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公开(公告)号:US20110115512A1
公开(公告)日:2011-05-19
申请号:US11180247
申请日:2005-07-12
申请人: Charles A. Miller
发明人: Charles A. Miller
CPC分类号: G01R1/073 , G01R1/06766 , G01R1/06772
摘要: Described herein is a probe card assembly providing signal paths for conveying high frequency signals between bond pads of an integrated circuit (IC) and an IC tester. The frequency response of the probe card assembly is optimized by appropriately distributing, adjusting and impedance matching resistive, capacitive and inductive impedance values along the signal paths so that the interconnect system behaves as an appropriately tuned Butterworth or Chebyshev filter.
摘要翻译: 这里描述的是提供用于在集成电路(IC)和IC测试器的接合焊盘之间传送高频信号的信号路径的探针卡组件。 通过沿着信号路径适当地分布,调整和阻抗匹配电阻,电容和电感阻抗值来优化探针卡组件的频率响应,使得互连系统作为适当调节的巴特沃斯或切比雪夫滤波器。
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公开(公告)号:US07928750B2
公开(公告)日:2011-04-19
申请号:US12336111
申请日:2008-12-16
申请人: Charles A. Miller
发明人: Charles A. Miller
IPC分类号: G01R31/28 , G01R31/303
CPC分类号: G01R1/0491 , G01R1/07 , G01R1/07378 , G01R31/3025
摘要: An interface device receives test data from a tester. A signal representing the test data is transmitted to a device under test through electromagnetically coupled structures on the interface device and the device under test. The device under test processes the test data and generates response data. A signal representing the response data is transmitted to the interface device through electromagnetically coupled structures on the device under test and the interface device.
摘要翻译: 接口设备从测试器接收测试数据。 表示测试数据的信号通过接口设备和被测设备上的电磁耦合结构发送到被测设备。 被测设备处理测试数据并产生响应数据。 表示响应数据的信号通过被测设备和接口设备上的电磁耦合结构传送到接口设备。
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公开(公告)号:US07821255B2
公开(公告)日:2010-10-26
申请号:US12485677
申请日:2009-06-16
IPC分类号: G01R31/02
CPC分类号: G01R1/0491 , G01R1/073 , G01R31/3025
摘要: A test system for testing electronic devices can include a plurality of testers and a test station. The test station can include probes to contact the devices and the tester can control testing. Test data can be received by the test station from the testers using wireless communications links.
摘要翻译: 用于测试电子设备的测试系统可以包括多个测试器和测试台。 测试站可以包括与设备接触的探头,测试仪可以控制测试。 测试台可以使用无线通信链路从测试人员接收测试数据。
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34.
公开(公告)号:US07714603B2
公开(公告)日:2010-05-11
申请号:US11779188
申请日:2007-07-17
CPC分类号: G06F1/26 , G01R31/2851 , G01R31/31721 , G01R31/31905 , G01R31/31924
摘要: A main power source supplies current through path impedance to a power terminal of an integrated circuit device under test (DUT). The DUT's demand for current at the power input terminal temporarily increases following edges of a clock signal applied to the DUT during a test as transistors within the IC switch in response to the clock signal edges. To limit variation (noise) in voltage at the power input terminal, an auxiliary power supply supplies an additional current pulse to the power input terminal to meet the increased demand during each cycle of the clock signal. The magnitude of the current pulse is a function of a predicted increase in current demand during that clock cycle, and of the magnitude of an adaption signal controlled by a feedback circuit provided to limit variation in voltage developed at the DUT's power input terminal.
