公开(公告)号：US11004836B2

公开(公告)日：2021-05-11

申请号：US16748413

申请日：2020-01-21

Applicant: Apple Inc.

Inventor： Andreas Bibl ,  Charles R. Griggs

IPC: H01L25/16 ,  H01L33/44 ,  H01L33/08 ,  H01L33/52 ,  H01L33/60 ,  H01L27/02 ,  H01L23/00 ,  H01L25/075 ,  H01L27/12 ,  H01L33/20 ,  H01L33/48 ,  H01L33/06 ,  H01L33/30 ,  H01L33/62 ,  H01L33/00 ,  H01L33/54 ,  H01L33/56

Abstract: Light emitting devices and methods of integrating micro LED devices into light emitting device are described. In an embodiment a light emitting device includes a reflective bank structure within a bank layer, and a conductive line atop the bank layer and elevated above the reflective bank structure. A micro LED device is within the reflective bank structure and a passivation layer is over the bank layer and laterally around the micro LED device within the reflective bank structure. A portion of the micro LED device and a conductive line atop the bank layer protrude above a top surface of the passivation layer.

公开(公告)号：US10964900B2

公开(公告)日：2021-03-30

申请号：US16529670

申请日：2019-08-01

Applicant: Apple Inc.

Inventor： Andreas Bibl ,  Kapil V. Sakariya ,  Charles R. Griggs ,  James Michael Perkins

IPC: H01L51/50 ,  H01L23/00 ,  H01L21/683 ,  G09G3/00 ,  H01L27/15 ,  H01L27/12 ,  G09G3/3208

Abstract: A display panel and method of manufacture are described. In an embodiment, a display substrate includes a pixel area and a non-pixel area. An array of subpixels and corresponding array of bottom electrodes are in the pixel area. An array of micro LED devices are bonded to the array of bottom electrodes. One or more top electrode layers are formed in electrical contact with the array of micro LED devices. In one embodiment a redundant pair of micro LED devices are bonded to the array of bottom electrodes. In one embodiment, the array of micro LED devices are imaged to detect irregularities.

公开(公告)号：US20210028153A1

公开(公告)日：2021-01-28

申请号：US16998917

申请日：2020-08-20

Applicant: Apple Inc.

Inventor： Kapil V. Sakariya ,  Andreas Bibl ,  Hsin-Hua Hu

IPC: H01L25/075 ,  H01L33/60 ,  H01L25/16 ,  H01L33/44 ,  H01L33/62 ,  H01L33/06 ,  H01L33/36

Abstract: Reflective bank structures for light emitting devices are described. The reflective bank structure may include a substrate, an insulating layer on the substrate, and an array of bank openings in the insulating layer with each bank opening including a bottom surface and sidewalls. A reflective layer spans sidewalls of each of the bank openings in the insulating layer.

公开(公告)号：US10734269B1

公开(公告)日：2020-08-04

申请号：US15914595

申请日：2018-03-07

Applicant: Apple Inc.

Inventor： Dariusz Golda ,  James M. Perkins ,  Andreas Bibl ,  Sumant Sood ,  Hyeun-Su Kim

IPC: H01L21/683 ,  H01L23/00 ,  H01L25/075 ,  H01L33/62 ,  H01L21/67 ,  B65G47/92 ,  H01L33/06 ,  H01L33/30 ,  H01L33/28 ,  H01L33/60

Abstract: Metal-to-metal adhesion joints are described as a manner to hold down micro devices to a carrier substrate within the context of a micro device transfer manufacturing process. In accordance with embodiments, the metal-to-metal adhesion joints must be broken in order to pick up the micro devices from a carrier substrate, resulting in micro devices with nubs protruding from bottom contacts of the micro devices. Once integrated, the micro devices are bonded to a receiving substrate, the nubs may be embedded in a metallic joint, or alternatively be diffused within the metallic joint as interstitial metallic material that is embedded within the metallic joint.

公开(公告)号：US20200219863A1

公开(公告)日：2020-07-09

申请号：US16748413

申请日：2020-01-21

Applicant: Apple Inc.

Inventor： Andreas Bibl ,  Charles R. Griggs

IPC: H01L25/16 ,  H01L33/44 ,  H01L33/08 ,  H01L33/52 ,  H01L33/60 ,  H01L27/02 ,  H01L23/00 ,  H01L25/075 ,  H01L27/12 ,  H01L33/20 ,  H01L33/48 ,  H01L33/06 ,  H01L33/30 ,  H01L33/62 ,  H01L33/00 ,  H01L33/54 ,  H01L33/56

Abstract: Light emitting devices and methods of integrating micro LED devices into light emitting device are described. In an embodiment a light emitting device includes a reflective bank structure within a bank layer, and a conductive line atop the bank layer and elevated above the reflective bank structure. A micro LED device is within the reflective bank structure and a passivation layer is over the bank layer and laterally around the micro LED device within the reflective bank structure. A portion of the micro LED device and a conductive line atop the bank layer protrude above a top surface of the passivation layer.

