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    Grouping spectral data from polishing substrates
    4.
    发明授权
    Grouping spectral data from polishing substrates 有权

    公开(公告)号：US10012494B2

    公开(公告)日：2018-07-03

    申请号：US14063740

    申请日：2013-10-25

    Applicant: Applied Materials, Inc.

    Inventor： Jeffrey Drue David ,  Boguslaw A. Swedek

    IPC: G01B11/02 ,  G01B13/02 ,  G01B11/06 ,  B24B37/013 ,  B24B49/12 ,  H01L21/66

    Abstract: Among other things, a computer-based method is described. The method comprises receiving, by one or more computers, a plurality of measured spectra reflected from a substrate at a plurality of different positions on the substrate. The substrate comprises at least two regions having different structural features. The method also comprises performing, by the one or more computers, a clustering algorithm on the plurality of measured spectra to separate the plurality of measured spectra into a number of groups based on the spectral characteristics of the plurality of measured spectra; selecting one of the number of groups to provide a selected group having a subset of spectra from the plurality of measured spectra; and determining, in the one or more computers, at least one characterizing value for the substrate based on the subset of spectra of the selected group.

    Computer program product and method of controlling polishing of a substrate
    6.
    发明授权
    Computer program product and method of controlling polishing of a substrate 有权
    控制基板抛光的计算机程序产品和方法

    公开(公告)号：US09573242B2

    公开(公告)日：2017-02-21

    申请号：US14299728

    申请日：2014-06-09

    Applicant: Applied Materials, Inc.

    Inventor： Jeffrey Drue David

    IPC: B24B37/013 ,  B24B37/005 ,  H01L21/304 ,  B24B49/12 ,  B24B49/04 ,  G05B15/02 ,  B24B37/04 ,  B24B37/10 ,  G01B11/06 ,  G01J3/28 ,  G01N21/55 ,  G01N21/95 ,  G01N21/84 ,  H01L21/321

    CPC classification number: B24B37/013 ,  B24B37/005 ,  B24B37/042 ,  B24B37/105 ,  B24B49/04 ,  B24B49/12 ,  G01B11/0683 ,  G01J3/28 ,  G01N21/55 ,  G01N21/9501 ,  G01N2021/8416 ,  G01N2021/8438 ,  G05B15/02 ,  H01L21/304 ,  H01L21/3212

    Abstract: A method of controlling polishing includes polishing a substrate of a non-metallic layer undergoing polishing and a metal layer underlying the non-metallic layer; storing a metal reference spectrum, the metal reference spectrum being a spectrum of light reflected from a same metal material as the metal layer; measuring a sequence of raw spectra of light reflected from the substrate during polishing with an in-situ optical monitoring system; normalizing each raw spectrum in the sequence of spectra to generate a sequence of normalized spectra, of which normalizing includes a division operation where the measured spectrum is in the numerator and the metal reference spectrum is in the denominator; and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on at least one normalized predetermined spectrum from the sequence of normalized spectra.

    Abstract translation: 控制抛光的方法包括抛光经历抛光的非金属层的基底和非金属层下面的金属层; 存储金属参考光谱，所述金属参考光谱是从与所述金属层相同的金属材料反射的光谱; 用原位光学监测系统测量在抛光过程中从衬底反射的光的原始光谱序列; 对光谱序列中的每个原始光谱进行归一化以产生归一化光谱序列，其归一化包括除法运算，其中所测量的光谱在分子中，金属参考光谱在分母中; 以及基于来自归一化光谱序列的至少一个归一化的预定光谱来确定抛光终点或抛光速率的调整中的至少一个。

    Reducing noise in spectral data from polishing substrates
    7.
    发明授权
    Reducing noise in spectral data from polishing substrates 有权
    从抛光基板减少光谱数据中的噪声

    公开(公告)号：US09551567B2

    公开(公告)日：2017-01-24

    申请号：US14063917

    申请日：2013-10-25

    Applicant: Applied Materials, Inc.

