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31.发明授权Conductive pad with ion exchange membrane for electrochemical mechanical polishing 失效带离子交换膜的导电垫用于电化学机械抛光公开(公告)号：US07344432B2
公开(公告)日：2008-03-18
申请号：US11555145
申请日：2006-10-31
申请人： Liang-Yun Chen , Yuchun Wang , Yan Wang , Alain Duboust , Daniel A. Carl , Ralph Wadensweiler , Manoocher Birang , Paul D. Butterfield , Rashid A. Mavliev , Stan D. Tsai , You Wang , Jie Diao , Renhe Jia , Lakshmanan Karuppiah , Robert Ewald
发明人： Liang-Yun Chen , Yuchun Wang , Yan Wang , Alain Duboust , Daniel A. Carl , Ralph Wadensweiler , Manoocher Birang , Paul D. Butterfield , Rashid A. Mavliev , Stan D. Tsai , You Wang , Jie Diao , Renhe Jia , Lakshmanan Karuppiah , Robert Ewald
CPC分类号： B24B37/046 , B24B27/0023 , B24B37/24 , B24B37/26 , B24D3/34 , B82Y30/00
摘要： An article of manufacture and apparatus are provided for processing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive polishing surface. An electrode is disposed below the polishing surface having a dielectric material therebetween. A plurality of apertures may be formed in the polishing surface and the dielectric material to at least partially expose the electrode to the polishing surface. A membrane may be disposed between the electrode and the polishing surface that is permeable to ions and current to promote continuity between the electrode and the polishing surface.
摘要翻译： 提供了一种用于处理基板表面的制造和设备。 在一个方面，提供了一种用于抛光衬底的制品，所述衬底包括具有至少部分导电的抛光表面的主体的抛光制品。 电极设置在其间具有介电材料的抛光表面下方。 可以在抛光表面和电介质材料中形成多个孔，以至少部分地将电极暴露于抛光表面。 可以在电极和抛光表面之间设置膜，其可透过离子和电流，以促进电极和抛光表面之间的连续性。
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公开(公告)号：US06841057B2
公开(公告)日：2005-01-11
申请号：US10098796
申请日：2002-03-13
申请人： Ralph Wadensweiler , Alain Duboust , Liang-Yuh Chen , Manoocher Birang , Ratson Morad , Paul D. Butterfield
发明人： Ralph Wadensweiler , Alain Duboust , Liang-Yuh Chen , Manoocher Birang , Ratson Morad , Paul D. Butterfield
摘要： A method and apparatus are provided for polishing a substrate surface. In one aspect, an apparatus for polishing a substrate includes a conductive polishing pad and an electrode having a membrane disposed therebetween. The membrane is orientated relative the conductive pad in a manner that facilitates removal of entrained gas from electrolyte flowing towards the conductive pad. The apparatus may be part of an electro-chemical polishing station that may optionally be part of a system that includes chemical mechanical polishing stations.
摘要翻译： 提供了一种用于抛光衬底表面的方法和装置。 一方面，用于抛光衬底的装置包括导电抛光垫和在其间设置有膜的电极。 膜以相对于导电垫的方向定向，以便于从电解液中流出的夹带气体去除导电垫。 该设备可以是电化学抛光站的一部分，其可以可选地是包括化学机械抛光站的系统的一部分。
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公开(公告)号：US07160432B2
公开(公告)日：2007-01-09
申请号：US10608404
申请日：2003-06-26
申请人： Feng Q. Liu , Liang-Yuh Chen , Stan D. Tsai , Alain Duboust , Siew S. Neo , Yongqi Hu , Yan Wang , Paul D. Butterfield
发明人： Feng Q. Liu , Liang-Yuh Chen , Stan D. Tsai , Alain Duboust , Siew S. Neo , Yongqi Hu , Yan Wang , Paul D. Butterfield
IPC分类号： B23H5/08
CPC分类号： B23H3/08 , B23H5/08 , B24B37/0056 , B24B37/044 , B24B37/046 , C09G1/04 , C25F3/02 , H01L21/3212 , H01L21/32125 , H01L21/32134 , H01L21/7684
摘要： Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a method is provided for processing a substrate to remove conductive material disposed over narrow feature definitions formed in a substrate at a higher removal rate than conductive material disposed over wide feature definitions formed in a substrate by an electrochemical mechanical polishing technique. The electrochemical mechanical polishing technique may include a polishing composition comprising an acid based electrolyte system, one or more chelating agents, one or more corrosion inhibitors, one or more inorganic or organic acid salts, one or more pH adjusting agents to provide a pH between about 2 and about 10, and a solvent.
