公开(公告)号：US11908979B2

公开(公告)日：2024-02-20

申请号：US17901831

申请日：2022-09-01

Applicant: Applied Materials, Inc.

Inventor： Yingdong Luo ,  Daihua Zhang ,  Hou T. Ng ,  Sivapackia Ganapathiappan ,  Nag B. Patibandla

IPC: H01L33/50 ,  H01L33/30 ,  H01L27/15

CPC classification number: H01L33/504 ,  H01L27/156 ,  H01L33/30

Abstract: A photocurable composition includes quantum dots, quantum dot precursor materials, a chelating agent, one or more monomers, and a photoinitiator. The quantum dots are selected to emit radiation in a first wavelength band in the visible light range in response to absorption of radiation in a second wavelength band in the UV or visible light range. The second wavelength band is different than the first wavelength band. The quantum dot precursor materials include metal atoms or metal ions corresponding to metal components present in the quantum dots. The chelating agent is configured to chelate the quantum dot precursor materials. The photoinitiator initiates polymerization of the one or more monomers in response to absorption of radiation in the second wavelength band.

公开(公告)号：US11888096B2

公开(公告)日：2024-01-30

申请号：US17380998

申请日：2021-07-20

Applicant: Applied Materials, Inc.

Inventor： Yingdong Luo ,  Sivapackia Ganapathiappan ,  Daihua Zhang ,  Hou T. Ng ,  Nag B. Patibandla

IPC: H01L33/50 ,  H01L27/15 ,  H01L33/56 ,  C09K11/02 ,  C08F22/14 ,  C09D4/06 ,  C09D4/00 ,  C08G75/045 ,  B82Y20/00 ,  B82Y40/00

CPC classification number: H01L33/502 ,  C08F22/14 ,  C08G75/045 ,  C09D4/00 ,  C09D4/06 ,  C09K11/025 ,  H01L27/156 ,  H01L33/56 ,  B82Y20/00 ,  B82Y40/00 ,  C08F2800/20 ,  C08F2810/20

Abstract: A photocurable composition includes a nanomaterial selected to emit radiation in a first wavelength band in the visible light range in response to absorption of radiation in a second wavelength band in the UV or visible light range. The second wavelength band is different than the first wavelength band. The photocurable composition further includes one or more (meth)acrylate monomers, a thiol crosslinker, and a photoinitiator that initiates polymerization of the one or more (meth)acrylate monomers in response to absorption of radiation in the second wavelength band. A light-emitting device includes a plurality of light-emitting diodes and the cured photocurable composition in contact with a surface through which radiation in a first wavelength band in the UV or visible light range is emitted from each of the light-emitting diodes.

公开(公告)号：US11798831B2

公开(公告)日：2023-10-24

申请号：US17735018

申请日：2022-05-02

Applicant: Applied Materials, Inc.

Inventor： Daihua Zhang ,  Hou T. Ng ,  Nag B. Patibandla ,  Sivapackia Ganapathiappan ,  Yingdong Luo ,  Kyuil Cho ,  Han-Wen Chen

IPC: H01L21/68 ,  H01L21/67 ,  H01L21/02

CPC classification number: H01L21/68 ,  H01L21/02288 ,  H01L21/6715

Abstract: A method for printing on a substrate includes printing a support structure by printing a liquid precursor material and curing the liquid precursor material, positioning a substrate within the support structure, printing one or more anchors on the substrate and the support structure by printing and curing the liquid precursor material to secure the substrate to the support structure, and printing one or more device structures on the substrate while anchored by printing and curing the liquid precursor material.

公开(公告)号：US11772229B2

公开(公告)日：2023-10-03

申请号：US16298802

申请日：2019-03-11

Applicant: Applied Materials, Inc.

Inventor： Sivapackia Ganapathiappan ,  Boyi Fu ,  Ashwin Chockalingam ,  Daniel Redfield ,  Rajeev Bajaj ,  Mahendra C. Orilall ,  Hou T. Ng ,  Jason G. Fung ,  Mayu Yamamura

IPC: B24B37/24

CPC classification number: B24B37/24

Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one polymer precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions. Embodiments of the disclosure further provide a polishing pad with polymeric layers that may be interpenetrating polymer networks.

公开(公告)号：US20230256560A1

公开(公告)日：2023-08-17

申请号：US18305264

申请日：2023-04-21

Applicant: Applied Materials, Inc.

Inventor： Uma Sridhar ,  Sivapackia Ganapathiappan ,  Ashwin Murugappan Chockalingam ,  Rajeev Bajaj ,  Daniel Redfield ,  Mayu Felicia Yamamura ,  Yingdong Luo ,  Nag B. Patibandla

IPC: B24B37/24 ,  C09D11/102 ,  C09D11/101 ,  B33Y80/00 ,  B29C64/112 ,  B33Y10/00 ,  B33Y70/00

CPC classification number: B24B37/24 ,  C09D11/102 ,  C09D11/101 ,  B33Y80/00 ,  B29C64/112 ,  B33Y10/00 ,  B33Y70/00 ,  H01L21/30625

Abstract: A method of forming a polishing pad that has a polishing region and a window region, wherein both regions are made of an interpenetrating polymer network formed from a free-radically polymerized material and a cationically polymerized material.

