Abstract:
The invention provides machine vision methods and apparatus for determining a calibration relationship between the imaging reference frame of an image acquisition device (e.g., a camera) and the motion reference frame of a moveable object (e.g., a motion stage) by positioning the object so that a fiducial thereon (e.g., a calibration mark) lies at a first fiducial position in the field of view and recording the corresponding position of the object in the motion reference frame. The object is then repositioned so that the fiducial moves to a second fiducial position in the field of view. Again, the corresponding position of the object in the motion reference frame is recorded. Likewise, the object is moved to a third fiducial position in the field of view, and its corresponding position in the motion reference frame is recorded. A calibration relationship between the motion reference frame of the object and the imaging reference frame of the camera as a function of the first, second and third fiducial positions and as a function of the first, second and third object positions.
Abstract:
The invention automatically inspects the bond of a wire to a contact pad on a semiconductor chip. The apparatus includes a movable platform for holding semiconductor chips situated in lead frames; a video camera for sensing images; illumination means for illuminating a chip in a lead frame; an image processor to digitize and analyze the images; a bonding mechanism; and a host controller electronically connected to bonding mechanism, movable platform, video camera, and image processor. Image processor locates a bond on a pad in a digitized image and provides a first nominal center of ball bond image. The invention aligns the center of a polar coordinate transform image having one or more segments with the nominal center of ball bond image and evaluates ball bond image using the polar coordinate transform image to create a polar projection histogram array and store it. An edge filter is applied to histogram array to detect peaks and store their number and values. Polar coordinate transform image is aligned with a next nominal ball center location until a predetermined number of potential ball center locations is exhausted. The maximum peak in the list of stored peaks is selected as the radius of bond from which the size and position of bond is computed and reported to host controller for further action.
Abstract:
A burned chrome-containing refractory and method which provides a refractory having less than 5 ppm total soluble chromium. Such product is obtained by adding to the starting mix less than 10 wt. % (often less than 3 wt. %) zirconia, silica, zircon, or molybdic oxide either individually or in combination.
Abstract:
A rebonded, fused brick resulting from burning a mix consisting essentially of a fused magnesite chrome grain, a fused chrome-magnesite grain or mixtures thereof, and a chrome ore having a Cr.sub.2 O.sub.3 /(Al.sub.2 O.sub.3 +Fe.sub.2 O.sub.3) ratio of at least about 1.15, a maximum silica content of about 3.85, and an Fe.sub.2 O.sub.3 content of less than about 25% by weight.
Abstract translation:由熔融的菱镁矿晶粒,熔融铬 - 菱镁矿晶粒或其混合物组成的混合物和Cr 2 O 3 /(Al 2 O 3 + Fe 2 O 3)比率至少约为1.15的铬矿, 最大二氧化硅含量约3.85,Fe2O3含量小于约25重量%。
Abstract:
A mix for forming a carbon-bonded refractory shape comprising from about 70 to 92 wt. % of a high purity magnesite and about 8 to 30 wt. % of a high purity graphite, and for each 100 wt. % of said magnesite and graphite, from about 1.5 to 6 wt. % of a carbon-containing bonding agent; said graphite containing at least about 98% carbon and having at least about 75% by weight -65 mesh or finer particles and said magnesite containing at least about 98% MgO, and containing less than about 0.03% boron oxide, less than about 0.3% silica, and having a CaO/SiO.sub.2 weight ratio above about 2, and the resultant carbon-bonded refractory shape and liner for basic oxygen furnaces made from such shapes and the method of increasing the life of liners for basic oxygen furnaces.
Abstract:
A refractory brick made from a size graded batch comprising 20-30 weight percent magnesite containing less than 0.8 weight percent silica, and the balance a chrome ore. The chrome ore includes oxides of chromium, aluminum and iron wherein the ratio between the oxides of chromium and the oxides of aluminum and iron is greater than 2 to 1. The silica content of the chrome ore is less than 2.7 weight percent, the iron oxide content is less than 17 weight percent, and the chrome ore to magnesite ratio is between 2.33 to 4 to 1.
Abstract:
Carbonaceous bonded refractory shapes in which the predominant refractory aggregate is andalusite, being characterized by the absence of substantial shrinkage after coking at 2000.degree. F.
Abstract:
A method and apparatus for assessing at least one of motion linearity of a motion stage, stage motion straightness of a motion stage, image capture repeatability of a motion stage and camera and accuracy of a calibration plate used to assess motion stage characteristics, the method including using a line scan camera to generate two dimensional images of a calibration plate having a plurality imageable features thereon, examining the images to identify actual coordinates of the imageable features and using the actual coordinates to assess linearity, straightness, repeatability and/or plate accuracy.
Abstract:
An image of a semiconductor interconnection pad is analyzed to determine a geometric description of the zone regions of a multiple zone semiconductor interconnection pad. Edge detection machine vision tools are used to extract features in the image. The extracted features are analyzed to derive geometric descriptions of the zone regions of the pad, that are applied in semiconductor device inspection, fabrication, and assembly operations.
Abstract:
A vision system is provided to determine a positional relationship between a semiconductor wafer on a platen and an element on a processing machine, such as a printing screen, on a remote side of the semiconductor wafer from the platen. A source directs ultraviolet light through an aperture in the platen to illuminate the semiconductor wafer and cast a shadow onto the element adjacent an edge of the semiconductor wafer. A video camera produces an image using light received from the platen aperture, wherein some of that received light was reflected by the wafer. The edge of the semiconductor wafer in the image is well defined by a dark/light transition.