公开(公告)号：US08531839B2

公开(公告)日：2013-09-10

申请号：US12916434

申请日：2010-10-29

申请人： Madhusudan K. Iyengar ,  Roger R. Schmidt

发明人： Madhusudan K. Iyengar ,  Roger R. Schmidt

IPC分类号： H05K7/20 ,  H01L23/34

CPC分类号： H05K7/20781 ,  H01L2924/0002 ,  H05K7/20645 ,  H05K7/20745 ,  H05K7/20836 ,  H01L2924/00

摘要： Methods of preventing overheating of computer equipment in a cabinet when a supply coolant to a cooler in the cabinet fails. An example embodiment is a data center that includes a plurality of cabinets and at least two coolant supply lines. The cabinets are configured to house computer equipment and the coolant supply lines provide coolant for the cabinets. Moreover, the cabinets are arranged in at least one row of adjacent cabinets such that each row of adjacent cabinets receives coolant from alternating coolant supply lines.

摘要翻译： 当柜内的冷却器供给冷却液时，防止机柜内计算机设备过热的方法失效。 示例性实施例是包括多个机柜和至少两个冷却剂供应管线的数据中心。 机柜被配置为容纳计算机设备，并且冷却剂供应管线为机柜提供冷却剂。 此外，机柜布置在至少一排相邻的机柜中，使得每排相邻机柜从交替的冷却剂供应管路接收冷却剂。

公开(公告)号：US20130192794A1

公开(公告)日：2013-08-01

申请号：US13361929

申请日：2012-01-30

申请人： Timothy J. Chainer ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Bejoy J. Kochuparambil ,  Roger R. Schmidt ,  Mark E. Steinke

发明人： Timothy J. Chainer ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Bejoy J. Kochuparambil ,  Roger R. Schmidt ,  Mark E. Steinke

IPC分类号： F28F9/00

CPC分类号： H05K13/00 ,  H01L21/4882 ,  H01L23/40 ,  H01L23/42 ,  H01L23/44 ,  H01L23/467 ,  H01L23/473 ,  H01L2224/16225 ,  H05K7/20009 ,  H05K7/20254 ,  Y10T29/49117

摘要： Several apparatuses and methods for providing cooling system interchangeability. One apparatus includes a thermally conductive plate thermally coupled to an integrated circuit. The thermally conductive plate is configured to couple interchangeably to a liquid cooling assembly or an air cooling assembly, and the liquid cooling assembly and the air cooling assembly are separate devices.

摘要翻译： 提供冷却系统互换性的几种设备和方法。 一种装置包括热耦合到集成电路的导热板。 导热板被配置为可互换地耦合到液体冷却组件或空气冷却组件，并且液体冷却组件和空气冷却组件是分离的装置。

公开(公告)号：US20130118712A1

公开(公告)日：2013-05-16

申请号：US13296207

申请日：2011-11-14

申请人： Madhusudan K. Iyengar ,  Roger R. Schmidt

发明人： Madhusudan K. Iyengar ,  Roger R. Schmidt

IPC分类号： F28D15/00 ,  B23P15/26

CPC分类号： H05K7/20736 ,  F28D2021/0028 ,  F28F2210/04 ,  H05K7/20618 ,  H05K7/20781 ,  Y10T29/4935

摘要： An apparatus, rear door heat exchanger, system, and method for controlling the redundancy of a cooling system for a server rack. The system includes a cooling system having at least two liquid cooling circuits. The system also includes a rear door heat exchanger connected to the cooling system. The rear door heat exchanger includes two heat exchange coils. Each heat exchange coil is carried by the server rack and configured to interface with a different liquid cooling circuit. The rear door heat exchanger also includes an adapter configured to couple together the two heat exchange coils into one heat exchange unit. The heat exchange unit is configured to interface with one liquid cooling circuit from the cooling system.

