公开(公告)号：US20180149677A1

公开(公告)日：2018-05-31

申请号：US15363285

申请日：2016-11-29

Applicant: Allegro MicroSystems, LLC

Inventor： Shaun D. Milano ,  Bryan Cadugan ,  Michael C. Doogue ,  Alexander Latham ,  William P. Taylor ,  Harianto Wong ,  Sundar Chetlur

IPC: G01R15/14 ,  G01R15/20 ,  G01R19/00

CPC classification number: G01R15/148 ,  G01R15/202 ,  G01R15/205 ,  G01R15/207 ,  G01R19/0092 ,  H01L2224/16145 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Systems and methods described herein are directed towards integrating a shield layer into a current sensor to shield a magnetic field sensing element and associated circuitry in the current sensor from electrical, voltage, or electrical transient noise. In an embodiment, a shield layer may be disposed along at least one surface of a die supporting a magnetic field sensing element. The shield layer may be disposed in various arrangements to shunt noise caused by a parasitic coupling between the magnetic field sensing element and the current carrying conductor away from the magnetic field sensing element.

公开(公告)号：US09865807B2

公开(公告)日：2018-01-09

申请号：US14877309

申请日：2015-10-07

Applicant: Allegro Microsystems, LLC

Inventor： Shixi Louis Liu ,  Harianto Wong ,  Paul A. David ,  John B. Sauber ,  Shaun D. Milano ,  Raguvir Kanda ,  Bruce Hemenway

IPC: H01L23/495 ,  H01L43/14 ,  H01L43/04 ,  H01L21/48 ,  H01L43/06 ,  G01R33/00 ,  G01R33/09 ,  G01R15/20 ,  H01L23/00

CPC classification number: H01L43/14 ,  G01R15/202 ,  G01R15/207 ,  G01R33/0052 ,  G01R33/09 ,  H01L21/4828 ,  H01L23/49548 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L43/04 ,  H01L43/065 ,  H01L2224/131 ,  H01L2224/16245 ,  H01L2224/81801 ,  H01L2924/15162 ,  H01L2924/014 ,  H01L2924/00014

Abstract: In one aspect, a method includes processing a metal substrate, performing a first etch on a first surface of the metal substrate to form, for an integrated circuit package, secondary leads and a curved component having two primary leads and performing a second etch, on a second surface of the substrate opposite the first surface, at locations on the secondary leads and locations on the curved component to provide a locking mechanism. Each primary lead located at a respective end of the curved component.

公开(公告)号：US09620705B2

公开(公告)日：2017-04-11

申请号：US15049732

申请日：2016-02-22

Applicant: ALLEGRO MICROSYSTEMS, LLC

Inventor： Shaun D. Milano ,  Michael C. Doogue ,  William P. Taylor

IPC: H01L23/00 ,  H01L43/04 ,  H01L23/495 ,  H01L23/31 ,  G01R33/00 ,  H01L43/02 ,  H01L43/12 ,  G01R33/07 ,  G01R33/09 ,  H01L43/06 ,  H01L43/08 ,  H01L43/14

CPC classification number: H01L43/04 ,  G01R33/0029 ,  G01R33/0052 ,  G01R33/0076 ,  G01R33/07 ,  G01R33/09 ,  H01L23/3107 ,  H01L23/3142 ,  H01L23/49503 ,  H01L23/49506 ,  H01L23/49541 ,  H01L23/49575 ,  H01L24/17 ,  H01L43/02 ,  H01L43/06 ,  H01L43/065 ,  H01L43/08 ,  H01L43/12 ,  H01L43/14 ,  H01L2224/16 ,  H01L2224/16245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/4826 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Methods and apparatus to provide a magnetic field sensor device including a magnetic sensor element, a die having wafer bumps, wherein the magnetic sensor element is positioned in relation to the die, and conductive leadfingers having respective portions electrically connected to the wafer bumps. In embodiments, the device includes a region about the magnetic sensor element that does not contain electrically conductive material for preventing eddy current flow.

公开(公告)号：US20140084400A1

公开(公告)日：2014-03-27

申请号：US14090037

申请日：2013-11-26

Applicant: Allegro Microsystems, LLC

Inventor： Shaun D. Milano ,  Michael C. Doogue ,  William P. Taylor

IPC: H01L43/02 ,  H01L43/12

CPC classification number: H01L43/04 ,  G01R33/0029 ,  G01R33/0052 ,  G01R33/0076 ,  G01R33/07 ,  G01R33/09 ,  H01L23/3107 ,  H01L23/3142 ,  H01L23/49503 ,  H01L23/49506 ,  H01L23/49541 ,  H01L23/49575 ,  H01L24/17 ,  H01L43/02 ,  H01L43/06 ,  H01L43/065 ,  H01L43/08 ,  H01L43/12 ,  H01L43/14 ,  H01L2224/16 ,  H01L2224/16245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/4826 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Methods and apparatus to provide an integrated circuit package having a conductive leadframe, a non-conductive die paddle mechanically coupled to the leadframe, and a die disposed on the die paddle and electrically connected to the leadframe. With this arrangement, eddy currents are reduced near the magnetic field transducer to reduce interference with magnetic fields.

