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    HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS OF USE THEREOF
    31.
    发明申请
    HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS OF USE THEREOF 审中-公开

    公开(公告)号：US20090315579A1

    公开(公告)日：2009-12-24

    申请号：US12548528

    申请日：2009-08-27

    申请人： Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Maurice Heathcote Norcott ,  Da-Yuan Shih ,  George Frederick Walker

    发明人： Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Maurice Heathcote Norcott ,  Da-Yuan Shih ,  George Frederick Walker

    IPC分类号： G01R1/073

    CPC分类号： G01R1/0735 ,  G01R1/06744 ,  G01R1/0675 ,  G01R1/07307 ,  G01R1/07378 ,  G01R3/00

    摘要： The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires. The elastomer is cured and the mold is removed, leaving an array of wires disposed in the elastomer and in electrical contact with the space transformer The space transformer can have an array of pins which are on the opposite surface of the space transformer opposite to that on which the elongated conductors are bonded. The pins are inserted into a socket on a second space transformer, such as a printed circuit board to form a probe assembly. Alternatively, an interposer electrical connector can be disposed between the first and second space transformer.

    HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS OF USE THEREOF
    33.
    发明申请
    HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS OF USE THEREOF 审中-公开

    公开(公告)号：US20080116912A1

    公开(公告)日：2008-05-22

    申请号：US11929711

    申请日：2007-10-30

    申请人： Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Maurice Heathcote Norcott ,  Da-Yuan Shih ,  George Frederick Walker

    发明人： Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Maurice Heathcote Norcott ,  Da-Yuan Shih ,  George Frederick Walker

    IPC分类号： G01R1/02

    CPC分类号： G01R1/0735 ,  G01R1/06744 ,  G01R1/0675 ,  G01R1/07307 ,  G01R1/07378 ,  G01R3/00

    摘要： The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires. The elastomer is cured and the mold is removed, leaving an array of wires disposed in the elastomer and in electrical contact with the space transformer. The space transformer can have an array of pins which are on the opposite surface of the space transformer opposite to that on which the elongated conductors are bonded. The pins are inserted into a socket on a second space transformer, such as a printed circuit board to form a probe assembly. Alternatively, an interposer electrical connector can be disposed between the first and second space transformer.

    HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS OF USE THEREOF
    35.
    发明申请
    HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS OF USE THEREOF 审中-公开

    公开(公告)号：US20080111570A1

    公开(公告)日：2008-05-15

    申请号：US11929911

    申请日：2007-10-30

    申请人： Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Maurice Heathcote Norcott ,  Da-Yuan Shih ,  George Frederick Walker

    发明人： Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Maurice Heathcote Norcott ,  Da-Yuan Shih ,  George Frederick Walker

    IPC分类号： G01R31/02

    CPC分类号： G01R1/0735 ,  G01R1/06744 ,  G01R1/0675 ,  G01R1/07307 ,  G01R1/07378 ,  G01R3/00

    摘要： The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires. The elastomer is cured and the mold is removed, leaving an array of wires disposed in the elastomer and in electrical contact with the space transformer The space transformer can have an array of pins which are on the opposite surface of the space transformer opposite to that on which the elongated conductors are bonded. The pins are inserted into a socket on a second space transformer, such as a printed circuit board to form a probe assembly. Alternatively, an interposer electrical connector can be disposed between the first and second space transformer.

    High density test probe with rigid surface structure
    39.
    发明授权
    High density test probe with rigid surface structure 失效
    高密度测试探头具有刚性表面结构

    公开(公告)号：US6062879A

    公开(公告)日：2000-05-16

    申请号：US78174

    申请日：1998-05-13

    申请人： Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Maurice Heathcote Norcott ,  Da-Yuan Shih

    发明人： Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Maurice Heathcote Norcott ,  Da-Yuan Shih

    IPC分类号： G01R1/073 ,  H01R13/24 ,  H05K7/10 ,  H01R4/04

    CPC分类号： H01R13/2414 ,  G01R1/07357 ,  H05K7/1061 ,  H01R12/714

    摘要： The present invention is a structure for probing an electronic device. The structure has a layer of elastomeric material having a first side and a second side; a plurality of electrical conductors extending from the first side to the second side; each of the electrical conductors has a first end and a second end, the first end extends to the first side, the second end extends to said second side; a layer of dielectric material disposed on the first side; the first end of the plurality of electrical conductors extends into openings in the layer of dielectric material. More particularly, in the present invention, the second side is disposed in contact with a first surface of a substrate and the second ends of the electrical conductors are electrically connected to first electrical contact locations on the first surface.

    摘要翻译： 本发明是用于探测电子设备的结构。 该结构具有具有第一侧和第二侧的弹性体材料层; 从所述第一侧延伸到所述第二侧的多个电导体; 每个电导体具有第一端和第二端，第一端延伸到第一侧，第二端延伸到所述第二侧; 设置在所述第一侧上的介电材料层; 多个电导体的第一端延伸到电介质材料层中的开口中。 更具体地说，在本发明中，第二面设置成与衬底的第一表面接触，并且电导体的第二端电连接到第一表面上的第一电接触位置。

    High density cantilevered probe for electronic devices
    40.
    发明授权
    High density cantilevered probe for electronic devices 失效
    用于电子设备的高密度悬臂式探头

    公开(公告)号：US5914614A

    公开(公告)日：1999-06-22

    申请号：US946141

    申请日：1997-10-07

    申请人： Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Maurice Heathcote Norcott ,  Da-Yuan Shih

    发明人： Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Maurice Heathcote Norcott ,  Da-Yuan Shih

    IPC分类号： G01R1/067 ,  G01R3/00 ,  H05K3/32 ,  H05K3/40 ,  G01R1/073

    CPC分类号： H05K3/326 ,  G01R1/06727 ,  G01R3/00 ,  G01R1/06744 ,  G01R1/06761 ,  H01L2224/1134 ,  H01L2924/00013 ,  H05K3/4015

    摘要： Probes for electronic devices are described. The probe is formed by ball bonding a plurality of wires to contact locations on a fan out substrate surface. The wires are cut off leaving stubs. A patterned polymer sheet having electrical conductor patterns therein is disposed over the stubs which extend through holes in the sheet. The ends of the wires are flattened to remit the polymer sheet in place. The wire is connected to an electrical conductor on the polymer sheet which is converted to a contact pad on the polymer sheet. A second wire is ball bonded to the pad on the polymer sheet and cut to leave a second stub. The polymer sheet is laser cut so that each second stub is free to move independently of the other second studs. The ends of the second stubs are disposed against contact locations of an electronic device, such as an FC chip, to test the electronic device.

    摘要翻译： 描述电子设备探头。 探针通过将多根线球焊接到扇形基板表面上的接触位置而形成。 电线被切断留下残留物。 其中具有电导体图案的图案化聚合物片材设置在延伸穿过片材中的孔的短截线上。 电线的端部被压扁以将聚合物片材放置在适当位置。 导线连接到聚合物片上的电导体，该电导体转换成聚合物片上的接触垫。 将第二根线球焊接到聚合物片上的垫上并切割以留下第二个短截线。 聚合物片材被激光切割，使得每个第二短截线自由地独立于其它第二螺柱移动。 第二短截线的端部设置在诸如FC芯片的电子设备的接触位置，以测试电子设备。