公开(公告)号：US20100328901A1

公开(公告)日：2010-12-30

申请号：US12822412

申请日：2010-06-24

申请人： Hideki MINATO ,  Hideki Kabune ,  Atsushi Furumoto

发明人： Hideki MINATO ,  Hideki Kabune ,  Atsushi Furumoto

IPC分类号： H05K7/02 ,  H02K11/00 ,  H02K9/22

CPC分类号： H02K11/0094 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/49541 ,  H01L24/37 ,  H01L24/41 ,  H01L24/48 ,  H01L25/072 ,  H01L2224/0603 ,  H01L2224/37147 ,  H01L2224/4103 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H02K3/522 ,  H02K9/22 ,  H02K11/024 ,  H02K11/05 ,  H02K11/33 ,  H02K2211/03 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/84

摘要： A linked semiconductor module unit links a plurality of semiconductor modules by a first bus bar and a second bus bar, which are embedded in resin parts. The linked semiconductor module unit is disposed in a place other than on a printed circuit board. The semiconductor module linking structure is implemented readily by molding the bus bars together with semiconductor chips and lands to form the resin parts.

摘要翻译： 连接的半导体模块单元通过嵌入在树脂部分中的第一母线和第二母线来连接多个半导体模块。 连接的半导体模块单元设置在印刷电路板以外的位置。 通过将汇流条与半导体芯片和焊盘一起模制以形成树脂部件，可以容易地实现半导体模块连接结构。

公开(公告)号：US20100327678A1

公开(公告)日：2010-12-30

申请号：US12822396

申请日：2010-06-24

申请人： Masashi YAMASAKI ,  Hideki Kabune ,  Atsushi Furumoto

发明人： Masashi YAMASAKI ,  Hideki Kabune ,  Atsushi Furumoto

IPC分类号： H02K11/00 ,  H02K5/22 ,  H02K9/22 ,  H02P6/16

CPC分类号： H02K11/024 ,  H02K3/522 ,  H02K11/05 ,  H02K11/33 ,  H02K2203/09 ,  H02K2211/03

摘要： A drive apparatus has a motor device having a tubular motor case. A stator is arranged radially inside the motor case. A rotor is arranged radially inside the stator. A shaft is rotatable with the rotor. An electronic circuit is arranged in the central axis direction of the shaft relative to the motor case. A choke coil has a hole in a central part thereof, in which the shaft is inserted.

摘要翻译： 驱动装置具有具有管状电动机壳体的电动机装置。 电动机壳体内径向配置定子。 转子径向布置在定子内。 轴可随转子旋转。 电子电路相对于电动机壳体设置在轴的中心轴线方向上。 扼流线圈在其中心部分具有孔，其中插入有轴。

公开(公告)号：US07321994B2

公开(公告)日：2008-01-22

申请号：US10771469

申请日：2004-02-05

申请人： Hideki Kabune ,  Hiromi Maehata

发明人： Hideki Kabune ,  Hiromi Maehata

IPC分类号： G06F11/00

CPC分类号： B60T8/885 ,  B60T2270/413

摘要： An electronic control unit includes a microcomputer and an input interface circuit. The microcomputer has square wave input ports, a reference square wave input port, a serial communication port, and an output port. Square wave signals are inputted from sensors to four channels of the input interface circuit. A channel selector included in the input interface circuit the selects square wave signals in orderly sequence for capturing. The microcomputer performs a comparison between a time at which the square wave is captured and a time at which the selected square wave signal is captured for diagnosing operation of an input capturing function.

摘要翻译： 电子控制单元包括微型计算机和输入接口电路。 微型计算机具有方波输入端口，参考方波输入端口，串行通信端口和输出端口。 方波信号从传感器输入到输入接口电路的四个通道。 包括在输入接口电路中的通道选择器按顺序选择方波信号进行捕获。 微型计算机在拍摄方波的时间和捕获所选择的方波信号的时间之间进行比较，以诊断输入捕捉功能的操作。

公开(公告)号：US07305587B2

公开(公告)日：2007-12-04

申请号：US10784198

申请日：2004-02-24

申请人： Hideki Kabune ,  Hiromi Maehata

发明人： Hideki Kabune ,  Hiromi Maehata

IPC分类号： G06F11/00

CPC分类号： G06F11/0757 ,  G05B19/0428 ,  G05B23/0256 ,  G05B2219/24038 ,  G06F11/076

摘要： An ECU (100, 200) includes a monitoring circuit (2) having a counter (3) for selecting an assignment number (21) of an assignment signal (20), a serial communicating unit (4) for transmitting the assignment signal (20) of the assignment number (21) selected by the counter (3) and to and receiving an answer signal from a microcomputer (1). The ECU also includes a comparing/judging circuit (5) for comparing an answer number (11) with a correct answer number (30) and incrementing the assignment number (21) of the assignment signal selected by the counter (3) by one when both the answers match. This circuit (5) maintains the same assignment number (21) when the answers do not match. The microcomputer (1) performs the operation in conformity with the assignment number (21) of the assignment signal (20) received and transmits the operation result by using an answer signal (10).

