公开(公告)号：US12132160B2

公开(公告)日：2024-10-29

申请号：US17615075

申请日：2020-11-04

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Yingwei Liu ,  Zhanfeng Cao ,  Zhiwei Liang ,  Ke Wang ,  Muxin Di ,  Shuang Liang ,  Yankai Gao

IPC: H01L33/62 ,  G09F9/302 ,  H01L25/075 ,  H01L33/00 ,  H01L33/38

CPC classification number: H01L33/62 ,  G09F9/3026 ,  H01L25/0753 ,  H01L33/005 ,  H01L33/387 ,  H01L2933/0016 ,  H01L2933/0066

Abstract: A method of manufacturing a driving backplane for display includes: forming a first conductive pattern layer including first conductive lines on a base; and forming a second conductive pattern layer including electrode groups and second conductive lines on a side of the first conductive pattern layer away from the base. The first conductive lines and the second conductive lines cross and are insulated from each other; an electrode group includes a first electrode and a second electrode electrically connected to a corresponding second conductive line. Orthogonal projections, on the base, of the first electrode and a corresponding first conductive line have an overlapping region, and a portion of the first electrode, whose orthogonal projection on the base is located in the overlapping region, is in contact with a portion of the first conductive line, whose orthogonal projection on the base is located in the overlapping region.

公开(公告)号：US20240088170A1

公开(公告)日：2024-03-14

申请号：US18518526

申请日：2023-11-23

Applicant: BOE Technology Group Co., Ltd.

Inventor： Ke Wang ,  Muxin Di ,  Zhiwei Liang ,  Guoqiang Wang ,  Renquan Gu ,  Xiaoxin Song ,  Xiaoyan Zhu ,  Yingwei Liu ,  Zhanfeng Cao

IPC: H01L27/12

CPC classification number: H01L27/124 ,  H01L27/1251 ,  H01L27/127

Abstract: An array substrate including a display area having a plurality of subpixels is provided. The plurality of subpixels includes a plurality of first subpixels in a display-bonding sub-area and a plurality of second subpixels in a regular display sub-area. The array substrate includes a plurality of thin film transistors on a first side of the base substrate and respectively in the plurality of subpixels. A respective one of the plurality of first subpixels includes a bonding pad on a second side of a base substrate; a lead line electrically connecting a respective one of a plurality of thin film transistors to the bonding pad; and a via extending through the base substrate. The lead line is unexposed in the array substrate. The lead line extends from the first side to the second side of the base substrate through the via, to connect to the bonding pad.

公开(公告)号：US11894394B2

公开(公告)日：2024-02-06

申请号：US17281015

申请日：2020-01-03

Applicant: BOE Technology Group Co., Ltd.

Inventor： Zhanfeng Cao ,  Yingwei Liu ,  Ke Wang ,  Guocai Zhang ,  Jianguo Wang ,  Zhiwei Liang ,  Haixu Li ,  Muxin Di

IPC: H01L27/12 ,  H01L27/15 ,  C25D7/12 ,  C25D17/00

CPC classification number: H01L27/124 ,  C25D7/123 ,  C25D17/007 ,  H01L27/127 ,  H01L27/156

Abstract: An array substrate, a method for preparing the array substrate, and a backlight module are disclosed. Before electroplating a first metal layer on a pattern of a seed layer, the method further includes: forming a pattern of a compensation electrode wire electrically connected with a lead electrode on a side, where the lead electrode is formed, of a base substrate. The compensation electrode wire is at least on a second side of a wiring region, the pattern of the lead electrode is formed at a first side of the wiring region, and the first side and the second side are different sides. In the electroplating process, the lead electrode is connected with a negative pole of a power supply, the compensation electrode wire is electrically connected with the lead electrode, thus an area of an electroplating negative pole generating electric field lines is increased by utilizing the compensation electrode wire.

公开(公告)号：US20230260982A1

公开(公告)日：2023-08-17

申请号：US18137857

申请日：2023-04-21

Applicant: BOE Technology Group Co., Ltd.

Inventor： Zhiwei Liang ,  Wenqian Luo ,  Yingwei Liu ,  Ke Wang ,  Qi Yao ,  Huijuan Wang ,  Haixu Li ,  Zhanfeng Cao ,  Guangcai Yuan ,  Xue Dong ,  Guoqiang Wang ,  Zhijun Lv

IPC: H01L25/16 ,  H01L23/00 ,  H01L27/12

CPC classification number: H01L25/167 ,  H01L24/13 ,  H01L27/124 ,  H01L2224/13016 ,  H01L2224/13083 ,  H01L2224/13124 ,  H01L2224/13147 ,  H01L2224/1319

Abstract: Provided is a display backplate including an array substrate and a plurality of pairs of connection structures on the array substrate, wherein the array substrate includes a plurality of thin-film transistors and a common electrode signal line, wherein at least one of the plurality of thin-film transistors is connected to one of a pair of connection structures and the common electrode signal line is connected to the other of the pair of connection structures; and an area of a first section of the connection structure is negatively correlated with a distance between the first section and a surface of the array substrate, and the first section is parallel to the surface of the array substrate.

