公开(公告)号：US07378146B1

公开(公告)日：2008-05-27

申请号：US09129737

申请日：1998-08-05

申请人： Jeffrey Curtis Hedrick ,  David Andrew Lewis ,  Stanley Joseph Whitehair

发明人： Jeffrey Curtis Hedrick ,  David Andrew Lewis ,  Stanley Joseph Whitehair

IPC分类号： B32B7/02

CPC分类号： C23C16/308 ,  Y10S428/911 ,  Y10T428/24975 ,  Y10T428/24983 ,  Y10T428/265

摘要： The present invention related to an improved structure of an optically transparent element that can be used in optical scanners, supermarket scanners, lenses for eyeglasses, etc. The application of oxynitride PECVD films provide good hardness and optical transparency. Such films displaying these physical properties are extremely useful as a scratch resistant coatings in lenses and systems in which an article contacts a transparent surface, such as in scanners and in environments in which intermittent, environmental contact occurs such as in displays for computers and suchlike and in liquid crystal displays, touch displays and compact disks.

摘要翻译： 本发明涉及可用于光学扫描仪，超市扫描仪，眼镜镜片等的光学透明元件的改进结构。氮氧化物PECVD膜的应用提供了良好的硬度和光学透明度。 显示这些物理性质的这样的薄膜作为防透光涂料在透镜和系统中是非常有用的，所述透镜和系统中的物品接触透明表面，例如在扫描仪中以及在诸如计算机等的显示器中发生间歇性环境接触的环境中， 在液晶显示器，触摸显示器和光盘中。

公开(公告)号：US06268238B1

公开(公告)日：2001-07-31

申请号：US09111507

申请日：1998-07-08

申请人： Evan Ezra Davidson ,  David Andrew Lewis ,  Jane Margaret Shaw ,  Alfred Viehbeck ,  Janusz Stanislaw Wilczynski

发明人： Evan Ezra Davidson ,  David Andrew Lewis ,  Jane Margaret Shaw ,  Alfred Viehbeck ,  Janusz Stanislaw Wilczynski

IPC分类号： H01L2144

CPC分类号： H05K3/4641 ,  H01L25/0652 ,  H01L2224/48091 ,  H01L2924/01014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/19041 ,  H05K1/053 ,  H05K1/056 ,  H05K1/145 ,  H05K3/3436 ,  H05K3/4608 ,  H05K2201/068 ,  H05K2201/09309 ,  H05K2201/09718 ,  Y10S428/901 ,  Y10T428/24802 ,  Y10T428/24917 ,  Y10T428/24926 ,  H01L2924/00014 ,  H01L2924/00

摘要： A three dimensional packaging architecture for ultimate high performance computers and methods for fabricating thereof are described. The packgage allows very dense packaging of multiple integrated circuit chips for minimum communication distances and maximum clock speeds of the computer. The packaging structure is formed from a plurality of subassemblies. Each subassembly is formed from a substrate which has on at least one side thereof at least one integrated circuit device. Between adjacent subassemblies there is disposed a second substrate. There are electrical interconnection means to electrically interconnect contact locations on the subassembly to contact locations on the second substrate. The electrical interconnection means can be solder mounds, wire bonds and the like. The first substrate provides electrical signal intercommunication between the electronic devices and each subassembly. The second substrate provides ground and power distribution to the plurality of subassemblies. Optionally, the outer surfaces of the structure that can be disposed a cube of memory chips.

摘要翻译： 描述了用于最终高性能计算机的三维封装架构及其制造方法。 该包装允许非常密集的多个集成电路芯片的封装，以实现计算机的最小通信距离和最大时钟速度。 包装结构由多个子组件形成。 每个子组件由至少一个侧面上至少有一个集成电路器件的衬底形成。 在相邻的子组件之间设置有第二衬底。 存在用于将子组件上的接触位置电互连到第二基板上的接触位置的电互连装置。 电互连装置可以是焊锡槽，引线接合等。 第一基板在电子设备和每个子组件之间提供电信号互通。 第二基板提供对多个子组件的接地和功率分配。 可选地，结构的外表面可以设置成存储芯片的立方体。

公开(公告)号：US06242139B1

公开(公告)日：2001-06-05

申请号：US09122277

申请日：1998-07-24

申请人： Jeffrey Curtis Hedrick ,  David Andrew Lewis ,  Stanley Joseph Whitehair

发明人： Jeffrey Curtis Hedrick ,  David Andrew Lewis ,  Stanley Joseph Whitehair

IPC分类号： G02B520

CPC分类号： G02F1/133516 ,  G02B5/201

摘要： A means to fabricate a color filter for use in a display, such as a liquid crystal display, in which a physical barrier is created which prevents the flow of a liquid dye after application and ensures that individual cells are filled with only the desired color. Additionally, a means is disclosed which creates a surface with all colors initially present, followed by an exposure means and a development means which enables the desired color to fill the desired cell.

