Abstract:
An electronic device is for detecting and monitoring a local parameter within a solid structure. The electronic device may include an integrated detection module having a functional IC including an integrated sensor to detect the local parameter within the solid structure, and an antenna and having a functional circuitry surface facing towards an outside of the functional IC, and a passivation layer to cover at least the functional circuitry surface of the functional IC so that the functional IC is hermetically sealed and galvanically insulated from a surrounding environment. The electronic device may also include an RF circuit to be coupled with the integrated detection module and having a remote antenna configured to transmit/receive signals for telecommunications and energy exchange with the antenna. The antenna, the RF circuit, and the remote antenna may wirelessly communicate via an electromagnetic coupling.
Abstract:
A retinal prosthesis including an electronic stimulation unit housed inside an eye and including: a plurality of electrodes that contact a portion of a retina of the eye; an electronic control circuit, which is electrically connected to the electrodes and supplies to the electrodes electrical stimulation signals designed to stimulate the portion of retina; and a local antenna connected to the electronic control circuit. The retinal prosthesis further includes an electromagnetic expansion housed inside the eye and formed by a first expansion antenna and a second expansion antenna electrically connected together, the first expansion antenna being magnetically or electromagnetically coupled to an external antenna, the second expansion antenna being magnetically or electromagnetically couple to the local antenna, the electromagnetic expansion moreover receiving an electromagnetic supply signal transmitted by the external antenna and generating a corresponding replica signal.
Abstract:
A test circuit is described of a circuit integrated on wafer of the type comprising at least one antenna of the embedded type comprising at least one test antenna associated with said at least one embedded antenna that realizes its connection of the wireless loopback type creating a wireless channel for said at least one embedded antenna and allows its electric test, transforming an electromagnetic signal of communication between said at least one embedded antenna and said at least one test antenna into an electric signal that can be read by a test apparatus.
Abstract:
Device (100) for detecting and monitoring local parameters within a solid structure (300). The device comprises an integrated detection module (1) made on a single chip, having an integrated functional circuitry portion (16) comprising at least one integrated sensor (10) and an integrated antenna (11), and electromagnetic means (2) for transmitting/receiving signals and energy exchange. The integrated functional circuitry portion (16) comprises a functional surface (18) facing towards the outside of the chip. A passivation layer (15) is arranged to completely cover at least the functional surface (18), so that the integrated detection module (1) is entirely hermetically sealed and galvanically insulated from the surrounding environment. The integrated antenna (11), the electromagnetic means (2) and the remote antenna (221) are operatively connected wirelessly through magnetic or electromagnetic coupling.
Abstract:
An embodiment of a probe card adapted for testing at least one integrated circuit integrated on a corresponding at least one die of a semiconductor material wafer, the probe card including a board adapted for the coupling to a tester apparatus, and a plurality of probes coupled to the said board, wherein the probe card comprises a plurality of replaceable elementary units, each one comprising at least one of said probes for contacting externally-accessible terminals of an integrated circuit under test, the plurality of replaceable elementary units being arranged so as to correspond to an arrangement of at least one die on the semiconductor material wafer containing integrated circuits to be tested.
Abstract:
An embodiment of a RF identification device is formed by a tag and by a reader. The tag is formed by a processing circuit and a first antenna, which has the function both of transmitting and of receiving data. The reader is formed by a control circuit and by a second antenna, which has the function both of transmitting and of receiving data. The processing circuit is formed by a resonance capacitor, a modulator, a rectifier circuit, a charge-pump circuit and a detection circuit. The antenna of the tag and the processing circuit are integrated in a single structure in completely monolithic form. The first antenna has terminals connected to the input of the rectifier circuit, the output of which is connected to the charge-pump circuit. The charge-pump circuit has an output connected to the detection circuit.
Abstract:
An embodiment of a RF identification device is formed by a tag and by a reader. The tag is formed by a processing circuit and a first antenna, which has the function both of transmitting and of receiving data. The reader is formed by a control circuit and by a second antenna, which has the function both of transmitting and of receiving data. The processing circuit is formed by a resonance capacitor, a modulator, a rectifier circuit, a charge-pump circuit and a detection circuit. The antenna of the tag and the processing circuit are integrated in a single structure in completely monolithic form. The first antenna has terminals connected to the input of the rectifier circuit, the output of which is connected to the charge-pump circuit. The charge-pump circuit has an output connected to the detection circuit.
Abstract:
An integrated circuit integrated on a semiconductor material die and adapted to be at least partly tested wirelessly, wherein circuitry for setting a selected radio communication frequencies to be used for the wireless test of the integrated circuit are integrated on the semiconductor material die.
Abstract:
An embodiment of a probe card adapted for testing at least one integrated circuit integrated on a corresponding at least one die of a semiconductor material wafer, the probe card including a board adapted for the coupling to a tester apparatus, and a plurality of probes coupled to the said board, wherein the probe card comprises a plurality of replaceable elementary units, each one comprising at least one of said probes for contacting externally-accessible terminals of an integrated circuit under test, the plurality of replaceable elementary units being arranged so as to correspond to an arrangement of at least one die on the semiconductor material wafer containing integrated circuits to be tested.
Abstract:
A method of testing integrated circuits, including: establishing at least a first physical communication channel between a test equipment and an integrated circuit under test by having at least a first probe of the test equipment contacting a corresponding physical contact terminal of the integrated circuit under test; having the test equipment and the integrated circuit under test exchange, over said first physical communication channel, at least two signals selected from the group including at least two test stimuli and at least two test response signals, wherein said at least two signals are exchanged by means of at least one modulated carrier wave modulated by the at least two signals.