum is empirically selected for particular spectrum-based endpoint determination logic so that the target thickness is achieved when endpoint is called by applying the particular spectrum-based endpoint logic. The method includes obtaining a current spectrum. The current spectrum is a spectrum of white light reflected from a film of interest on a second substrate when the film of interest is being subjected to a polishing step and has a current thickness that is greater than the target thickness. The method includes determining, for the second substrate, when an endpoint of the polishing step has been achieved. The determining is based on the reference and current spectra.

Abstract translation: 用于基于频谱的终点的方法和装置。 终点方法包括选择参考频谱。 参考光谱是在第一衬底上从感兴趣的膜反射的白光的光谱，并且具有大于目标厚度的厚度。 对于特定的基于频谱的端点确定逻辑，经验地选择参考频谱，使得当通过应用特定的基于频谱的端点逻辑来调用端点时实现目标厚度。 该方法包括获得当前频谱。 目前的光谱是当感兴趣的薄膜经受抛光步骤并且具有大于目标厚度的电流厚度时，在第二基板上从感兴趣的薄膜反射的白光的光谱。 该方法包括为第二基底确定何时已经实现了抛光步骤的终点。 该确定基于参考和当前光谱。

公开(公告)号：US08992286B2

公开(公告)日：2015-03-31

申请号：US13777672

申请日：2013-02-26

Applicant: Applied Materials, Inc.

Inventor： Benjamin Cherian ,  Jeffrey Drue David ,  Boguslaw A. Swedek ,  Dominic J. Benvegnu ,  Jun Qian ,  Thomas H. Osterheld

IPC: B24B1/00 ,  B24B49/12 ,  B24B37/013

CPC classification number: B24B49/12 ,  B24B37/013

Abstract: A method of controlling a polishing operation includes measuring a plurality of spectra at a plurality of different positions on a substrate to provide a plurality of measured spectra. For each measured spectrum of the plurality of measured spectra, a characterizing value is generated based on the measured spectrum. For each characterizing value, a goodness of fit of the measured spectrum to another spectrum used in generating the characterizing value is determined. A wafer-level characterizing value map is generated by applying a regression to the plurality of characterizing values with the plurality of goodnesses of fit used as weighting factors in the regression. A polishing endpoint or a polishing parameter of the polishing apparatus is adjusted based on the wafer-level characterizing map, and the substrate or a subsequent substrate is polished in the polishing apparatus with the adjusted polishing endpoint or polishing parameter.

Abstract translation: 控制抛光操作的方法包括测量衬底上多个不同位置处的多个光谱以提供多个测量光谱。 对于多个测量光谱的每个测量光谱，基于测量的光谱产生表征值。 对于每个特征值，确定测量的光谱与生成表征值所使用的另一光谱的拟合度。 通过将回归应用于具有多个适合度的拟合优点用作回归中的加权因子来生成晶片级特征值映射。 基于晶片级特征图调整抛光装置的抛光终点或抛光参数，并且在抛光装置中用调整的抛光终点或抛光参数对衬底或随后的衬底进行抛光。

公开(公告)号：US20150024659A1

公开(公告)日：2015-01-22

申请号：US14299728

申请日：2014-06-09

Applicant: APPLIED MATERIALS, INC.

Inventor： Jeffrey Drue David

IPC: B24B37/013 ,  B24B37/005 ,  H01L21/304 ,  B24B49/12 ,  B24B49/04 ,  G05B15/02 ,  B24B37/04

CPC classification number: B24B37/013 ,  B24B37/005 ,  B24B37/042 ,  B24B37/105 ,  B24B49/04 ,  B24B49/12 ,  G01B11/0683 ,  G01J3/28 ,  G01N21/55 ,  G01N21/9501 ,  G01N2021/8416 ,  G01N2021/8438 ,  G05B15/02 ,  H01L21/304 ,  H01L21/3212

Abstract: A method of controlling polishing includes polishing a substrate of a non-metallic layer undergoing polishing and a metal layer underlying the non-metallic layer; storing a metal reference spectrum, the metal reference spectrum being a spectrum of light reflected from a same metal material as the metal layer; measuring a sequence of raw spectra of light reflected from the substrate during polishing with an in-situ optical monitoring system; normalizing each raw spectrum in the sequence of spectra to generate a sequence of normalized spectra, of which normalizing includes a division operation where the measured spectrum is in the numerator and the metal reference spectrum is in the denominator; and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on at least one normalized predetermined spectrum from the sequence of normalized spectra.