摘要翻译： 提供了抛光组合物和从衬底表面去除导电材料的方法。 在一个方面，提供了一种处理衬底以除去布置在形成于衬底中的窄特征定义之上的导电材料的方法，该导电材料以比通过电化学机械抛光技术在衬底中形成的宽特征定义上布置的导电材料更高的去除速率。 电化学机械抛光技术可以包括抛光组合物，其包含酸性电解质体系，一种或多种螯合剂，一种或多种腐蚀抑制剂，一种或多种无机或有机酸盐，一种或多种pH调节剂，以提供约 2和约10，和溶剂。
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公开(公告)号：US06988942B2
公开(公告)日：2006-01-24
申请号：US10894756
申请日：2004-07-20
申请人： Liang-Yuh Chen , Yuchun Wang , Yan Wang , Alain Duboust , Daniel A. Carl , Ralph Wadensweiler , Manoocher Birang , Paul D. Butterfield , Rashid Mavliev , Stan D. Tsai
发明人： Liang-Yuh Chen , Yuchun Wang , Yan Wang , Alain Duboust , Daniel A. Carl , Ralph Wadensweiler , Manoocher Birang , Paul D. Butterfield , Rashid Mavliev , Stan D. Tsai
IPC分类号： B24D11/00
CPC分类号： H01L21/32125 , B23H5/08 , B24B37/22 , B24B37/24 , B24B37/26 , B24B53/017 , B24B57/02 , B82Y30/00 , Y10T428/24273 , Y10T428/24355 , Y10T428/24628 , Y10T428/24917
摘要： An article of manufacture and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive surface adapted to polish the substrate and a mounting surface. A plurality of perforations may be formed in the polishing article for flow of material therethrough. In another aspect, a polishing article for polishing a substrate includes a body having a polishing surface and a conductive element disposed therein. The conductive element may have a contact surface that extends beyond a plane defined by the polishing surface. The polishing surface may have one or more pockets formed therein. The conductive element may be disposed in each of the polishing pockets.
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公开(公告)号：US06977036B2
公开(公告)日：2005-12-20
申请号：US10837955
申请日：2004-05-03
申请人： Ralph Wadensweiler , Alain Duboust , Liang-Yuh Chen , Manoocher Birang , Ratson Morad , Paul D. Butterfield
发明人： Ralph Wadensweiler , Alain Duboust , Liang-Yuh Chen , Manoocher Birang , Ratson Morad , Paul D. Butterfield
摘要： A method and apparatus are provided for polishing a substrate surface. In one aspect, an apparatus for polishing a substrate includes a conductive polishing pad and an electrode having a membrane disposed therebetween. The membrane is orientated relative the conductive pad in a manner that facilitates removal of entrained gas from electrolyte flowing towards the conductive pad. The apparatus may be part of an electro-chemical polishing station that may optionally be part of a system that includes chemical mechanical polishing stations.
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公开(公告)号：US07040964B2
公开(公告)日：2006-05-09
申请号：US10262164
申请日：2002-10-01
IPC分类号： B24B1/00
CPC分类号： B24B37/26 , B24B37/20 , H01L21/30625 , Y10S451/921
摘要： A polishing apparatus that employs a polishing media retention arrangement to prevent slippage or wrinkles in the polishing media during polishing. The polishing media is drawn against a support surface by a vacuum applied between the polishing media and the support surface. Also, a porous layer may be placed between the polishing media and the support surface to form dimples in the polishing media upon the application of vacuum. An alternative arrangement draws the polishing media against a carrier and the substrate to be polished.
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公开(公告)号：US06645050B1
公开(公告)日：2003-11-11
申请号：US09718050
申请日：2000-11-20
IPC分类号： B24B100
CPC分类号： B24B37/32 , B24B41/04 , H01L21/30625
摘要： Generally, a method and apparatus for retaining a substrate is provided. In one embodiment, a carrier for retaining a substrate comprises a carrier plate having a lower surface, at least one first fluid outlet and a second fluid outlet. The first fluid outlet is fluidly coupled to the lower surface of the carrier plate. The second fluid outlet is fluidly coupled to the lower surface of the carrier plate. A first fluid circuit is coupled to the first fluid outlet and is adapted to flow a fluid forms a fluidic layer between the carrier plate and the substrate. A second fluid circuit is coupled to the second fluid outlet and is separate from the first fluid circuit.
