摘要:
A semiconductor memory device having as its main storage portion a capacitor storing charges as binary information and an access transistor controlling input/output of the charges to/from the capacitor, and eliminating the need for refresh, is obtained. The semiconductor memory device includes a capacitor with a storage node located above a semiconductor substrate and holding the charges corresponding to a logical level of stored binary information, an access transistor located on the semiconductor substrate surface and controlling input/output of the charges accumulated in the capacitor, and a latch circuit located on the semiconductor substrate and maintaining a potential of the capacitor storage node. At least one of circuit elements constituting the latch circuit is located above the access transistor.
摘要:
P+-type source/drain regions for load transistors and N+-type source/drain regions for driver transistors are connected by means of P+-type source/drain region outgoing lead and N+-type source/drain region outgoing lead via direct contact holes. The drain region outgoing lead for the load transistors and ground lead are formed in a three-dimensionally overlapping manner, and the drain region outgoing lead for the driver transistors connected to memory nodes on one side and the drain region outgoing lead for the load transistors connected to memory nodes on the other side are also formed in a three-dimensionally overlapping manner, whereby memory node charge accumulators are constituted.
摘要:
An SRAM is provided with a high-resistance element for loading including a high-resistance portion, which extends onto adjacent memory cell. An interlayer insulating film is formed between the high-resistance portions.
摘要:
P.sup.+ -type source/drain regions for load transistors and N.sup.+ -type source/drain regions for driver transistors are connected by means of P.sup.+ -type source/drain region outgoing lead and N.sup.+ -type source/drain region outgoing lead via direct contact holes. The drain region outgoing lead for the load transistors and ground lead are formed in a three-dimensionally overlapping manner, and the drain region outgoing lead for the driver transistors connected to memory nodes on one side and the drain region outgoing lead for the load transistors connected to memory nodes on the other side are also formed in a three-dimensionally overlapping manner, whereby memory node charge accumulators are constituted.
摘要:
The present invention is provided in order to suppress a leak current at an emitter-base junction and to implement a high-speed operation of a bipolar transistor. An n.sup.+ buried layer is formed at a surface of a p.sup.- silicon substrate. An n.sup.- epitaxial growth layer and an n.sup.+ diffused layer are formed on n.sup.+ buried layer. A p.sup.+ external base region and a p.sup.- base region are formed at a surface of n.sup.- epitaxial growth layer so as to be adjacent to each other. A first interlayer insulating layer having an opening is formed on p.sup.- base region. A groove which is located under opening and extends under first interlayer insulating layer is formed at a surface of p.sup.- base region. An n.sup.+ emitter region is formed at a bottom surface of groove within p.sup.- base region. A sidewall insulating layer is formed so as to expose n.sup.+ emitter region and to cover a sidewall of opening and to come into contact with a bottom surface of first interlayer insulating layer.
摘要翻译:提供本发明是为了抑制发射极 - 基极结处的漏电流并实现双极晶体管的高速操作。 在p硅衬底的表面上形成n +掩埋层。 n +外延生长层和n +扩散层形成在n +掩埋层上。 在n外延生长层的表面形成p +外部基极区域和p基极区域,以便彼此相邻。 在p基极区上形成具有开口的第一层间绝缘层。 在p基底区域的表面上形成有位于开口下方并在第一层间绝缘层下方延伸的槽。 n +发射极区域形成在p基极区域内的沟槽的底面。 形成侧壁绝缘层,以露出n +发射极区域并覆盖开口的侧壁并与第一层间绝缘层的底表面接触。
摘要:
On an epitaxial layer (4) serving as a collector layer are formed an emitter layer (10), an intrinsic base layer (9) surrounding the emitter layer (10) while permitting the surface of the emitter layer (10) to be exposed, external base layers (8) and link base layers (7) lying between the intrinsic base layer (9) and external base layers (8). The intrinsic base layer between the emitter layer and the epitaxial layer serving as the collector layer has a relatively high impurity concentration, so that a collector-emitter breakdown voltage is not decreased. The link base layers between the intrinsic base layer and external base layers has a relatively low impurity concentration to suppress decrease in emitter-base junction breakdown voltage.
摘要:
Provided are a thin-film transistor formed by connecting polysilicon layers having different conductivity types with each other which prevents occurrence of inconvenience resulting from diffusion of impurities and a method of fabricating the same. A drain (6), a channel (7) and a source (8) are integrally formed on a surface of a second oxide film (4) by polysilicon. The drain (6) is formed to be connected with a pad layer (3) (second polycrystalline semiconductor layer) through a contact hole (5) which is formed to reach an upper surface of the pad layer (3). The pad layer (3) positioned on a bottom portion of the contact hole (5) (opening) is provided with a boron implantation region BR.
摘要:
A semiconductor device includes: a capacitor: an access transistor with impurity regions, controlling input/output of charge stored in the capacitor, one of the impurity regions being electrically connected to the capacitor; a latch circuit located above a silicon substrate, and storing the potential of a storage node of the capacitor; and a bit line connected to the other of the impurity regions of the access transistor T6. At least a portion of the latch circuit is formed above the bit line.
摘要:
A semiconductor device is comprised of: an element isolating film formed on one major surface of a semiconductor substrate; an element forming region formed on the major surface and surrounded by the element isolating film; a gate electrode formed via a gate insulating film on the element forming region and extended over the element isolating film; first and second impurity regions formed in the element forming region, whose portions exposed from a surface of the semiconductor substrate are made in contact with the element isolating film and are located opposite to each other under the gate electrode; a first insulating film formed near the gate electrode on the first impurity region, and extended over the gate electrode and near an extended portion of the gate electrode within the element isolating film; and a second insulating film formed near the gate electrode on the second impurity region. In this semiconductor device, a distance defined from an outer edge of the gate electrode on the side of the first impurity region to another outer edge of the first insulating film on the side apart from the gate electrode is longer than a distance defined from an outer edge of the gate electrode on the side of the second impurity region to another outer edge of the second insulating film on the side apart from the gate electrode.
摘要:
In an access transistor formed on a silicon substrate, its drain region is formed of n− type and n+ type drain regions and its source region is formed of n− type and n+ type source regions. In a driver transistor, its source region is formed of n− type and n++ type source regions and its drain regions is formed of n− type and n+ type drain regions. The n+ +type source region is formed deeper than the n+ type drain region. Accordingly, a semiconductor device ensuring improvement in a static noise margin while suppressing increase in manufacturing cost is provided.
摘要翻译:在形成在硅衬底上的存取晶体管中,其漏极区由n型和n +型漏极区形成,其源区由n型和n +型源极区形成。 在驱动晶体管中,其源区由n型和n ++型源极区形成,其漏极区由n型和n +型漏极区形成。 n +型源极区域形成得比n +型漏极区域更深。 因此,提供了一种在抑制制造成本增加的同时确保静态噪声容限的改善的半导体装置。