摘要翻译： 制造用于显示器（例如液晶显示器）的彩色滤光片的方法，其中产生物理屏障，防止液体染料在施加之后流动，并确保单个电池仅填充所需的颜色。 此外，公开了一种创建具有最初存在的所有颜色的表面的装置，随后是曝光装置和使所需颜色填充所需单元的显影装置。

公开(公告)号：US6057902A

公开(公告)日：2000-05-02

申请号：US129736

申请日：1998-08-05

申请人： Marie Angelopoulos ,  David Andrew Lewis ,  Shui-Chih Alan Lien

发明人： Marie Angelopoulos ,  David Andrew Lewis ,  Shui-Chih Alan Lien

IPC分类号： G02F1/1337

CPC分类号： G02F1/133753 ,  G02F1/133788 ,  G02F2001/133761

摘要： A structure for providing a wide viewing angle for a liquid crystal display or similar comprising the formation of more than one region within a pixel (for each color) which provides more than one pretilt angle is provided by controlling chemistry of a second layer placed in predetermined locations within a single pixel.

摘要翻译： 提供用于液晶显示器或类似物的宽视角的结构，其通过控制设置在预定角度的第二层的化学性质来提供，所述结构包括在提供多于一个预倾角的像素内（用于每种颜色）形成多于一个区域 单个像素内的位置。

公开(公告)号：US6051283A

公开(公告)日：2000-04-18

申请号：US5729

申请日：1998-01-13

申请人： Kam Leung Lee ,  David Andrew Lewis ,  Ronnen Andrew Roy ,  Raman Gobichettipalayam Viswanathan

发明人： Kam Leung Lee ,  David Andrew Lewis ,  Ronnen Andrew Roy ,  Raman Gobichettipalayam Viswanathan

IPC分类号： H01L21/285 ,  H01L21/324 ,  B05D3/06 ,  B05D3/00 ,  H01L21/44

CPC分类号： H01L21/28518 ,  H01L21/324 ,  Y10T428/12493 ,  Y10T428/12528 ,  Y10T428/12674

摘要： The present invention is directed to a method of forming a new material layer or region near an interface region of two dissimilar materials, and an optional third layer, wherein at least one of said dissimilar materials or optional third is capable of being heated by microwave energy. The method of the present invention includes a step of irradiating a structure containing at least two dissimilar materials and an optional third layer under conditions effective to form the new material layer in the structure. An apparatus for conducting the microwave heating as well as the structures formed from the method are also described herein.

摘要翻译： 本发明涉及一种在两种不同材料的界面区域附近形成新材料层或区域的方法，以及任选的第三层，其中所述不同材料或任选的第三层中的至少一种能够被微波能量加热 。 本发明的方法包括在有效地在结构中形成新材料层的条件下照射含有至少两种不同材料和任选的第三层的结构的步骤。 本文还描述了用于进行微波加热的装置以及由该方法形成的结构。

公开(公告)号：US6019530A

公开(公告)日：2000-02-01

申请号：US129508

申请日：1998-08-05

申请人： Alphonso Philip Lanzetta ,  David Andrew Lewis ,  Lawrence Shungwei Mok ,  Stanley Joseph Whitehair

发明人： Alphonso Philip Lanzetta ,  David Andrew Lewis ,  Lawrence Shungwei Mok ,  Stanley Joseph Whitehair

IPC分类号： B41J5/08 ,  G06F1/16 ,  G06F3/02

CPC分类号： G06F1/1616 ,  G06F1/1666 ,  G06F3/0221 ,  H01H2223/052 ,  H01H2223/062

摘要： The invention is directed to a keyboard where the keys are raised up from a retracted position upon the initialization of usage of the keyboard. An embedded airbag mechanism is self-inflatable to raise keys to the normal operating heights. The keys will be retracted when the airbag is deflated. The rising and retracting of the keys can also be controlled by hinge-like structure. The close and open of the cover of a laptop computer will activate the mechanism to raise and retract the keys on the keyboard.