摘要翻译: 主电源将电流通过路径阻抗提供给被测集成电路器件(DUT)的电源端子。 在测试期间,DUT对电源输入端的电流需求暂时增加了在测试期间施加到DUT的时钟信号的随后边缘,作为IC开关中的晶体管响应于时钟信号的边缘。 为了限制电源输入端子的电压变化(噪声),辅助电源为电源输入端子提供额外的电流脉冲,以满足在时钟信号的每个周期期间增加的需求。 电流脉冲的大小是在该时钟周期期间电流需求的预测增加以及由反馈电路控制的适配信号的大小的函数,以限制在DUT的功率输入端产生的电压变化。
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公开(公告)号:US07694246B2
公开(公告)日:2010-04-06
申请号:US10177367
申请日:2002-06-19
IPC分类号: G06F17/50
CPC分类号: G11C29/56 , G01R31/2831 , G01R31/2886 , G01R31/31718 , G11C29/006 , G11C29/56016
摘要: A semiconductor wafer is cut to singulate integrated circuit dice formed on the wafer. A die pick machine then positions and orients the singulated dice on a carrier base such that signal, power and ground pads formed on the surface of each die reside at predetermined positions relative to landmarks on the carrier base the die pick machine optically identifies. With the dice temporarily held in place on the carrier base, they are subjected to a series of testing and other processing steps. Since each die's signal pads reside in predetermined locations, they can be accessed by appropriately arranged probes providing test equipment with signal access to the pads during tests. After each test, a die pick machine may replace any die that fails the test with another die, thereby improving efficiency of subsequent testing and other processing resources.
摘要翻译: 切割半导体晶片以对形成在晶片上的集成电路芯片进行分割。 然后,骰子拾取机器将分离的骰子定位和定位在载体基座上,使得形成在每个模具表面上的信号,功率和接地垫相对于骰子拾取机器光学识别的载体基座上的标志位于预定位置。 将骰子临时固定在承运人基地上,对其进行一系列测试和其他处理步骤。 由于每个管芯的信号焊盘都位于预定位置,所以它们可以通过适当布置的探头进行访问,从而在测试期间为测试设备提供对焊盘的信号访问。 在每次测试之后,模具拾取机器可以用另一个模具代替未测试的任何模具,从而提高后续测试和其他处理资源的效率。
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公开(公告)号:US07683738B2
公开(公告)日:2010-03-23
申请号:US11773011
申请日:2007-07-03
申请人: Charles A. Miller
发明人: Charles A. Miller
IPC分类号: H01P9/00
CPC分类号: H01P9/00 , G01R31/2822
摘要: A transmission line includes a signal conductor and at least one varactor diode capacitively coupled to the signal conductor. The transmission line's signal path delay is a function of its shunt capacitance, and the varactor's capacitance forms a part of the transmission line's shunt capacitance. The transmission line's signal path delay is adjusted by adjusting a control voltage across the varactor diode thereby to adjust the varactor diode's capacitance.
摘要翻译: 传输线包括电容耦合到信号导体的信号导体和至少一个变容二极管。 传输线的信号路径延迟是其分流电容的函数,变容二极管的电容构成传输线分流电容的一部分。 通过调整变容二极管两端的控制电压来调整传输线的信号路径延迟,从而调整变容二极管的电容。
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公开(公告)号:US07550842B2
公开(公告)日:2009-06-23
申请号:US10317661
申请日:2002-12-12
申请人: Igor Y. Khandros , Benjamin N. Eldridge , Charles A. Miller , A. Nicholas Sporck , Gary W. Grube , Gaetan L. Mathieu
发明人: Igor Y. Khandros , Benjamin N. Eldridge , Charles A. Miller , A. Nicholas Sporck , Gary W. Grube , Gaetan L. Mathieu
IPC分类号: H01L23/34
CPC分类号: H01L23/13 , H01L23/4951 , H01L23/5386 , H01L23/5387 , H01L24/48 , H01L24/49 , H01L24/50 , H01L25/0655 , H01L2224/0401 , H01L2224/05554 , H01L2224/06136 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48137 , H01L2224/48139 , H01L2224/4824 , H01L2224/49 , H01L2224/73215 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01014 , H01L2924/01015 , H01L2924/0105 , H01L2924/014 , H01L2924/10161 , H01L2924/14 , H01L2924/15192 , H01L2924/181 , H01L2924/19043 , H01L2924/19107 , H01L2924/3011 , H01L2924/3025 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599 , H01L2924/00
摘要: In an integrated circuit assembly, know good die (KGD) are assembled on a substrate. Interconnect elements electrically connect pads on a die attached to the substrate to traces or other electrical conductors on the substrate or to pads on another die attached to the substrate. The substrate may have one or more openings, exposing pads of the die. The assembly may comprise one or more dice.