公开(公告)号：US11638979B2

公开(公告)日：2023-05-02

申请号：US16897195

申请日：2020-06-09

Applicant: Applied Materials, Inc

Inventor： Uma Sridhar ,  Sivapackia Ganapathiappan ,  Ashwin Murugappan Chockalingam ,  Rajeev Bajaj ,  Daniel Redfield ,  Mayu Felicia Yamamura ,  Yingdong Luo ,  Nag B. Patibandla

IPC: B24B37/24 ,  C09D11/102 ,  C09D11/101 ,  B33Y80/00 ,  B29C64/112 ,  B33Y10/00 ,  B33Y70/00 ,  H01L21/306 ,  B29K63/00 ,  B29K75/00 ,  B29L31/00

Abstract: A polishing pad for a semiconductor fabrication operation includes a polishing region and a window region, wherein both regions are made of an interpenetrating polymer network formed from a free-radically polymerized material and a cationically polymerized material.

公开(公告)号：US20220399479A1

公开(公告)日：2022-12-15

申请号：US17345970

申请日：2021-06-11

Applicant: Applied Materials, Inc.

Inventor： Lisong Xu ,  Mingwei Zhu ,  Byung Sung Kwak ,  Hyunsung Bang ,  Liang Zhao ,  Hou T. Ng ,  Sivapackia Ganapathiappan ,  Nag Patibandla

IPC: H01L33/44 ,  H01L33/62 ,  H01L25/075 ,  H01L33/50 ,  H01L33/00 ,  H01L21/66 ,  G02B27/01

Abstract: Methods of making high-pixel-density LED structures are described. The methods may include forming a backplane substrate and a LED substrate. The backplane substrate and the LED substrate may be bonded together, and the bonded substrates may include an array of LED pixels. Each of the LED pixels may include a group of isolated subpixels. A quantum dot layer may be formed on at least one of the isolated subpixels in each of the LED pixels. The methods may further include repairing at least one defective LED pixel by forming a replacement quantum dot layer on a quantum-dot-layer-free subpixel in the defective LED pixel. The methods may also include forming a UV barrier layer on the array of LED pixels after the repairing of the at least one defective LED pixel.

公开(公告)号：US20220336246A1

公开(公告)日：2022-10-20

申请号：US17735018

申请日：2022-05-02

Applicant: Applied Materials, Inc.

Inventor： Daihua Zhang ,  Hou T. Ng ,  Nag B. Patibandla ,  Sivapackia Ganapathiappan ,  Yingdong Luo ,  Kyuil Cho ,  Han-Wen Chen

IPC: H01L21/68 ,  H01L21/67 ,  H01L21/02

Abstract: A method for printing on a substrate includes printing a support structure by printing a liquid precursor material and curing the liquid precursor material, positioning a substrate within the support structure, printing one or more anchors on the substrate and the support structure by printing and curing the liquid precursor material to secure the substrate to the support structure, and printing one or more device structures on the substrate while anchored by printing and curing the liquid precursor material.

公开(公告)号：US20220328336A1

公开(公告)日：2022-10-13

申请号：US17842681

申请日：2022-06-16

Applicant: Applied Materials, Inc.

Inventor： Daihua Zhang ,  Hou T. Ng ,  Nag B. Patibandla ,  Sivapackia Ganapathiappan ,  Yingdong Luo ,  Kyuil Cho ,  Han-Wen Chen

IPC: H01L21/68 ,  H01L21/67 ,  H01L21/02

Abstract: Printing on a substrate includes printing a support structure by printing a liquid precursor material and curing the liquid precursor material, printing one or more alignment markers by printing the liquid precursor material outside the support structure and curing the liquid precursor material, positioning a substrate within the support structure, performing a registration of the substrate using the one or more alignment markers, and printing one or more device structures on the substrate while registered by printing and curing the liquid precursor material.

公开(公告)号：US11329003B2

公开(公告)日：2022-05-10

申请号：US16839007

申请日：2020-04-02

Applicant: Applied Materials, Inc.

Inventor： Daihua Zhang ,  Hou T. Ng ,  Nag B. Patibandla ,  Sivapackia Ganapathiappan ,  Yingdong Luo ,  Kyuil Cho ,  Han-Wen Chen

IPC: H01L23/544 ,  H01L21/67 ,  H01L21/02

Abstract: A method of printing structures on a reconstructed wafer includes positioning a plurality of semiconductor dies on a support substrate, anchoring the plurality of semiconductor dies to the support substrate by printing a plurality of anchors that extend across edges of the semiconductor dies onto the support substrate and thus form a reconstructed wafer, and printing one or more device structures on the pluralities of semiconductor dies while anchored on the support substrate. The printing operations include ejecting droplets of a liquid precursor material and curing the liquid precursor material.