摘要翻译： ECU（100,200）包括具有用于选择分配信号（20）的分配编号（21）的计数器（3）的监视电路（2），用于发送分配信号（20）的串行通信单元（4） ）由计数器（3）选择的分配号（21）和从微计算机（1）接收的应答信号。 ECU还包括比较判定电路（5），用于将应答号码（11）与正确的应答号码（30）进行比较，并将由计数器（3）选择的分配信号的分配号码（21）递增1 两个答案都匹配。 当答案不匹配时，该电路（5）保持相同的分配号（21）。 微型计算机（1）根据接收到的分配信号（20）的分配编号（21）进行操作，并通过应答信号（10）发送运算结果。

公开(公告)号：US20050145414A1

公开(公告)日：2005-07-07

申请号：US10508538

申请日：2004-01-28

申请人： Hiroshi Tohkairin ,  Kenji Sakakibara ,  Hideki Kabune

发明人： Hiroshi Tohkairin ,  Kenji Sakakibara ,  Hideki Kabune

IPC分类号： H05K1/02 ,  H05K3/46 ,  H05K7/20 ,  H01L23/34

CPC分类号： H05K1/0207 ,  H01L2924/0002 ,  H05K1/0206 ,  H05K3/4623 ,  H05K3/4641 ,  H05K2201/09354 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09781 ,  H05K2201/10689 ,  H01L2924/00

摘要： The present invention is characterized in that in a metal-core multilayer printed wiring board (1) which is obtained by forming one or more of at least inner layers of a laminate having a insulating layer and a conductor layer stacked alternately from a metal plate and has the metal plate as a core, the metal plate (13) is disposed below a site on which a heating element (10) is to be mounted, a surface layer over which the heating element (10) is to be mounted is connected to the metal plate (13) of the inner layer via a BVH (12) and a heat radiation layer (14) is formed over the surface layer. The present invention makes it possible to efficiently radiate heat, which has been released from the heating element, to the outside of the printed wiring board without impairing the packaging density of circuits and at the same time, to mount another element on the side opposite to the side on which the heating element exists.

摘要翻译： 本发明的特征在于，在金属芯多层印刷电路板（1）中，所述金属芯多层印刷电路板（1）通过形成由金属板交替堆叠的具有绝缘层和导体层的层叠体的至少内层中的一个或多个而获得， 将金属板作为芯，将金属板（13）设置在要安装加热元件（10）的位置的下方，将要安装加热元件（10）的表面层连接到 通过BVH（12）和散热层（14）在内层的金属板（13）上形成。 本发明使得可以有效地将已经从加热元件释放的热量辐射到印刷电路板的外部，而不会损害电路的封装密度，同时在另一个元件的相反侧安装另一个元件 加热元件所在的一侧。

公开(公告)号：US09000633B2

公开(公告)日：2015-04-07

申请号：US13379096

申请日：2010-06-23

申请人： Masashi Yamasaki ,  Atsushi Furumoto ,  Hideki Kabune

发明人： Masashi Yamasaki ,  Atsushi Furumoto ,  Hideki Kabune

IPC分类号： H02K11/04 ,  H02K11/00 ,  B62D5/04 ,  H02K5/22

CPC分类号： H02K11/0073 ,  B62D5/0406 ,  H02K5/225 ,  H02K11/33 ,  H02K2211/03

摘要： A heat sink has two heat radiation blocks. The heat radiation block is formed in a wide column shape. The heat radiation block has connection parts at both ends. The connection parts have respective holes formed to pass through in the axial direction of a motor. One screw is inserted in one connection part and threaded into a motor case. The other screw is inserted in the other connection part and threaded into the motor case together with a cover. A power module forming an inverter circuit of each of two power supply systems is arranged on each heat radiation blocks.

摘要翻译： 散热片有两个散热块。 散热块形成为宽的柱状。 散热块在两端具有连接部分。 连接部具有形成为沿电动机的轴向通过的各个孔。 一个螺丝插入一个连接部分并拧入电机外壳。 另一个螺钉插入另一个连接部分，并与盖子一起拧入电机外壳。 形成两个电源系统中的每一个的逆变器电路的功率模块布置在每个散热块上。

公开(公告)号：US08957557B2

公开(公告)日：2015-02-17

申请号：US13380321

申请日：2010-06-23

申请人： Masashi Yamasaki ,  Hideki Kabune ,  Atsushi Furumoto

发明人： Masashi Yamasaki ,  Hideki Kabune ,  Atsushi Furumoto

IPC分类号： H02K11/00 ,  B62D5/04 ,  H02K5/22 ,  H02K9/22 ,  H02K3/50

CPC分类号： H02K11/0073 ,  B62D5/0406 ,  H02K3/50 ,  H02K5/225 ,  H02K9/22 ,  H02K11/33

摘要： An electronic control unit (50, 70) including semiconductor modules (501 to 506) and capacitors (701 to 706) is disposed in the axial direction of a motor (30). The semiconductor modules (501 to 506) are placed longitudinally and brought into contact with a heat sink (601). The vertical line to each of surfaces of semiconductor chips included in the semiconductor modules (501 to 506) is perpendicular to the axial line of the motor (30). Accordingly, the capacitors (701 to 706) are disposed so that at least a part of the capacitors (701 to 706) overlap the semiconductor modules (501 to 506) and heat sink (601) in the axial direction of the motor (30).