Abstract translation: 提供集成电路封装的方法和装置，其具有导电引线框架，机械耦合到引线框架的非导电管芯焊盘以及设置在管芯焊盘上并电连接到引线框架的管芯。 通过这种布置，磁场传感器附近的涡流减小，以减少对磁场的干扰。

公开(公告)号：US12210040B2

公开(公告)日：2025-01-28

申请号：US17648310

申请日：2022-01-19

Applicant: Allegro MicroSystems, LLC

Inventor： Shaun D. Milano ,  Bryan Cadugan ,  Michael C. Doogue ,  Alexander Latham ,  William P. Taylor ,  Harianto Wong ,  Sundar Chetlur

IPC: G01R15/14 ,  G01R15/20 ,  G01R19/00

Abstract: Systems and methods described herein are directed towards integrating a shield layer into a current sensor to shield a magnetic field sensing element and associated circuitry in the current sensor from electrical, voltage, or electrical transient noise. In an embodiment, a shield layer may be disposed along at least one surface of a die supporting a magnetic field sensing element. The shield layer may be disposed in various arrangements to shunt noise caused by a parasitic coupling between the magnetic field sensing element and the current carrying conductor away from the magnetic field sensing element.

公开(公告)号：US10908190B2

公开(公告)日：2021-02-02

申请号：US16587284

申请日：2019-09-30

Applicant: Allegro MicroSystems, LLC

Inventor： Wade Bussing ,  Alexander Latham ,  Shaun D. Milano ,  Christian Feucht

IPC: G01R15/20

Abstract: Systems and methods described herein are directed towards differential current sensing a current sensor having two or more magnetic field sensing elements that are oriented to sense a magnetic field generated by a current through an external conductor in the same direction. The current sensor can be positioned such that at least one first magnetic field sensing element is vertically aligned with the external conductor and at least one second magnetic field sensing element is not vertically aligned with the external conductor. The magnetic field sensing elements may be spaced from each to measure a gradient field and can generate a magnetic field signal indicative of a distance between the respective magnetic field sensing element and the current carrying external conductor. A difference between the magnetic field signals can be determined that is indicative of the current through the external conductor.

公开(公告)号：US10761120B2

公开(公告)日：2020-09-01

申请号：US15435725

申请日：2017-02-17

Applicant: Allegro MicroSystems, LLC

Inventor： Christian Feucht ,  Shaun D. Milano

IPC: G01R19/25 ,  G01R15/20 ,  G01R35/00 ,  G01R33/00 ,  G01R33/02

Abstract: Systems and methods are described herein for reducing the effects of magnetic field cross-coupling in a multi-conductor current sensor system. A current sensor system includes one or more current sensors, each positioned proximate to at least one conductor and spaced from at least one other conductor. Each conductor carries a current intended to be measured by a respective current sensor. The current sensors include one or more magnetic field sensing elements to generate a magnetic field signal indicative of a detected magnetic field. A characterization measurement is performed to determine the coupling between each current sensor and the respective current conductor and to determine the coupling between the current sensor and the other ones of the current conductors, by providing a reference current to each of the conductors and measuring the outputs at each of the current sensors. The characterization measurement can be used to generate a coupling matrix.

公开(公告)号：US10753963B2

公开(公告)日：2020-08-25

申请号：US16426215

申请日：2019-05-30

Applicant: Allegro MicroSystems, LLC

Inventor： Shaun D. Milano ,  Shixi Louis Liu

IPC: G01R15/20 ,  H01L43/02 ,  H01L43/04 ,  H01L43/06 ,  H01L43/08 ,  G01R19/00 ,  G01R33/00 ,  G01R33/09 ,  H01L21/48 ,  G01R33/07 ,  H01L23/00 ,  H01L23/495

Abstract: A current sensor integrated circuit includes a lead frame having a primary conductor and at least one secondary lead, a semiconductor die disposed adjacent to the primary conductor, an insulation structure disposed between the primary conductor and the semiconductor die, and a non-conductive insulative material enclosing the semiconductor die, the insulation structure, a first portion of the primary conductor, and a first portion of the at least one secondary lead to form a package. The first portion of the at least one secondary lead (between a first end proximal to the primary conductor and a second end proximal to the second, exposed portion of the at least one secondary lead) has a thickness that is less than a thickness of the second, exposed portion of the least one secondary lead. A distance between the second, exposed portion of the primary conductor and the second, exposed portion of the at least one secondary lead is at least 7.2 mm.

公开(公告)号：US20200025804A1

公开(公告)日：2020-01-23

申请号：US16587284

申请日：2019-09-30

Applicant: Allegro MicroSystems, LLC

Inventor： Wade Bussing ,  Alexander Latham ,  Shaun D. Milano ,  Christian Feucht

IPC: G01R15/20

Abstract: Systems and methods described herein are directed towards differential current sensing a current sensor having two or more magnetic field sensing elements that are oriented to sense a magnetic field generated by a current through an external conductor in the same direction. The current sensor can be positioned such that at least one first magnetic field sensing element is vertically aligned with the external conductor and at least one second magnetic field sensing element is not vertically aligned with the external conductor. The magnetic field sensing elements may be spaced from each to measure a gradient field and can generate a magnetic field signal indicative of a distance between the respective magnetic field sensing element and the current carrying external conductor. A difference between the magnetic field signals can be determined that is indicative of the current through the external conductor.

公开(公告)号：US10352969B2

公开(公告)日：2019-07-16

申请号：US15363285

申请日：2016-11-29

Applicant: Allegro MicroSystems, LLC

Inventor： Shaun D. Milano ,  Bryan Cadugan ,  Michael C. Doogue ,  Alexander Latham ,  William P. Taylor ,  Harianto Wong ,  Sundar Chetlur

IPC: G01R15/14 ,  G01R19/00 ,  G01R15/20

Abstract: Systems and methods described herein are directed towards integrating a shield layer into a current sensor to shield a magnetic field sensing element and associated circuitry in the current sensor from electrical, voltage, or electrical transient noise. In an embodiment, a shield layer may be disposed along at least one surface of a die supporting a magnetic field sensing element. The shield layer may be disposed in various arrangements to shunt noise caused by a parasitic coupling between the magnetic field sensing element and the current carrying conductor away from the magnetic field sensing element.