Abstract translation: 控制抛光的方法包括抛光经历抛光的非金属层的基底和非金属层下面的金属层; 存储金属参考光谱，所述金属参考光谱是从与所述金属层相同的金属材料反射的光谱; 用原位光学监测系统测量在抛光过程中从衬底反射的光的原始光谱序列; 对光谱序列中的每个原始光谱进行归一化以产生归一化光谱序列，其归一化包括除法运算，其中所测量的光谱在分子中，金属参考光谱在分母中; 以及基于来自归一化光谱序列的至少一个归一化的预定光谱来确定抛光终点或抛光速率的调整中的至少一个。

公开(公告)号：US08932107B2

公开(公告)日：2015-01-13

申请号：US14027070

申请日：2013-09-13

Applicant: Applied Materials, Inc.

Inventor： Jeffrey Drue David ,  Boguslaw A. Swedek ,  Dominic J. Benvegnu ,  Sivakumar Dhandapani

IPC: B24B1/00 ,  B24B49/12 ,  B24B37/013 ,  B24B37/10

CPC classification number: B24B49/12 ,  B24B37/013 ,  B24B37/105

Abstract: A polishing apparatus includes a platen to hold a polishing pad having a plurality of optical apertures, a carrier head to hold a substrate against the polishing pad, a motor to generate relative motion between the carrier head and the platen, and an optical monitoring system. The optical monitoring system includes at least one light source, a common detector, and an optical assembly configured to direct light from the at least one light source to each of a plurality of separated positions in the platen, to direct light from each position of the plurality of separated positions to the substrate as the substrate passes over said each position, to receive reflected light from the substrate as the substrate passes over said each position, and to direct the reflected light from each of the plurality of separated positions to the common detector.

Abstract translation: 抛光装置包括用于保持具有多个光学孔的抛光垫的压板，用于将衬底保持在抛光垫上的载体头，用于在承载头和压板之间产生相对运动的电动机以及光学监控系统。 所述光学监视系统包括至少一个光源，公共检测器和配置成将来自所述至少一个光源的光引导到所述压板中的多个分离位置中的每一个的光学组件，以引导来自所述至少一个光源的每个位置的光 当衬底越过所述每个位置时，多个分离的位置到衬底，以在衬底经过所述每个位置时接收来自衬底的反射光，并将来自多个分离位置中的每一个的反射光引导到公共检测器 。

公开(公告)号：US08874250B2

公开(公告)日：2014-10-28

申请号：US14046237

申请日：2013-10-04

Applicant: Applied Materials, Inc.

Inventor： Jeffrey Drue David ,  Dominic J. Benvegnu ,  Harry Q. Lee ,  Boguslaw A. Swedek ,  Lakshmanan Karuppiah

IPC: G06F19/00 ,  B24B49/00 ,  G01B11/28 ,  B24B49/12 ,  G05B15/02 ,  B24B37/013

CPC classification number: G05B15/02 ,  B24B37/013 ,  B24B49/12

Abstract: Methods, systems, and apparatus for spectrographic monitoring of a substrate during chemical mechanical polishing are described. In one aspect, a computer-implemented method includes storing a library having a plurality of reference spectra, each reference spectrum of the plurality of reference spectra having a stored associated index value, measuring a sequence of spectra in-situ during polishing to obtain measured spectra, for each measured spectrum of the sequence of spectra, finding a best matching reference spectrum to generate a sequence of best matching reference spectra, determining the associated index value for each best matching spectrum from the sequence of best matching reference spectra to generate a sequence of index values, fitting a linear function to the sequence of index values, and halting the polishing either when the linear function matches or exceeds a target index or when the associated index value from the determining step matches or exceeds the target index.

