公开(公告)号：US20210076510A1

公开(公告)日：2021-03-11

申请号：US16563713

申请日：2019-09-06

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ming-Hung CHEN ,  Yung I. YEH ,  Chang-Lin YEH ,  Sheng-Yu CHEN

IPC: H05K5/00 ,  H05K5/06 ,  H05K1/18 ,  H05K9/00 ,  H05K3/28 ,  H05K1/14

Abstract: A semiconductor device package includes a display device, an encapsulation layer disposed in direct contact with the display device, and a reinforced structure surrounded by the encapsulation layer. The reinforced structure is spaced apart from a surface of the display device. A method of manufacturing a semiconductor device package is also disclosed.

公开(公告)号：US20200312733A1

公开(公告)日：2020-10-01

申请号：US16370633

申请日：2019-03-29

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang-Lin YEH ,  Jen-Chieh KAO ,  Sheng-Yu CHEN ,  Yu-Chang CHEN ,  Yu-Chang CHEN

IPC: H01L23/31 ,  H01L25/065 ,  H01L23/00 ,  H01L23/29 ,  H01L21/48 ,  H01L21/56 ,  H01L25/00

Abstract: A semiconductor package structure includes a substrate having a first surface and a second surface opposite to the first surface; a first encapsulant disposed on the first surface of the substrate, and defining a cavity having a sidewall, wherein an accommodating space is defined by the sidewall of the cavity of the first encapsulant and the substrate, and the accommodating space has a volume capacity; and a connecting element disposed adjacent to the first surface of the substrate and in the cavity, wherein a volume of the connecting element is substantially equal to the volume capacity of the accommodating space.

公开(公告)号：US20180374805A1

公开(公告)日：2018-12-27

申请号：US16121467

申请日：2018-09-04

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang-Lin YEH ,  Jen-Chieh KAO ,  Chih-Yi HUANG ,  Fu-Chen CHU

IPC: H01L23/66 ,  H01L43/02 ,  H01L23/552

CPC classification number: H01L23/66 ,  H01L23/49838 ,  H01L23/552 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/16 ,  H01L43/02 ,  H01L2223/6605 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2224/48227 ,  H01L2225/06517 ,  H01L2225/06531 ,  H01L2225/06537 ,  H01L2225/06572 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19107

Abstract: A semiconductor package device includes: (1) a substrate having a first surface; (2) a permeable element including a first portion disposed on the first surface of the substrate, a second portion protruding from the first portion, and a third portion disposed on the second portion and contacting the second portion of the permeable element; (3) a first electrical element disposed on the substrate and surrounded by the second portion of the permeable element; and (4) a coil disposed on the substrate and surrounding the second portion of the permeable element.

公开(公告)号：US20180226365A1

公开(公告)日：2018-08-09

申请号：US15425723

申请日：2017-02-06

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang-Lin YEH ,  Jen-Chieh KAO ,  Chih-Yi HUANG ,  Fu-Chen CHU

IPC: H01L23/66 ,  H01L23/498 ,  H01L43/02

CPC classification number: H01L43/02 ,  H01L23/49838 ,  H01L23/552 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/16 ,  H01L2224/16227 ,  H01L2224/48227 ,  H01L2225/06517 ,  H01L2225/06531 ,  H01L2225/06537 ,  H01L2225/06572 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19107

Abstract: A semiconductor package device includes a substrate, a first package body, a permeable element and a coil. The substrate includes a first surface. The first package body encapsulates the first surface of the substrate. The permeable element includes a first portion disposed on the first surface of the substrate and a second portion disposed on the package body. The coil is within the first package body.

公开(公告)号：US20180204824A1

公开(公告)日：2018-07-19

申请号：US15408158

申请日：2017-01-17

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang-Lin YEH

IPC: H01L25/10 ,  H01L23/498 ,  H01L23/31 ,  H01L23/04 ,  H01L23/48 ,  H01L25/065 ,  H01L21/56 ,  H01L21/78 ,  H01L21/768 ,  H01L25/00

CPC classification number: H01L25/50 ,  H01L21/561 ,  H01L23/04 ,  H01L23/3121 ,  H01L23/3142 ,  H01L25/112 ,  H01L25/115 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/1532 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2224/81 ,  H01L2224/85

Abstract: An electronic module includes a first sub-module and a second sub-module. The first sub-module includes a first substrate, a first electronic component disposed on the first substrate and a first electrode. The second sub-module includes a second substrate, a second electronic component disposed on the second substrate and a second electrode spaced from the first electrode. The second electrode faces the first electrode to form a capacitor for transmitting an alternating current (AC) signal between the first sub-module and the second sub-module.

公开(公告)号：US20180151485A1

公开(公告)日：2018-05-31

申请号：US15362548

申请日：2016-11-28

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jen-Chieh KAO ,  Chang-Lin YEH ,  Yi CHEN ,  Sung-Hung CHIANG

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/02 ,  H01L21/48

CPC classification number: H01L23/49838 ,  H01L21/486 ,  H01L23/02 ,  H01L23/3121 ,  H01L23/49827 ,  H01L23/5383 ,  H01L23/552 ,  H01L24/06 ,  H01L24/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2225/06517 ,  H01L2225/06537 ,  H01L2225/06572 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/16153 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/00012

Abstract: A semiconductor device package includes a substrate, a package body, a via and an interconnect. The substrate includes a surface and a pad on the first surface. The package body covers at least a portion of the surface of the substrate. The via is disposed in the package body and includes a conductive layer and a first intermediate layer. The conductive layer is electrically connected with the pad. The first intermediate layer is adjacent to the conductive layer. The interconnect is disposed on the first intermediate layer.