公开(公告)号：US10685940B2

公开(公告)日：2020-06-16

申请号：US16375614

申请日：2019-04-04

Applicant: Apple Inc.

Inventor： Jonathan S. Steckel ,  Jean-Jacques P. Drolet ,  Roland Van Gelder ,  Kelly C. McGroddy ,  Ion Bita ,  James Michael Perkins ,  Andreas Bibl ,  Sajjad A. Khan ,  James E. Pedder ,  Elmar Gehlen

IPC: H01L29/18 ,  H01L33/00 ,  H01L25/075 ,  G02F1/13357 ,  H01L33/60 ,  H01L33/44

Abstract: Display panels and methods of manufacture are described for down converting a peak emission wavelength of a pump LED within a subpixel with a quantum dot layer. In some embodiments, pump LEDs with a peak emission wavelength below 500 nm, such as between 340 nm and 420 nm are used. QD layers in accordance with embodiments can be integrated into a variety of display panel structures including a wavelength conversion cover arrangement, QD patch arrangement, or QD layers patterned on the display substrate.

公开(公告)号：US20200161288A1

公开(公告)日：2020-05-21

申请号：US16688638

申请日：2019-11-19

Applicant: Apple Inc.

Inventor： Andreas Bibl ,  Kapil V. Sakariya ,  Vikram Pavate

IPC: H01L25/16 ,  H01L33/62 ,  H01L33/44 ,  H01L31/16 ,  H01L31/0216 ,  H01L23/538 ,  H01L23/31 ,  H01L23/29 ,  G04G9/10 ,  H01L25/075 ,  G09G3/32 ,  G06F1/16 ,  G06F3/042 ,  G06F3/041

Abstract: A display module and system applications including a display module are described. The display module may include a display substrate including a front surface, a back surface, and a display area on the front surface. A plurality of interconnects extend through the display substrate from the front surface to the back surface. An array of light emitting diodes (LEDs) are in the display area and electrically connected with the plurality of interconnects, and one or more driver circuits are on the back surface of the display substrate. Exemplary system applications include wearable, rollable, and foldable displays.

公开(公告)号：US20200013975A1

公开(公告)日：2020-01-09

申请号：US16529670

申请日：2019-08-01

Applicant: Apple Inc.

Inventor： Andreas Bibl ,  Kapil V. Sakariya ,  Charles R. Griggs ,  James Michael Perkins

IPC: H01L51/50 ,  H01L23/00 ,  H01L21/683 ,  G09G3/00 ,  H01L27/15

Abstract: A display panel and method of manufacture are described. In an embodiment, a display substrate includes a pixel area and a non-pixel area. An array of subpixels and corresponding array of bottom electrodes are in the pixel area. An array of micro LED devices are bonded to the array of bottom electrodes. One or more top electrode layers are formed in electrical contact with the array of micro LED devices. In one embodiment a redundant pair of micro LED devices are bonded to the array of bottom electrodes. In one embodiment, the array of micro LED devices are imaged to detect irregularities.

公开(公告)号：US10510736B2

公开(公告)日：2019-12-17

申请号：US16219896

申请日：2018-12-13

Applicant: Apple Inc.

Inventor： John A. Higginson ,  Andreas Bibl ,  Hsin-Hua Hu

IPC: H01L23/31 ,  H01L25/16 ,  H01L33/44 ,  H01L33/06 ,  H01L33/00 ,  H01L33/42 ,  H01L33/62 ,  H01L25/075 ,  H01L27/12 ,  H01L25/00 ,  H01L33/54 ,  H01L21/56

Abstract: A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.

公开(公告)号：US10438339B1

公开(公告)日：2019-10-08

申请号：US15695953

申请日：2017-09-05

Applicant: Apple Inc.

Inventor： Patrick J. Czarnota ,  Paul Argus Parks ,  Nile A. Light ,  Stephen P. Bathurst ,  John H. Higginson ,  Stephen R. Deming ,  Robert B. Martin ,  Tsan Y. Chan ,  Andreas Bibl

IPC: G06K9/00 ,  G06T7/00

Abstract: An optical verification method and mass transfer system described. In an embodiments, a mass transfer sequence may be accompanied by optical imaging and inspection to detect pick and place errors. The optical imaging and inspection techniques may be performed in-situ.