    Inventor： Jeffrey Drue David ,  Boguslaw A. Swedek ,  Benjamin Cherian

    IPC: G01B5/02 ,  B24B49/00 ,  G01B11/06 ,  B24B37/013 ,  B24B49/12 ,  H01L21/66

    CPC classification number: B24B37/013 ,  B24B49/12 ,  G01B11/06 ,  G01B11/0625 ,  H01L21/30625 ,  H01L22/12 ,  H01L22/20 ,  H01L22/26

    Abstract: Among other things, a machine based method includes representing a plurality of spectra reflected from one or more substrates at a plurality of different positions on the one or more substrates in the form of a first matrix; decomposing, by one or more computers, the first matrix into products of at least two component matrixes of a first set of component matrixes; reducing dimensions of each of the at least two component matrixes to produce a second set of component matrixes containing the at least two matrixes with reduced dimensions; and generating, by the one or more computers, a second matrix by taking a product of the matrixes of the second set of component matrixes.

    Abstract translation: 其中，基于机器的方法包括表示在第一矩阵形式的一个或多个基板上的多个不同位置处的一个或多个基板反射的多个光谱; 通过一个或多个计算机将第一矩阵分解成第一组分矩阵的至少两个分量矩阵的乘积; 减少所述至少两个组分矩阵中的每一个的尺寸以产生包含具有减小的尺寸的所述至少两个矩阵的第二组分量矩阵; 以及由所述一个或多个计算机通过获取所述第二组分量矩阵的矩阵的乘积来生成第二矩阵。

    POLISHING WITH MEASUREMENT PRIOR TO DEPOSITION OF OUTER LAYER
    8.
    发明申请
    POLISHING WITH MEASUREMENT PRIOR TO DEPOSITION OF OUTER LAYER 审中-公开
    在外层沉积之前进行抛光

    公开(公告)号：US20160284615A1

    公开(公告)日：2016-09-29

    申请号：US15173584

    申请日：2016-06-03

    Applicant: Applied Materials, Inc.

    Inventor： Tomohiko Kitajima ,  Jeffrey Drue David ,  Jun Qian ,  Taketo Sekine ,  Garlen C. Leung ,  Sidney P. Huey

    IPC: H01L21/66 ,  H01L21/321 ,  B24B49/10 ,  H01L21/311 ,  B24B37/013 ,  H01L21/3105 ,  H01L21/67

    CPC classification number: H01L22/26 ,  B24B37/013 ,  B24B49/105 ,  H01L21/31053 ,  H01L21/3212 ,  H01L21/67075 ,  H01L21/67092 ,  H01L21/67253 ,  H01L22/14 ,  H01L22/20 ,  H01L22/34

    Abstract: A method of controlling polishing includes storing a base measurement, the base measurement being a measurement of a substrate after deposition of at least one layer overlying a semiconductor wafer and before deposition of an outer layer over the at least one layer, after deposition of the outer layer over the at least one layer and during polishing of the outer layer on substrate, receiving a sequence of raw measurements of the substrate from an in-situ monitoring system, normalizing each raw measurement in the sequence of raw measurement to generate a sequence of normalized measurements using the raw measurement and the base measurement, and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on at least the sequence of normalized measurements.

    Abstract translation: 控制抛光的方法包括存储基底测量，所述基底测量是沉积覆盖在半导体晶片上的至少一个层之后并且在外层沉积外层之后在所述至少一个层上沉积之后的衬底的测量值 层，并且在衬底上的外层的抛光期间，从原位监测系统接收衬底的原始测量序列，对原始测量序列中的每个原始测量进行归一化，以生成标准化的序列 使用原始测量和基础测量的测量，以及至少基于归一化测量的顺序来确定抛光终点或抛光速率的调整中的至少一个。

    Endpointing detection for chemical mechanical polishing based on spectrometry
    9.
    发明授权
    Endpointing detection for chemical mechanical polishing based on spectrometry 有权
    基于光谱法的化学机械抛光的终点检测

    公开(公告)号：US09117751B2

    公开(公告)日：2015-08-25

    申请号：US14010193

    申请日：2013-08-26

    Applicant: Applied Materials, Inc.