摘要翻译： 一种用于控制用于服务器机架的冷却系统的冗余的装置，后门热交换器，系统和方法。 该系统包括具有至少两个液体冷却回路的冷却系统。 该系统还包括连接到冷却系统的后门热交换器。 后门热交换器包括两个热交换线圈。 每个热交换线圈由服务器机架承载，并配置成与不同的液体冷却回路接口。 后门热交换器还包括配置成将两个热交换盘管连接在一起的一个热交换单元中的适配器。 热交换单元配置成与来自冷却系统的一个液体冷却回路相连接。

公开(公告)号：US20120298338A1

公开(公告)日：2012-11-29

申请号：US13115590

申请日：2011-05-25

申请人： Madhusudan K. Iyengar ,  Roger R. Schmidt

发明人： Madhusudan K. Iyengar ,  Roger R. Schmidt

IPC分类号： F28D15/00

CPC分类号： F28F27/00 ,  F28D1/0475 ,  F28F1/32 ,  H05K7/20745 ,  Y10T29/49826

摘要： Methods of preventing overheating of computer equipment in a cabinet when a supply coolant to a cooler in the cabinet fails. An example embodiment is a data center that includes a plurality of cabinets and at least two main coolant supply lines. The cabinets are configured to house computer equipment and the main coolant supply lines provide coolant to the plurality of cabinets. Moreover, each cabinet includes a cooler and each of these coolers includes at least two radiators which receive coolant from different main coolant supply lines.

摘要翻译： 当柜内的冷却器供给冷却液时，防止机柜内计算机设备过热的方法失效。 示例性实施例是包括多个机柜和至少两个主冷却剂供应管线的数据中心。 机柜被配置为容纳计算机设备，并且主冷却剂供应管线为多个机柜提供冷却剂。 此外，每个机柜包括一个冷却器，并且这些冷却器中的每一个包括至少两个从不同主冷却剂供应管路接收冷却剂的散热器。

公开(公告)号：US08245401B2

公开(公告)日：2012-08-21

申请号：US12612905

申请日：2009-11-05

申请人： Bret W. Lehman ,  Roger R. Schmidt ,  Prabjit Singh

发明人： Bret W. Lehman ,  Roger R. Schmidt ,  Prabjit Singh

IPC分类号： B23P15/26

CPC分类号： H05K7/20254 ,  Y10T29/4935 ,  Y10T29/49359 ,  Y10T29/49364 ,  Y10T29/49368 ,  Y10T29/49369 ,  Y10T29/49373 ,  Y10T29/49377 ,  Y10T29/49393

摘要： A cold plate apparatus is provided which includes a tube and a casted heat sink member. The tube includes a first metal and first and second ends, with a heat transfer region disposed between the ends. The heat sink includes a second metal that surrounds the heat transfer region of the tube, with the first and second ends of the tube residing outside of the heat sink. The second metal has a lower melting point than the first, and the metals reacted peritectically such that a metallurgical bond exists between the tube and the heat sink. The metallurgical bond includes an alloy layer that was formed during casting of the heat sink member. A thickness of the alloy layer was minimized during casting of the heat sink member to enhance the heat transfer characteristic of the metallurgical bond.

摘要翻译： 提供一种冷板装置，其包括管和铸造散热构件。 管包括第一金属和第一和第二端，其中传热区域设置在端部之间。 散热器包括围绕管的传热区域的第二金属，管的第一和第二端位于散热器的外部。 第二金属具有比第一金属低的熔点，并且所述金属在周围进行反应，使得管和散热器之间存在冶金结合。 冶金结合包括在散热构件的铸造期间形成的合金层。 在散热构件的铸造期间合金层的厚度最小化，以增强冶金结合的传热特性。

公开(公告)号：US08210741B2

公开(公告)日：2012-07-03

申请号：US12611519

申请日：2009-11-03

申请人： Hendrik F. Hamann ,  Madhusudan K. Iyengar ,  James A. Lacey ,  Roger R. Schmidt

发明人： Hendrik F. Hamann ,  Madhusudan K. Iyengar ,  James A. Lacey ,  Roger R. Schmidt

IPC分类号： G01N25/72 ,  G01K3/00

CPC分类号： H01L23/34 ,  H01L2924/0002 ,  H01L2924/00

摘要： An apparatus determines cooling characteristics of an operational cooling device used for transferring heat from an electronic device. The operational cooling device is thermally coupled to a heat pipe. The heat pipe has an exposed surface for selective application of heat thereon. Heat from a localized heat source is selectively applied to at least one region of the exposed surface. The heat source is preferably capable of being varied both positionally relative to the exposed surface and in heat intensity. A heat shield is preferably positioned around the exposed surface of the heat pipe to isolate the operational cooling device from the heat from the localized heat source. A temperature detector repeatedly measures a temperature distribution across the exposed surface while the cooling device is in a heat transfer mode. The temperature distribution is then used to thermally characterize the operational cooling device.