摘要翻译： 本发明涉及一种键盘，其中键盘在键盘的使用初始化时从缩回位置升起。 嵌入式安全气囊机构可自动充气，以将钥匙提升到正常操作高度。 当气囊放气时，钥匙将缩回。 键的上升和缩回也可以通过铰链式结构来控制。 膝上型计算机的盖子的关闭和打开将激活提升和缩回键盘上的键的机构。

公开(公告)号：US5817986A

公开(公告)日：1998-10-06

申请号：US699954

申请日：1996-08-20

申请人： Evan Ezra Davidson ,  David Andrew Lewis ,  Jane Margaret Shaw ,  Alfred Viehbeck ,  Janusz Stanislaw Wilczynski

发明人： Evan Ezra Davidson ,  David Andrew Lewis ,  Jane Margaret Shaw ,  Alfred Viehbeck ,  Janusz Stanislaw Wilczynski

IPC分类号： H05K3/36 ,  H01L25/065 ,  H05K1/05 ,  H05K1/14 ,  H05K3/34 ,  H05K3/46 ,  H05K7/14 ,  H05K1/00

CPC分类号： H05K3/4641 ,  H01L25/0652 ,  H05K1/145 ,  H01L2224/48091 ,  H01L2924/01014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/19041 ,  H05K1/053 ,  H05K1/056 ,  H05K2201/068 ,  H05K2201/09309 ,  H05K2201/09718 ,  H05K3/3436 ,  H05K3/4608 ,  Y10S428/901 ,  Y10T428/24802 ,  Y10T428/24917 ,  Y10T428/24926

摘要： A three dimensional packaging architecture for ultimate high performance computers and methods for fabricating thereof are described. The package allows very dense packaging of multiple integrated circuit chips for minimum communication distances and maximum clock speeds of the computer. The packaging structure is formed from a plurality of subassemblies. Each subassembly is formed from a substrate which has on at least one side thereof at least one integrated circuit device. Between adjacent subassemblies there is disposed a second substrate. There are electrical interconnection means to electrically interconnect contact locations on the subassembly to contact locations on the second substrate. The electrical interconnection means can be solder mounds, wire bonds and the like. The first substrate provides electrical signal intercommunication between the electronic devices and each subassembly. The second substrate provides ground and power distribution to the plurality of subassemblies. Optionally, the outer surfaces of the structure that can be disposed a cube of memory chips.

公开(公告)号：US07247262B2

公开(公告)日：2007-07-24

申请号：US11121293

申请日：2005-05-03

申请人： Richard Alexander Evans ,  Melissa Ann Skidmore ,  Lachlan Hartley Yee ,  Tracey Lee Hanley ,  David Andrew Lewis

发明人： Richard Alexander Evans ,  Melissa Ann Skidmore ,  Lachlan Hartley Yee ,  Tracey Lee Hanley ,  David Andrew Lewis

IPC分类号： G02B5/23 ,  G02F1/01 ,  F21V9/08 ,  C07D309/00

CPC分类号： C09D11/50 ,  C07D311/92 ,  C07F7/21 ,  C09K9/02 ,  C09K2211/1033 ,  C09K2211/1048

摘要： The invention related to a photochromic polymeric composition comprising a polymer matrix and a photochromic compound which is an adduct comprising a photochromic moiety and at least one pendant oligomer group to provide a rate of fade of the photochromic polymeric composition which is significantly changed when compared with the corresponding composition comprising the photochromic compound without said pendent oligomer. The invention also relates to a photochromic compound which is an adduct comprising a photochromic moiety and at least one pendent oligomer.

摘要翻译： 本发明涉及包含聚合物基质和光致变色化合物的光致变色聚合物组合物，其是包含光致变色部分和至少一个侧链低聚物基团的加合物，以提供光致变色聚合物组合物的褪色速率，其与 相应的组合物包含不含所述侧链低聚物的光致变色化合物。 本发明还涉及光致变色化合物，其是包含光致变色部分和至少一种侧挂低聚物的加合物。