摘要翻译： 通常，提供了用于保持基板的方法和装置。 在一个实施例中，用于保持衬底的载体包括具有下表面的载体板，至少一个第一流体出口和第二流体出口。 第一流体出口流体地联接到承载板的下表面。 第二流体出口流体地联接到承载板的下表面。 第一流体回路耦合到第一流体出口并且适于使流体流动在载体板和基底之间形成流体层。 第二流体回路耦合到第二流体出口并且与第一流体回路分离。
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公开(公告)号：US20090036032A1
公开(公告)日：2009-02-05
申请号：US12248414
申请日：2008-10-09
申请人： Yongqi Hu , Paul D. Butterfield , Junzi Zhao , Stan D. Tsai , Feng Q. Liu
发明人： Yongqi Hu , Paul D. Butterfield , Junzi Zhao , Stan D. Tsai , Feng Q. Liu
IPC分类号： B24B1/00
CPC分类号： B23H5/08 , B24B37/015 , B24B37/046 , B24B37/12 , B24B49/14 , C25D7/00
摘要： Methods for polishing a substrate are provided. In one embodiment, the method includes pressing a substrate against a pad assembly disposed on rotating platen assembly, the pad assembly comprising an electrode coupled to a power source, flowing an electrolyte fluid onto the pad assembly, wherein the electrolyte fluid is in contact with the substrate and the electrode, creating an electrical bias between the electrode and the substrate, and heating the electrolyte fluid with an infrared lamp to a temperature of at least 10 degrees Celsius above room temperature.
摘要翻译： 提供了抛光基板的方法。 在一个实施例中，该方法包括将基板压靠在设置在旋转台板组件上的焊盘组件上，该焊盘组件包括耦合到电源的电极，将电解液流动到焊盘组件上，其中电解质流体与 衬底和电极，在电极和衬底之间产生电偏压，并用红外灯将电解质液体加热到高于室温的至少10摄氏度的温度。
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公开(公告)号：US07375449B2
公开(公告)日：2008-05-20
申请号：US11506636
申请日：2006-08-17
申请人： Paul D. Butterfield
发明人： Paul D. Butterfield
IPC分类号： H02K3/04
CPC分类号： H02K3/26 , H02K1/2793 , H02K3/28 , H02K3/47 , H02K5/20 , H02K5/225 , H02K11/048 , H02K11/33 , H02K13/08 , H02K21/24
摘要： An electrical machine having a magnet assembly with a magnet carrier ring with an even number of permanent magnets mounted in the carrier ring around a circular locus, and a conductor assembly with one or more conductor circuits wound in a double helix wave winding around a flat conductor support ring with the conductor circuits having uniformly curved conductor segments of involute or arcuate configuration wherein the magnet assembly and conductor assembly are contained in a housing with the magnet assembly rotating relative to the conductor assembly.
摘要翻译： 一种具有磁体组件的电机，具有安装在环形轨迹周围的承载环中的偶数个永磁体的磁体载体环，以及具有一个或多个导体电路的导体组件，所述导体组件缠绕在围绕扁平导体的双螺旋波绕组中 支撑环具有导体电路，其具有渐开线或弓形构造的均匀弯曲的导体段，其中磁体组件和导体组件容纳在壳体中，磁体组件相对于导体组件旋转。
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公开(公告)号：US07137879B2
公开(公告)日：2006-11-21
申请号：US11393220
申请日：2006-03-30
申请人： Liang-Yuh Chen , Yuchun Wang , Yan Wang , Alain Duboust , Daniel A. Carl , Ralph Wadensweiler , Manoocher Birang , Paul D. Butterfield , Rashid Mavliev , Stan D. Tsai
发明人： Liang-Yuh Chen , Yuchun Wang , Yan Wang , Alain Duboust , Daniel A. Carl , Ralph Wadensweiler , Manoocher Birang , Paul D. Butterfield , Rashid Mavliev , Stan D. Tsai
CPC分类号： B82Y30/00 , B24B37/046 , B24B37/24 , B24B37/26 , B24D3/34
摘要： An article of manufacture and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive surface adapted to polish the substrate and a mounting surface. A plurality of perforations may be formed in the polishing article for flow of material therethrough. In another aspect, a polishing article for polishing a substrate includes a body having a polishing surface and a conductive element disposed therein. The conductive element may have a contact surface that extends beyond a plane defined by the polishing surface. The polishing surface may have one or more pockets formed therein. The conductive element may be disposed in each of the polishing pockets.
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