摘要翻译： 设备确定用于从电子设备传送热量的操作冷却装置的冷却特性。 操作冷却装置热耦合到热管。 热管具有用于选择性地在其上施加热量的暴露表面。 来自局部热源的热量被选择性地施加到暴露表面的至少一个区域。 热源优选能够相对于暴露的表面和热强度在位置上都变化。 优选地，隔热板围绕热管的暴露表面定位，以将操作冷却装置与来自局部热源的热隔离。 当冷却装置处于传热模式时，温度检测器重复测量暴露表面上的温度分布。 然后将温度分布用于热操作冷却装置的特征。

公开(公告)号：US08164897B2

公开(公告)日：2012-04-24

申请号：US12708792

申请日：2010-02-19

申请人： David P. Graybill ,  Madhusudan K Iyengar ,  Jeffrey A. Newcomer ,  Roger R. Schmidt

发明人： David P. Graybill ,  Madhusudan K Iyengar ,  Jeffrey A. Newcomer ,  Roger R. Schmidt

IPC分类号： H05K7/20 ,  F28F7/00

CPC分类号： H05K7/20745 ,  H05K7/20836

摘要： An apparatus is provided for facilitating cooling of an electronics rack of a data center. The apparatus includes: an airflow director mounted to the electronics rack to redirect airflow exhausting from the electronics rack through an airflow return pathway back towards an air inlet side of the rack; an air-to-liquid heat exchanger disposed within the airflow return pathway for cooling redirected airflow before exiting into the data center near the air inlet side of the rack; an air temperature sensor for monitoring air temperature of the redirected airflow; and an automated isolation door associated with the airflow director for automatically blocking airflow exhausting from the air outlet side of the electronics rack from passing through the airflow return pathway back towards the air inlet side of the rack responsive to temperature of the redirected airflow exceeding a defined temperature threshold.

摘要翻译： 提供了一种便于冷却数据中心的电子机架的装置。 该装置包括：气流导向器，其安装到电子机架，以将从电子机架排出的气流重新定向到机架的空气入口侧的气流返回路径; 设置在所述气流返回路径内的空气对液体热交换器，用于在退出到所述齿条的空气入口侧附近的数据中心之前冷却重新导向的气流; 用于监测重定向气流的空气温度的空气温度传感器; 以及与气流导向器相关联的自动隔离门，用于根据重定向气流的温度自动阻止从电子机架的空气出口侧排出的气流通过气流返回通道返回到机架的进气侧， 温度阈值。

公开(公告)号：US08077462B2

公开(公告)日：2011-12-13

申请号：US12552479

申请日：2009-09-02

申请人： Wayne A. Barringer ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  James J. Steffes ,  Gerard V. Weber, Jr.

发明人： Wayne A. Barringer ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  James J. Steffes ,  Gerard V. Weber, Jr.

IPC分类号： H05K7/20

CPC分类号： H05K7/20781 ,  H05K7/2079 ,  H05K7/20818 ,  Y10T29/4935

摘要： A cooling apparatus and method are provided which include an air-to-liquid heat exchanger and system coolant inlet and outlet plenums mounted to an electronics rack door along an edge of the door remote from the edge hingedly mounted to the rack. The plenums are in fluid communication with the heat exchanger and respectively include an inlet and outlet. Coolant supply and return hoses are disposed above the electronics rack and couple the inlet plenum to a coolant supply header and the outlet plenum to a coolant return header. The hoses are sufficiently long and flexible to open or close the door. A stress relief structure is attached to the top of the door and clamps the supply and return hoses in fixed relation to relieve stress on connect couplings at the ends of the hoses to the plenum inlet and outlet during opening or closing of the door.