公开(公告)号：US11600747B2

公开(公告)日：2023-03-07

申请号：US16959097

申请日：2019-08-16

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Zhiwei Liang ,  Yingwei Liu ,  Han Yue ,  Minghua Xuan ,  Hsuanwei Mai ,  Zhanfeng Cao ,  Ke Wang ,  Huijuan Wang ,  Guangcai Yuan ,  Zhijun Lv ,  Xinhong Lu

IPC: H01L33/38 ,  H01L27/15 ,  H01L33/00 ,  H01L33/62

Abstract: A display backplane includes a base, a plurality of driving electrodes disposed above the base, and a connection structure disposed on at least one of the plurality of driving electrodes. An orthographic projection of the connection structure on the base is within an orthographic projection of a corresponding driving electrode on the base; and the connection structure includes at least one conductive portion disposed at a first included angle with the corresponding driving electrode.

公开(公告)号：US11495718B2

公开(公告)日：2022-11-08

申请号：US17265806

申请日：2020-05-13

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Zhanfeng Cao ,  Yingwei Liu ,  Ke Wang ,  Dongni Liu ,  Minghua Xuan ,  Guangcai Yuan ,  Lei Chen ,  Xue Dong

IPC: H01L33/62 ,  G09G3/00 ,  G09G3/32

Abstract: The present disclosure provides a driving substrate, a method for preparing the same, and a flexible display device. The driving substrate includes: a base substrate; a first driving function layer arranged on a first surface of the base substrate, the first driving function layer including a plurality of driving thin film transistors and a plurality of signal wirings, and at least one of the plurality of signal wirings being of a single-layer structure and having a thickness greater than a threshold; a pad layer arranged on a surface of the first driving function layer away from the base substrate, the pad layer including a plurality of first pads and a plurality of second pads, and each first pad being connected to a first electrode of the corresponding driving thin film transistor and each second pad being connected to a common electrode line in the plurality of signal wirings.

公开(公告)号：US11424232B2

公开(公告)日：2022-08-23

申请号：US16920771

申请日：2020-07-06

Applicant: BOE Technology Group Co., Ltd.

Inventor： Yingwei Liu ,  Ke Wang ,  Zhiwei Liang ,  Muxin Di ,  Zhanfeng Cao ,  Shuang Liang ,  Guangcai Yuan ,  Qi Yao ,  Dongni Liu

IPC: H01L23/538 ,  H01L25/18 ,  H01L23/00 ,  H01L25/00 ,  H01L25/16

Abstract: Provided are a display structure and a preparation method thereof, and a display apparatus. The display structure includes a flexible back plate and a display substrate which are stacked, the flexible back plate including a bonding electrode for bonding to an integrated circuit chip, and the flexible back plate being bent to form a bent portion on which the bonding electrode is located.

公开(公告)号：US11387291B2

公开(公告)日：2022-07-12

申请号：US16605493

申请日：2019-04-28

Applicant: BOE Technology Group Co., Ltd.

Inventor： Shuang Liang ,  Yingwei Liu ,  Zhanfeng Cao ,  Zhiwei Liang ,  Muxin Di

IPC: H01L27/32 ,  H01L41/113

Abstract: Disclosed herein is a photoelectric sensor, display panel and their manufacturing method. The photoelectric sensor may comprise a photodeformable unit and a piezoelectric unit in contact with the photodeformable unit.

公开(公告)号：US11367740B2

公开(公告)日：2022-06-21

申请号：US16084452

申请日：2018-01-08

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Qi Yao ,  Yingwei Liu

IPC: H01L27/12 ,  H01L29/786 ,  H01L29/66 ,  H01L27/32 ,  H01L51/00

Abstract: The present disclosure provides an array substrate, a manufacturing method thereof, a flexible display panel, and a display device, all for achieving a frame-free full-screen flexible display product. The array substrate provided in the present disclosure comprises a flexible base substrate, a thin film transistor on a first surface of the flexible base substrate, and a wiring terminal for transmitting a signal to an electrode of the thin film transistor on a second surface of the flexible base substrate opposite to the first surface. The electrode of the thin film transistor is electrically connected to the wiring terminal through a via hole penetrating the flexible base substrate.

公开(公告)号：US11342480B2

公开(公告)日：2022-05-24

申请号：US16855351

申请日：2020-04-22

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Zhiwei Liang ,  Wenqian Luo ,  Shibo Jiao ,  Feng Wang ,  Yingwei Liu

IPC: H01L33/00 ,  H01L33/62 ,  H01L25/075

Abstract: The present disclosure provides a detection device for Micro-LED and a method manufacturing thereof, and a detection apparatus for Micro-LED, and the detection device for Micro-LED comprises: a substrate, and a first via and a second via penetrating through the substrate; the substrate comprises a first surface and a second surface which are opposite to each other; the first via and the second via are respectively arranged corresponding to a first pole and a second pole of a Micro-LED to be detected, and the detection device for Micro-LED further comprises: a first detection component and a second detection component on the first surface of the substrate.