摘要翻译: 在集成电路组件中,将好的芯片(KGD)组装在基板上。 互连元件将附接到衬底的芯片上的焊盘电连接到衬底上的迹线或其它电导体或连接到衬底的另一芯片上的焊盘。 衬底可以具有一个或多个开口,暴露管芯的焊盘。 组件可以包括一个或多个骰子。
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公开(公告)号:US07466157B2
公开(公告)日:2008-12-16
申请号:US10772970
申请日:2004-02-05
申请人: Charles A. Miller
发明人: Charles A. Miller
IPC分类号: G01R31/28 , G01R31/303
CPC分类号: G01R1/0491 , G01R1/07 , G01R1/07378 , G01R31/3025
摘要: An interface device receives test data from a tester. A signal representing the test data is transmitted to a device under test through electromagnetically coupled structures on the interface device and the device under test. The device under test processes the test data and generates response data. A signal representing the response data is transmitted to the interface device through electromagnetically coupled structures on the device under test and the interface device.
摘要翻译: 接口设备从测试器接收测试数据。 表示测试数据的信号通过接口设备和被测设备上的电磁耦合结构发送到被测设备。 被测设备处理测试数据并产生响应数据。 表示响应数据的信号通过被测设备和接口设备上的电磁耦合结构传送到接口设备。
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公开(公告)号:US07443181B2
公开(公告)日:2008-10-28
申请号:US11758525
申请日:2007-06-05
申请人: Charles A. Miller
发明人: Charles A. Miller
IPC分类号: G01R31/02
CPC分类号: G01R31/2889 , G01R1/07314 , G01R1/07378 , G01R31/31905 , Y10T29/49117
摘要: A probe system for providing signal paths between an integrated circuit (IC) tester and input/output, power and ground pads on the surfaces of ICs to be tested includes a probe board assembly, a flex cable and a set of probes arranged to contact the IC's I/O pads. The probe board assembly includes one or more rigid substrate layers with traces and vias formed on or within the substrate layers providing relatively low bandwidth signal paths linking the tester to probes accessing some of the IC's pads. The flex cable provides relatively high bandwidth signal paths linking the tester to probes accessing others of the IC's pads.
摘要翻译: 用于在集成电路(IC)测试器和要测试的IC的表面上的输入/输出,电源和接地焊盘之间提供信号路径的探针系统包括探针板组件,柔性电缆和一组探针, IC的I / O焊盘。 探针板组件包括一个或多个刚性衬底层,其具有形成在衬底层上或衬底层内的迹线和通孔,其提供将测试器连接到访问IC的一些衬垫的探针的相对低带宽的信号路径。 柔性电缆提供相对高带宽的信号路径,将测试仪连接到访问IC其他焊盘的探针。
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40.
公开(公告)号:US07342405B2
公开(公告)日:2008-03-11
申请号:US10062999
申请日:2002-01-30
IPC分类号: G01R31/26
CPC分类号: G01R31/31721 , G01R31/2851 , G01R31/31905 , G01R31/31924 , G06F1/26
摘要: A power supply provides power to a power terminal of an integrated circuit device under test (DUT). The DUT's demand for current at the power input terminal may temporarily increase due, for example, to state changes in the DUT. To limit variation (noise) in voltage at the power input terminal, a supplemental current is supplied to the power input terminal.
摘要翻译: 电源为被测集成电路设备(DUT)的电源端子供电。 DUT在电源输入端子上对电流的需求可能由于例如DUT的状态变化而暂时增加。 为了限制电源输入端子电压的变化(噪声),补充电流被提供给电源输入端子。
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