摘要翻译： 包括半导体模块（501至506）和电容器（701至706）的电子控制单元（50,70）设置在电动机（30）的轴向上。 半导体模块（501至506）被纵向放置并与散热器（601）接触。 包括在半导体模块（501至506）中的半导体芯片的每个表面的垂直线垂直于电动机（30）的轴线。 因此，电容器（701〜706）的配置使得至少一部分电容器（701〜706）在电动机（30）的轴向上与半导体模块（501〜506）和散热片（601）重叠， 。

公开(公告)号：US08630095B2

公开(公告)日：2014-01-14

申请号：US12822412

申请日：2010-06-24

申请人： Hideki Minato ,  Hideki Kabune ,  Atsushi Furumoto

发明人： Hideki Minato ,  Hideki Kabune ,  Atsushi Furumoto

IPC分类号： H05K5/00

CPC分类号： H02K11/0094 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/49541 ,  H01L24/37 ,  H01L24/41 ,  H01L24/48 ,  H01L25/072 ,  H01L2224/0603 ,  H01L2224/37147 ,  H01L2224/4103 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H02K3/522 ,  H02K9/22 ,  H02K11/024 ,  H02K11/05 ,  H02K11/33 ,  H02K2211/03 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/84

摘要： A linked semiconductor module unit links a plurality of semiconductor modules by a first bus bar and a second bus bar, which are embedded in resin parts. The linked semiconductor module unit is disposed in a place other than on a printed circuit board. The semiconductor module linking structure is implemented readily by molding the bus bars together with semiconductor chips and lands to form the resin parts.

摘要翻译： 连接的半导体模块单元通过嵌入在树脂部分中的第一母线和第二母线来连接多个半导体模块。 连接的半导体模块单元设置在除了印刷电路板之外的位置。 通过将汇流条与半导体芯片和焊盘一起模制以形成树脂部件，可以容易地实现半导体模块连接结构。

公开(公告)号：US08365860B2

公开(公告)日：2013-02-05

申请号：US13134464

申请日：2011-06-08

申请人： Yasuhiko Mukai ,  Hideki Kabune ,  Koichi Nakamura ,  Masashi Hori

发明人： Yasuhiko Mukai ,  Hideki Kabune ,  Koichi Nakamura ,  Masashi Hori

IPC分类号： B62D5/04

CPC分类号： B62D5/008 ,  B62D5/0472

摘要： A steering control apparatus acquires vibration torque, which is generated by vibration of a gear mechanism when a steering wheel is operated at a steering angle. By setting the acquired vibration torque as a torque difference, an EPS motor current command value is corrected based on the torque difference thereby to calculate a corrected EPS motor current command value. Rattling and vibration caused in the gear mechanism are suppressed from being transferred to the steering wheel through an input shaft so that a driver is released from uncomfortable feeling.

摘要翻译： 转向控制装置获取当方向盘以转向角操作时由齿轮机构的振动产生的振动转矩。 通过将取得的振动转矩设定为转矩差，根据转矩差校正EPS电动机电流指令值，由此计算校正后的EPS电动机电流指令值。 齿轮机构引起的振动和振动被抑制通过输入轴传递到方向盘，使得驾驶员不舒适的感觉被释放。

公开(公告)号：US20120098366A1

公开(公告)日：2012-04-26

申请号：US13380321

申请日：2010-06-23

申请人： Masashi Yamasaki ,  Hideki Kabune ,  Atsushi Furumoto

发明人： Masashi Yamasaki ,  Hideki Kabune ,  Atsushi Furumoto

IPC分类号： H02K5/00

CPC分类号： H02K11/0073 ,  B62D5/0406 ,  H02K3/50 ,  H02K5/225 ,  H02K9/22 ,  H02K11/33

摘要： An electronic control unit (50, 70) including semiconductor modules (501 to 506) and capacitors (701 to 706) is disposed in the axial direction of a motor (30). The semiconductor modules (501 to 506) are placed longitudinally and brought into contact with a heat sink (601). The vertical line to each of surfaces of semiconductor chips included in the semiconductor modules (501 to 506) is perpendicular to the axial line of the motor (30). Accordingly, the capacitors (701 to 706) are disposed so that at least a part of the capacitors (701 to 706) overlap the semiconductor modules (501 to 506) and heat sink (601) in the axial direction of the motor (30).

摘要翻译： 包括半导体模块（501至506）和电容器（701至706）的电子控制单元（50,70）设置在电动机（30）的轴向上。 半导体模块（501至506）被纵向放置并与散热器（601）接触。 包括在半导体模块（501至506）中的半导体芯片的每个表面的垂直线垂直于电动机（30）的轴线。 因此，电容器（701〜706）的配置使得至少一部分电容器（701〜706）在电动机（30）的轴向上与半导体模块（501〜506）和散热片（601）重叠， 。