    Inventor： Dominic J. Benvegnu ,  Jeffrey Drue David ,  Boguslaw A. Swedek

    IPC: H01L21/302 ,  H01L21/66 ,  B24B37/013 ,  B24B37/20 ,  B24B49/08 ,  B24B49/12 ,  B24D7/14 ,  H01L21/3105 ,  H01L21/321

    CPC classification number: H01L22/26 ,  B24B37/013 ,  B24B37/205 ,  B24B49/08 ,  B24B49/12 ,  B24D7/14 ,  H01L21/30625 ,  H01L21/31053 ,  H01L21/31055 ,  H01L21/3212 ,  H01L21/67075 ,  H01L21/67092 ,  H01L21/67253

    Abstract: Methods and apparatus for spectrum-based endpointing. An endpointing method includes selecting a reference spectrum. The reference spectrum is a spectrum of white light reflected from a film of interest on a first substrate and has a thickness greater than a target thickness. The reference spectrum is empirically selected for particular spectrum-based endpoint determination logic so that the target thickness is achieved when endpoint is called by applying the particular spectrum-based endpoint logic. The method includes obtaining a current spectrum. The current spectrum is a spectrum of white light reflected from a film of interest on a second substrate when the film of interest is being subjected to a polishing step and has a current thickness that is greater than the target thickness. The method includes determining, for the second substrate, when an endpoint of the polishing step has been achieved. The determining is based on the reference and current spectra.

    Abstract translation: 用于基于频谱的终点的方法和装置。 终点方法包括选择参考频谱。 参考光谱是在第一衬底上从感兴趣的膜反射的白光的光谱，并且具有大于目标厚度的厚度。 对于特定的基于频谱的端点确定逻辑，经验地选择参考频谱，使得当通过应用特定的基于频谱的端点逻辑来调用端点时实现目标厚度。 该方法包括获得当前频谱。 目前的光谱是当感兴趣的薄膜经受抛光步骤并且具有大于目标厚度的电流厚度时，在第二基板上从感兴趣的薄膜反射的白光的光谱。 该方法包括为第二基底确定何时已经实现了抛光步骤的终点。 该确定基于参考和当前光谱。

    SPECTRAPHIC MONITORING BASED ON PRE-SCREENING OF THEORETICAL LIBRARY
    10.
    发明申请
    SPECTRAPHIC MONITORING BASED ON PRE-SCREENING OF THEORETICAL LIBRARY 有权
    基于理论图书馆预筛选的光谱监测

    公开(公告)号：US20140242730A1

    公开(公告)日：2014-08-28

    申请号：US13779542

    申请日：2013-02-27

    Applicant: Applied Materials, Inc.

    Inventor： Jeffrey Drue David

    IPC: H01L21/66

    CPC classification number: H01L22/12 ,  B24B37/0053 ,  B24B49/12 ,  G01B11/0625 ,  H01L22/26

    Abstract: An optical model for a layer stack has a plurality of input parameters, the plurality of input parameters defining a parameter space. A plurality of model spectra are generated by calculating a model spectrum using the optical model for each of a first plurality of different points in the parameter space. A test spectrum of a test substrate is measured. For each model spectrum of the plurality of model spectra, the test spectrum is compared to the model spectrum to determine a difference value, thereby generating a plurality of difference values. A plurality of minima in the plurality of difference values are determined. Reference spectra can be generated clustered around points in the parameter space corresponding to a local minimum from the plurality of minima, or the local minimum can be used as a seed value in fitting the optical model to a measured spectrum.

    Abstract translation: 用于层堆叠的光学模型具有多个输入参数，所述多个输入参数定义参数空间。 通过使用参数空间中的第一多个不同点中的每一个的光学模型来计算模型谱来生成多个模型光谱。 测量测试基板的测试光谱。 对于多个模型光谱的每个模型光谱，将测试光谱与模型光谱进行比较以确定差值，从而产生多个差值。 确定多个差值中的多个最小值。 参考光谱可以围绕与多个最小值中的局部最小值相对应的参数空间中的点聚集，或者可以将局部最小值用作将光学模型拟合到测量光谱中的种子值。

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