公开(公告)号：US06241593B1

公开(公告)日：2001-06-05

申请号：US09350950

申请日：1999-07-09

申请人： Hung Chih Chen ,  Steven M. Zuniga ,  Frank Bose

发明人： Hung Chih Chen ,  Steven M. Zuniga ,  Frank Bose

IPC分类号： B24B500

CPC分类号： B24B37/30

摘要： Configurations within the CMP carrier head to maintain a constant contact area through which a downward pressure can be applied and distributed to the substrate for ensuring the force pressing the substrate against the pad will remain steady for each application of pressure, and for repeated application of pressure over time.

摘要翻译： CMP载体头部内的结构以保持恒定的接触面积，向下施加压力并将其分布到基底中以确保将基底压靠在垫上的力将保持稳定，并且为了反复施加压力 随着时间的推移。

公开(公告)号：US6146259A

公开(公告)日：2000-11-14

申请号：US907810

申请日：1997-08-08

申请人： Steven M. Zuniga ,  Hung Chih Chen ,  Manoocher Birang ,  Kapila Wijekoon ,  Sen-Hou Ko

发明人： Steven M. Zuniga ,  Hung Chih Chen ,  Manoocher Birang ,  Kapila Wijekoon ,  Sen-Hou Ko

IPC分类号： B24B37/30 ,  B24B37/32 ,  B24B49/16 ,  H01L21/304 ,  B24B47/02

CPC分类号： B24B37/30 ,  B24B37/32 ,  B24B49/16

摘要： A carrier head for a chemical mechanical polishing apparatus includes a flexible membrane, the lower surface of which provides a substrate-receiving surface. The carrier head may include a projection which contacts an upper surface of the flexible membrane to apply an increased load to a potentially underpolished region of a substrate. Fluid jets may be used for the purpose.

摘要翻译： 用于化学机械抛光装置的载体头包括柔性膜，其下表面提供基板接收表面。 承载头可以包括与柔性膜的上表面接触的突起，以将增加的负载施加到基底的潜在的被抛光的区域。 流体射流可用于此目的。

公开(公告)号：US20200276686A1

公开(公告)日：2020-09-03

申请号：US16799688

申请日：2020-02-24

申请人： Andrew J. Nagengast ,  Steven M. Zuniga

发明人： Andrew J. Nagengast ,  Steven M. Zuniga

IPC分类号： B24B37/32

摘要： A carrier head for chemical mechanical polishing includes a base, an actuator, a substrate mounting surface, and a retainer. The retainer includes an inner section and an outer section connected by a flexure. A bottom of the inner section of the retainer provides an inner portion of a lower surface configured to contact a polishing pad. An inner surface of the inner section extends upwardly from an inner edge of the lower surface to circumferentially surround the substrate mounting surface. The inner section of the retainer is positioned to receive a controllable load from the actuator and is vertically movable relative to the base. A bottom of the outer section of the retainer provides an outer portion of the lower surface. The outer section of the retainer is vertically fixed to the base. The inner section of the retainer is vertically movable relative to the outer section of the retainer.

公开(公告)号：US20200246841A1

公开(公告)日：2020-08-06

申请号：US16777432

申请日：2020-01-30

申请人： Steven M. Zuniga ,  Jay Gurusamy ,  Jagan Rangarajan

发明人： Steven M. Zuniga ,  Jay Gurusamy ,  Jagan Rangarajan

IPC分类号： B08B1/00 ,  H01L21/67 ,  H01L21/02 ,  B08B3/08

摘要： A substrate cleaning device may include a chamber body configured to hold a substrate and a brush assembly. The brush assembly may include a first roller, a second roller, and a belt extending between the first roller and the second roller. At least one of the first roller and the second roller may be movable between a first position where the belt contacts a first surface of a substrate disposed in the chamber body and a second position where the belt is spaced from the first surface. Other substrate cleaning devices and methods of cleaning substrates are disclosed.

公开(公告)号：US20200234995A1

公开(公告)日：2020-07-23

申请号：US16738798

申请日：2020-01-09

申请人： Jagan Rangarajan ,  Edward Golubovsky ,  Shaun Van Der Veen ,  Justin Ho Kuen Wong ,  Steven M. Zuniga

发明人： Jagan Rangarajan ,  Edward Golubovsky ,  Shaun Van Der Veen ,  Justin Ho Kuen Wong ,  Steven M. Zuniga

IPC分类号： H01L21/687 ,  B24B41/06 ,  H01L21/677

摘要： A wafer processing device may include a wafer exchanger including two or more blades, each of the two or more blades may be configured to receive a wafer, the two or more blades may be rotatable about an axis on a single horizontal plane, and the two or more blades may be movable between at least a load cup and a robot access location; wherein the load cup may include a wafer station that is vertically moveable relative a blade located in the load cup and may be configured to remove a wafer from a blade located in the load cup and place a wafer on a blade located in the load cup. Other devices, load cups and methods are also disclosed herein.