Abstract translation: 描述了在化学机械抛光期间用于光谱监测基底的方法，系统和装置。 一方面，计算机实现的方法包括存储具有多个参考光谱的库，多个参考光谱的每个参考光谱具有存储的相关联的索引值，在抛光期间原位测量光谱序列以获得测量的光谱 ，对于光谱序列的每个测量光谱，找到最佳匹配参考光谱以产生最佳匹配参考光谱序列，从最佳匹配参考光谱序列确定每个最佳匹配光谱的相关索引值，以产生序列 索引值，将线性函数拟合到索引值序列，以及当线性函数匹配或超过目标索引时或者当来自确定步骤的相关索引值匹配或超过目标索引时停止抛光。

公开(公告)号：US20140316550A1

公开(公告)日：2014-10-23

申请号：US14322686

申请日：2014-07-02

Applicant: Applied Materials, Inc.

Inventor： Boguslaw A. Swedek ,  Dominic J. Benvegnu ,  Jeffrey Drue David

IPC: B24B49/12 ,  G05B15/02

Abstract: A computer implemented method of monitoring a polishing process includes, for each sweep of a plurality of sweeps of an optical sensor across a substrate undergoing polishing, obtaining a plurality of current spectra, each current spectrum of the plurality of current spectra being a spectrum resulting from reflection of white light from the substrate, for each sweep of the plurality of sweeps, determining a difference between each current spectrum and each reference spectrum of a plurality of reference spectra to generate a plurality of differences, for each sweep of the plurality of sweeps, determining a smallest difference of the plurality of differences, thus generating a sequence of smallest difference, and determining a polishing endpoint based on the sequence of smallest differences.

Abstract translation: 监测抛光过程的计算机实现的方法包括：对于经历抛光的衬底上的光学传感器的多个扫描的每次扫描，获得多个电流光谱，多个电流光谱的每个电流光谱是由 对于多个扫描的每次扫描，从基板反射白光，确定多个参考光谱的每个当前光谱和每个参考光谱之间的差异，以对于多个扫描的每次扫描产生多个差异， 确定多个差异的最小差异，从而产生最小差异的序列，并且基于最小差异的序列确定抛光端点。

公开(公告)号：US20140242878A1

公开(公告)日：2014-08-28

申请号：US13777672

申请日：2013-02-26

Applicant: Applied Materials, Inc.

Inventor： Benjamin Cherian ,  Jeffrey Drue David ,  Boguslaw A. Swedek ,  Dominic J. Benvegnu ,  Jun Qian ,  Thomas H. Osterheld

IPC: B24B49/12 ,  B24B37/013

CPC classification number: B24B49/12 ,  B24B37/013

Abstract: A method of controlling a polishing operation includes measuring a plurality of spectra at a plurality of different positions on a substrate to provide a plurality of measured spectra. For each measured spectrum of the plurality of measured spectra, a characterizing value is generated based on the measured spectrum. For each characterizing value, a goodness of fit of the measured spectrum to another spectrum used in generating the characterizing value is determined. A wafer-level characterizing value map is generated by applying a regression to the plurality of characterizing values with the plurality of goodnesses of fit used as weighting factors in the regression. A polishing endpoint or a polishing parameter of the polishing apparatus is adjusted based on the wafer-level characterizing map, and the substrate or a subsequent substrate is polished in the polishing apparatus with the adjusted polishing endpoint or polishing parameter.

Abstract translation: 控制抛光操作的方法包括测量衬底上多个不同位置处的多个光谱以提供多个测量光谱。 对于多个测量光谱的每个测量光谱，基于测量的光谱产生表征值。 对于每个特征值，确定测量的光谱与生成表征值所使用的另一光谱的拟合度。 通过将回归应用于具有多个适合度的拟合优点用作回归中的加权因子来生成晶片级特征值映射。 基于晶片级特征图调整抛光装置的抛光终点或抛光参数，并且在抛光装置中用调整的抛光终点或抛光参数对衬底或随后的衬底进行抛光。

公开(公告)号：US08755927B2

公开(公告)日：2014-06-17

申请号：US13919144

申请日：2013-06-17

Applicant: Applied Materials, Inc.