公开(公告)号：US06172399B2

公开(公告)日：2001-01-09

申请号：US09118618

申请日：1998-07-17

申请人： Kam Leung Lee ,  David Andrew Lewis ,  Raman Gobichettipalayam Viswanathan

发明人： Kam Leung Lee ,  David Andrew Lewis ,  Raman Gobichettipalayam Viswanathan

IPC分类号： H01L2976

CPC分类号： H01L21/26513 ,  H01L21/26586 ,  H01L21/324 ,  H01L29/665 ,  H01L29/6659

摘要： The present invention is a method of utilizing microwave energy for annealing of ion implanted wafers. By controlling the time, power density and temperature regime, it is possible to substantially fully anneal the wafer while limiting (and substantially preventing) the diffusion of dopant into the silicon, thereby producing higher performance scaled semiconductor devices. It is also possible, using different conditions, to allow and control the dopant profile (diffusion) into the silicon. Another aspect of the present invention is a method of forming a PN junction in a semiconductor wafer having a profile depth less than about 50 nm and a profile wherein the net doping concentration at said PN junction changes by greater than about one order of magnitude over 6 nm wherein the surface concentration of said dopant is greater than about 1×1020/cm3. The method includes providing a semiconductor wafer which can be single crystal or amorphous surface; implanting into said surface a dopant; exposing the surface to an energy source; the energy source being applied to supply energy at a rate such that the surface is substantially fully annealed before the dopant diffuses greater than about 50 nm. Another aspect of the present invention is having a PN junction formed between a first material of a first conductivity type and a second material of a second conductivity type, the junction has a depth of less than about 50 nm, in the first material the net doping concentration at the junction changes by greater than about one order of magnitude over 10 nm, the maximum value of said first conducting material of said wafer has a surface concentration of greater than about 1×1020/cm3.

摘要翻译： 本发明是利用微波能量退火离子注入晶片的方法。 通过控制时间，功率密度和温度状态，可以在限制（并且基本上防止）掺杂剂向硅中的扩散的同时基本上完全退火晶片，从而产生更高性能的定标的半导体器件。 也可以使用不同的条件来允许和控制硅中的掺杂剂分布（扩散）。 本发明的另一方面是在具有小于约50nm的轮廓深度的半导体晶片中形成PN结的方法和其中所述PN结处的净掺杂浓度在6以上大于约一个数量级的轮廓 nm，其中所述掺杂剂的表面浓度大于约1×1020 / cm3。 该方法包括提供可以是单晶或非晶面的半导体晶片; 将所述表面植入掺杂剂; 将表面暴露于能量源; 施加能量源以使得在掺杂剂扩散大于约50nm之前表面基本上完全退火的速率提供能量。 本发明的另一方面是在第一导电类型的第一材料和第二导电类型的第二材料之间形成PN结，该结具有小于约50nm的深度，在第一材料中，净掺杂 在该结处的浓度在10nm以上变化大约一个数量级，所述晶片的所述第一导电材料的最大值具有大于约1×1020 / cm3的表面浓度。

公开(公告)号：US6150645A

公开(公告)日：2000-11-21

申请号：US129505

申请日：1998-08-05

申请人： David Andrew Lewis ,  Stanley Joseph Whitehair

发明人： David Andrew Lewis ,  Stanley Joseph Whitehair

IPC分类号： B01J19/12 ,  G01N22/00 ,  H05B6/68 ,  H05B6/74 ,  H05B6/66

CPC分类号： H05B6/74 ,  B01J19/126 ,  G01N22/00 ,  H05B6/68 ,  H05B6/705 ,  B01J2219/00058 ,  B01J2219/00191 ,  B01J2219/0879 ,  B01J2219/1275 ,  Y02B40/143

摘要： A control system for a blind microwave radiation tool a workpiece is described. The controlled system automatically tunes the cavity containing the workpiece. The control system automatically controls the temperature of the workpiece according to a predetermined temperature versus time schedule. Control system automatically determines when the workpiece has reached a particular predetermined physical condition. To achieve these results the control system automatically monitors applied power, reflected power or current temperature and automatically controls the microwave cavity volume and shape and launch structure including antennae location, cavity short location, cavity diameter, coupling loop position, etc. in order to maintain the cavity in resonance and to determine when to exit without operator intervention. Control system can run on a small computer or an embedded controller and is useful for automatically curing polyamic acid to polyimide to a predetermined percent cure, processing preimpregnated glass cloth in a continuous manner which can be used in circuit boards and drying and partial curing of web-like materials automatically without operator intervention.

摘要翻译： 描述了用于盲微波辐射工具的工件的控制系统。 受控系统自动调谐包含工件的腔体。 控制系统根据预定的温度对时间表自动控制工件的温度。 控制系统自动确定工件何时达到特定的预定物理状态。 为了实现这些结果，控制系统自动监测所施加的功率，反射功率或当前温度，并自动控制微波腔的体积和形状以及发射结构，包括天线位置，腔体短距离，腔体直径，耦合回路位置等，以便保持 腔内共振并确定何时退出而无需操作员干预。 控制系统可以在小型计算机或嵌入式控制器上运行，可用于将聚酰胺酸与聚酰亚胺自动固化至预定百分比固化，以连续方式处理预浸玻璃布，可用于电路板和干燥和部分固化网 自动地进行操作员干预。