公开(公告)号：US08585468B2

公开(公告)日：2013-11-19

申请号：US13305589

申请日：2011-11-28

申请人： Hung Chih Chen ,  Steven M. Zuniga ,  Charles C. Garretson ,  Douglas R. McAllister ,  Jian Lin ,  Stacy Meyer ,  Sidney P. Huey ,  Jeonghoon Oh ,  Trung T. Doan ,  Jeffrey Schmidt ,  Martin S. Wohlert ,  Kerry F. Hughes ,  James C. Wang ,  Danny Cam Toan Lu ,  Romain Beau De Lamenie ,  Venkata R. Balagani ,  Aden Martin Allen ,  Michael Jon Fong

发明人： Hung Chih Chen ,  Steven M. Zuniga ,  Charles C. Garretson ,  Douglas R. McAllister ,  Jian Lin ,  Stacy Meyer ,  Sidney P. Huey ,  Jeonghoon Oh ,  Trung T. Doan ,  Jeffrey Schmidt ,  Martin S. Wohlert ,  Kerry F. Hughes ,  James C. Wang ,  Danny Cam Toan Lu ,  Romain Beau De Lamenie ,  Venkata R. Balagani ,  Aden Martin Allen ,  Michael Jon Fong

IPC分类号： B24B5/00

CPC分类号： B24B37/32 ,  Y10T29/49815

摘要： A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.

公开(公告)号：US08545660B1

公开(公告)日：2013-10-01

申请号：US13424984

申请日：2012-03-20

申请人： Steven M. Zuniga ,  Robert D. Tolles ,  Derek G. Aqui ,  Andrew J. Nagengast ,  Anthony J. Senn ,  Keenan Leon Guerrero

发明人： Steven M. Zuniga ,  Robert D. Tolles ,  Derek G. Aqui ,  Andrew J. Nagengast ,  Anthony J. Senn ,  Keenan Leon Guerrero

IPC分类号： B32B37/00

CPC分类号： B32B37/003 ,  B32B37/10 ,  B32B37/1009 ,  B32B38/004 ,  B32B2309/60 ,  B32B2309/68 ,  B32B2457/14 ,  H01L21/67092 ,  H01L21/67748 ,  H01L21/6875

摘要： A bonding apparatus and method holds first and second bodies peripherally, one above the other, on respective shelves. A lower heat-transfer body is configured to lift the first body from below and press the first and second bodies against an upper heat-transfer body to enable bonding between the first and second bodies.

摘要翻译： 接合装置和方法将第一和第二主体周边地彼此上下放置在相应的搁架上。 下部传热体构造成从下方提升第一体，并且将第一和第二体压靠在上部传热体上，以使第一和第二体之间的粘结。

公开(公告)号：US08469776B2

公开(公告)日：2013-06-25

申请号：US13104711

申请日：2011-05-10

申请人： Steven M. Zuniga ,  Andrew J. Nagengast ,  Jeonghoon Oh

发明人： Steven M. Zuniga ,  Andrew J. Nagengast ,  Jeonghoon Oh

IPC分类号： B24B5/35

CPC分类号： B24B37/30 ,  Y10T428/24174 ,  Y10T428/24182

摘要： A carrier head that has a base assembly, a retaining ring assembly, a carrier ring, and a flexible membrane is described. The flexible membrane has a main portion and an outer annular portion, wherein a junction between the main portion and the outer annular portion comprises a peripheral edge hinge and an annular recess above the hinge along the outer wall of the outer annular portion.

摘要翻译： 描述了具有基座组件，保持环组件，载体环和柔性膜的承载头。 柔性膜具有主要部分和外部环形部分，其中主要部分和外部环形部分之间的接合处包括周边边缘铰链和沿着外部环形部分的外壁的铰链上方的环形凹部。

公开(公告)号：US08360409B2

公开(公告)日：2013-01-29

申请号：US12636328

申请日：2009-12-11

申请人： Steven M. Zuniga ,  Derek G. Aqui ,  Andrew J. Nagengast ,  Keenan Leon Guerrero ,  Harish K. Bolla ,  Aditya Agarwal

发明人： Steven M. Zuniga ,  Derek G. Aqui ,  Andrew J. Nagengast ,  Keenan Leon Guerrero ,  Harish K. Bolla ,  Aditya Agarwal

IPC分类号： B23Q3/00

CPC分类号： H01L21/68728 ,  H01L21/6719 ,  H01L21/68707 ,  H01L21/68764 ,  H01L21/68771

摘要： A system for simultaneously treating multiple workpieces is configured with sites, configured to hold respective workpieces, affixed on a rotatable base. Each site has a shelf accommodating an interior space and may be positioned by base rotation in alignment with a station of fixed location. Each station is equipped with an active component. The active components are movable simultaneously within respective stations into the respective interior spaces of respective aligned sites.

摘要翻译： 用于同时处理多个工件的系统被配置有被固定在可旋转底座上的各个工件的位置。 每个场地具有容纳内部空间的搁架，并且可以通过基座旋转定位成与固定位置的工位对准。 每个车站都配有一个有源组件。 有源部件可以在相应的站内同时移动到各个对准的位置的相应的内部空间中。

公开(公告)号：US20120325395A1

公开(公告)日：2012-12-27

申请号：US13603876

申请日：2012-09-05

申请人： Steven M. Zuniga ,  Thomas H. Osterheld

发明人： Steven M. Zuniga ,  Thomas H. Osterheld

IPC分类号： B32B43/00 ,  B32B37/12

CPC分类号： B24B41/06 ,  B24B37/30 ,  B24B37/32

摘要： A carrier head for a chemical mechanical polishing apparatus includes a retaining ring having a flexible lower portion and a rigid upper portion.

摘要翻译： 用于化学机械抛光装置的承载头包括具有柔性下部和刚性上部的保持环。