Inventor： Jun Qian ,  Charles C. Garretson ,  Sivakumar Dhandapani ,  Jeffrey Drue David ,  Harry Q. Lee

IPC: G06F19/00 ,  B24B49/04 ,  B24B49/12

CPC classification number: B24B49/04 ,  B24B49/12

Abstract: A substrate having a plurality of zones is polished and spectra are measured. For each zone, a first linear function fits a sequence of index values associated with reference spectra that best match the measured spectra. A projected time at which a reference zone will reach the target index value is determined based on the first linear function, and for at least one adjustable zone, a polishing parameter adjustment is calculated such that the adjustable zone has closer to the target index at the projected time than without such adjustment. The adjustment is calculated based on a feedback error calculated for a previous substrate. The feedback error for a subsequent substrate is calculated based on a second linear function that fits a sequence of index values associated with reference spectra that best match spectra measured after the polishing parameter is adjusted.

Abstract translation: 研磨具有多个区域的基板并测量光谱。 对于每个区域，第一个线性函数拟合与参考光谱相关联的索引值序列，该参考光谱与测量的光谱最匹配。 基于第一线性函数确定参考区域将达到目标指标值的预计时间，并且对于至少一个可调整区域，计算抛光参数调整，使得可调节区域更接近目标索引处的目标索引 预计时间比没有这样的调整。 基于对先前基板计算的反馈误差来计算调整。 基于适合与调整抛光参数之后测量的最佳匹配光谱的参考光谱相关联的索引值序列的第二线性函数来计算后续衬底的反馈误差。

公开(公告)号：US20140141695A1

公开(公告)日：2014-05-22

申请号：US13791617

申请日：2013-03-08

Applicant: Applied Materials, Inc.

Inventor： Jeffrey Drue David ,  Boguslaw A. Swedek ,  Doyle E. Bennett ,  Thomas H. Osterheld ,  Benjamin Cherian ,  Dominic J. Benvegnu ,  Harry Q. Lee ,  Allen L. D'Ambra ,  Jagan Rangarajan

IPC: B24B37/005

CPC classification number: B24B37/005 ,  B24B37/013 ,  B24B37/04 ,  B24B37/345

Abstract: A polishing apparatus includes a plurality of stations supported on a platform, the plurality of stations including at least two polishing stations and a transfer station, each polishing station including a platen to support a polishing pad, a plurality of carrier heads suspended from and movable along a track such that each polishing station is selectively positionable at the stations, and a controller configured to control motion of the carrier heads along the track such that during polishing at each polishing station only a single carrier head is positioned in the polishing station.

Abstract translation: 抛光装置包括支撑在平台上的多个工位，所述多个工位包括至少两个抛光站和转移站，每个抛光站包括用于支撑抛光垫的压板，多个托架头悬挂并可沿其移动 轨道，使得每个抛光站可选择性地定位在车站处;以及控制器，被配置为控制承载头沿着轨道的运动，使得在每个抛光站的抛光期间，只有单个承载头位于抛光台中。

公开(公告)号：US20140045282A1

公开(公告)日：2014-02-13

申请号：US14041113

申请日：2013-09-30

Applicant: Applied Materials, Inc.

Inventor： Harry Q. Lee ,  Boguslaw A. Swedek ,  Dominic J. Benvegnu ,  Jeffrey Drue David

IPC: H01L21/66 ,  H01L21/306

CPC classification number: H01L22/12 ,  B24B37/013 ,  B24B49/12 ,  H01L21/30625 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Methods of determining a polishing endpoint are described using spectra obtained during a polishing sequence. In particular, techniques for using only desired spectra, faster searching methods and more robust rate determination methods are described.

Abstract translation: 使用在抛光顺序期间获得的光谱来描述确定抛光终点的方法。 特别地，描述了仅使用期望的光谱，更快的搜索方法和更稳定的速率确定方法的技术。