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    METHOD OF MAKING A MAGNETORESISTIVE READER STRUCTURE
    31.
    发明申请
    METHOD OF MAKING A MAGNETORESISTIVE READER STRUCTURE 审中-公开
    制造磁化读取器结构的方法

    公开(公告)号：US20090266790A1

    公开(公告)日：2009-10-29

    申请号：US12110388

    申请日：2008-04-28

    申请人： Hamid Balamane ,  Jordan A. Katine ,  Jui-Lung Li ,  Neil L. Robertson

    发明人： Hamid Balamane ,  Jordan A. Katine ,  Jui-Lung Li ,  Neil L. Robertson

    IPC分类号： B44C1/22

    CPC分类号： G11B5/3163 ,  G11B5/3903

    摘要： A method of making a magnetoresistive sensor includes defining a track width of a magnetoresistive element stack of the sensor with a hard mask and photoresist. Further, processes of the method enable depositing of hard magnetic bias material on each side of the stack after the hard mask used to define the track width is removed. A separate chemical mechanical polishing (CMP) stop layer that is different from the hard mask enables subsequent creating of a planar surface via CMP to remove unwanted material on top of the sensor stack.

    摘要翻译： 制造磁阻传感器的方法包括用硬掩模和光致抗蚀剂限定传感器的磁阻元件堆的轨道宽度。 此外，该方法的过程使得在用于限定轨道宽度的硬掩模被去除之后，能够在堆叠的每一侧上沉积硬磁偏置材料。 与硬掩模不同的单独的化学机械抛光（CMP）停止层可以随后通过CMP产生平坦表面以去除传感器堆叠顶部的不需要的材料。

    Process to open connection vias on a planarized surface
    32.
    发明授权
    Process to open connection vias on a planarized surface 有权
    在平坦化表面上打开连接通孔的过程

    公开(公告)号：US07523550B2

    公开(公告)日：2009-04-28

    申请号：US11411555

    申请日：2006-04-25

    申请人： Amanda Baer ,  Hamid Balamane ,  Michael Feldbaum ,  Ming Jiang ,  Aron Pentek

    发明人： Amanda Baer ,  Hamid Balamane ,  Michael Feldbaum ,  Ming Jiang ,  Aron Pentek

    IPC分类号： H01K3/10

    CPC分类号： G11B5/3163 ,  G11B5/1278 ,  G11B5/3116 ,  Y10T29/49021 ,  Y10T29/49032 ,  Y10T29/49044 ,  Y10T29/49126 ,  Y10T29/49139 ,  Y10T29/49153 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49169

    摘要： A method for forming a via in an alumina protective layer on a structure such as a magnetic write head for use in perpendicular magnetic recording. A structure such as a magnetic pole, and or magnetic trailing shield, is formed over a substrate and is covered with a thick layer of alumina. The alumina layer can then be planarized by a chemical mechanical polishing process (CMP) and then a mask structure, such as a photoresist mask, is formed over the alumina layer. The mask structure is formed with an opening disposed over the contact pad. A reactive ion mill is then performed to remove portions of the alumina layer that are exposed at the opening in the mask, thereby forming a via in the alumina layer.

    摘要翻译： 在用于垂直磁记录的诸如磁写头的结构上的氧化铝保护层中形成通孔的方法。 诸如磁极和/或磁性后屏蔽的结构形成在衬底上并被厚层氧化铝覆盖。 然后可以通过化学机械抛光工艺（CMP）将氧化铝层平坦化，然后在氧化铝层上形成诸如光致抗蚀剂掩模的掩模结构。 掩模结构形成有设置在接触垫上方的开口。 然后执行反应离子研磨机以除去在掩模中的开口处暴露的部分氧化铝层，从而在氧化铝层中形成通孔。

    Method of laser cutting a metal line on an MR head
    36.
    发明授权
    Method of laser cutting a metal line on an MR head 失效
    激光切割MR头上的金属线的方法

    公开(公告)号：US5759428A

    公开(公告)日：1998-06-02

    申请号：US616395

    申请日：1996-03-15

    申请人： Hamid Balamane ,  Chie Ching Poon ,  Neil Leslie Robertson ,  Andrew Ching Tam

    发明人： Hamid Balamane ,  Chie Ching Poon ,  Neil Leslie Robertson ,  Andrew Ching Tam

    IPC分类号： B23K26/40 ,  B23K26/08

    CPC分类号： B23K26/40 ,  B23K26/362 ,  B23K2203/26 ,  B23K2203/50 ,  Y10T29/49032

    摘要： A thin film conductive line is formed between MR pads on an MR head for protecting an MR sensor from electrostatic discharge (ESD) during assembly steps between row level fabrication of the head and prior to merge of a head stack assembly with a disk stack assembly. The conductive line may have a reduced thickness delete pad. A laser beam having a fluence sufficient to sever the conductive line at the delete pad but insufficient to damage or cause debris from structure underlying or surrounding the conductive line is used to sever the conductive line. The method traverses minimum energy, short laser pulses at a high pulse rate across the width of the conductive line so that each laser pulse melts conductive material across the line, the melted material withdrawing from the melted area and being heaped on top of adjacent portions of the delete pad by surface tension and the melted material cooling to room temperature before the next pulse so that there is no cumulative heating and therefore no damage to or debris from the underlying structure. The conductive material of the line is incrementally plowed to each side of a severed path by successive overlapping laser pulses so that when the series of laser pulses has traversed the width of the delete pad the conductive line has been severed.

    摘要翻译： 在MR头上的MR焊盘之间形成薄膜导电线，用于在磁头堆叠组件与磁盘堆叠组件合并之前的组装步骤期间保护MR传感器免受静电放电（ESD）的影响。 导线可以具有减小的厚度删除焊盘。 激光束具有足够的能量来切断在删除焊盘处的导线，但是不足以损坏或者导致来自导电线下面或周围的结构的碎屑被切断导线。 该方法在导线的宽度上以高脉冲速度穿过最小能量，短激光脉冲，使得每个激光脉冲在导线上熔化导电材料，熔化的材料从熔化区域中排出并堆叠在相邻部分的顶部 删除垫由表面张力和熔化的材料在下一个脉冲之前冷却至室温，使得没有累积加热，因此不会从底层结构损坏或碎屑。 线的导电材料通过连续重叠的激光脉冲逐渐地被切割到切断路径的每一侧，使得当一系列激光脉冲已经穿过删除焊盘的宽度时，导线已被切断。