摘要翻译： 提供了一种冷却装置和方法，其包括空气 - 液体热交换器和系统冷却剂入口和出口集气室，其沿着门的边缘安装到电子机架门，远离铰接安装到机架的边缘。 增压室与热交换器流体连通，分别包括入口和出口。 冷却剂供应和返回软管设置在电子机架上方，并将进气室连接到冷却剂供应集管，并将出口压力室连接到冷却剂返回集管。 软管足够长且灵活以打开或关闭门。 应力消除结构连接到门的顶部，并且固定地夹紧供应和返回软管，以在门的打开或关闭期间将软管端部处的连接联接器上的压力释放到通风口入口和出口。

公开(公告)号：US07967062B2

公开(公告)日：2011-06-28

申请号：US11424642

申请日：2006-06-16

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Keith E. Fogel ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Keith E. Fogel ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC分类号： F28F7/00 ,  H05K7/20

CPC分类号： H01L23/3677 ,  H01L2224/78301 ,  Y10T29/49128 ,  Y10T29/4935 ,  H01L2924/00014

摘要： A composite interface and methods of fabrication are provided for coupling a cooling assembly to an electronic device. The interface includes a plurality of thermally conductive wires formed of a first material having a first thermal conductivity, and a thermal interface material at least partially surrounding the wires. The interface material, which thermally interfaces the cooling assembly to a surface to be cooled of the electronic device, is a second material having a second thermal conductivity, wherein the first thermal conductivity is greater than the second thermal conductivity. At least some wires reside partially over a first region of higher heat flux and extend partially over a second region of lower heat flux, wherein the first and second regions are different regions of the surface to be cooled. These wires function as thermal spreaders facilitating heat transfer from the surface to be cooled to the cooling assembly.

摘要翻译： 提供了复合界面和制造方法，用于将冷却组件连接到电子设备。 界面包括由具有第一导热性的第一材料形成的多个导热丝，以及至少部分地围绕线的热界面材料。 将冷却组件与待冷却的电子设备的表面热接合的界面材料是具有第二导热性的第二材料，其中第一热导率大于第二导热系数。 至少一些线部分地位于较高热通量的第一区域上，并部分地延伸在较低热通量的第二区域上，其中第一和第二区域是待冷却表面的不同区域。 这些电线作为热扩散器起促进从待冷却表面到冷却组件的热传递。

公开(公告)号：US07787248B2

公开(公告)日：2010-08-31

申请号：US11426423

申请日：2006-06-26

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC分类号： H05K7/20 ,  F28F7/00 ,  H01B9/06 ,  F25D23/12 ,  B05B7/06

CPC分类号： H01L23/4735 ,  H01L23/427 ,  H01L2924/0002 ,  Y10S165/908 ,  Y10T29/49002 ,  H01L2924/00

摘要： A multi-fluid cooling system and methods of fabrication thereof are provided for removing heat from one or more electronic devices. The cooling system includes a multi-fluid manifold structure with at least one first fluid inlet orifice and at least one second fluid inlet orifice for concurrently, separately injecting a first fluid and a second fluid onto a surface to be cooled when the cooling system is employed to cool one or more electronic devices, wherein the first fluid and the second fluid are immiscible, and the first fluid has a lower boiling point temperature than the second fluid. When the cooling system is employed to cool the one or more electronic devices and the first fluid boils, evolving first fluid vapor condenses in situ by direct contact with the second fluid of higher boiling point temperature.

摘要翻译： 提供多流体冷却系统及其制造方法，用于从一个或多个电子设备去除热量。 冷却系统包括具有至少一个第一流体入口孔口和至少一个第二流体入口孔口的多流体歧管结构，用于在采用冷却系统时同时单独地将第一流体和第二流体注入待冷却的表面上 以冷却一个或多个电子设备，其中所述第一流体和所述第二流体是不混溶的，并且所述第一流体具有比所述第二流体低的沸点温度。 当冷却系统用于冷却一个或多个电子装置和第一流体沸腾时，放出的第一流体蒸汽通过与较高沸点温度的第二流体直接接触而原位冷凝。