摘要:
A method for producing an alignment layer for a liquid crystal panel, which is produced by modifying an alignment film in a fixed direction and at a fixed angle by using an atmospheric pressure plasma source to form a uniform and isotropic alignment layer on the surface of the substrate. The resultant alignment layer has good uniformity and high anchoring energy, and the pre-tilt angle can be selected as desired. In addition, there are no problems with static charge generation, dust pollution and the like as in the prior arts. The method of the present invention is not restricted by vacuum apparatuses that need ion alignment or vacuum plasma alignment and the like and is not restricted by the size of the equipment. Therefore, the method of the present invention is suitable for treating the surface of an alignment layer of a large size liquid crystal panel.
摘要:
A chip package structure including a first substrate, a second substrate, bumps and adhesive blocks is provided. The first substrate has first bonding pads. The second substrate is disposed above the first substrate and has second bonding pads. The bumps are respectively arranged on the first bonding pads or the second bonding pads, and the second substrate is electrically connected to the first substrate through the bumps. The adhesive material with B-stage property are respectively arranged between the first bonding pads and the second bonding pads and enclose each bump. The bumps can be stud bumps or plating bumps.
摘要:
A manufacturing process for chip package without core is disclosed. First of all, a conductive layer with a first surface and a second surface is provided. A first film is formed onto the first surface, and the conductive layer is patterned to form a patterned circuit layer. A solder resistance layer is formed on the patterned circuit layer and then patterned to expose parts of the patterned circuit layer. After a second film is formed on the solder resistance layer and the first film is removed, a chip is disposed on the first surface and electrically connected to the patterned circuit layer. A molding compound is formed to cover the patterned circuit layer and fix the chip onto the patterned circuit layer. After that, the second film is removed.
摘要:
This invention relates to a method of preparing a first alicyclic compound having a vinyl group on one alkyl ring carbon and an alkoxy, cycloalkoxy, heterocycloalkyoxy, aryloxy, or heteroaryloxy group on the same ring carbon; the method comprising reacting an aliphatic alcohol or an aromatic alcohol with a second alicyclic compound having an exo cyclic carbon-carbon double bond, wherein the non-ring olefinic carbon is substituted with a hydroxymethyl, thiomethyl, alkoxymethyl, aryloxymethyl, acyloxymethyl, alkylsulfonyloxymethyl, arylsulfonyloxymethyl, alkylsulfonylmethyl, arylsulfonylmethyl, halomethyl, or silyloxymethyl group.
摘要:
An electropolishing device having: an electrode device, which includes a positive electrode guide, a negative electrode guide, a positive electrode plate, a negative electrode plate and a negative working electrode; a clamping apparatus, which includes at least an insulated screw, an upper insulated piece and a lower insulated piece; and an insulated structure, which includes an upper insulated cover and a lower insulated cover.
摘要:
An automatic feature extraction system for analyzing a face image and finding the facial features of the face. In the pre-processing stage, a second-chance region growing method is applied to determine a face region on the face image. In the feature extraction stage, three primary facial features, including both eyes and the mouth, are extracted first. Then other facial features can be extracted according to these extracted primary facial features. Searching feature points can be achieved by calculating the cost function of each point using a simple feature template. In addition, a genetic algorithm can be used to accelerate the process of searching feature points.
摘要:
A method and apparatus for molding a flip chip semiconductor device are disclosed herein. A substrate having at least one air hole is provided. A chip is mounted on the substrate by multiple solder balls such that the air hole is beneath the chip and surrounded by the multiple solder balls. The substrate mounted with the chip is placed in a mold apparatus which defines at least one air channel aligning with the air hole, such that air can be exhausted via the air hole and the air channel when encapsulation material is filling the mold apparatus.
摘要:
A non-contact pick-up device is disclosed. The non-contact pick-up device mainly includes a disk, and a plurality of air nozzles on the disk. Each nozzle has an air channel; and an upper end of the channel is tilt outwards. Therefore, as a disc-shaped article is placed on the disk; air jets out from the nozzles, due to Bernoulli principle, pressure difference is formed on the disc-shaped article. Thus, due to the action of atmosphere pressure, the disc-shaped article will be clamped. The pick-up device may be used in semiconductor manufacturing process for clamping a wafer.
摘要:
A method of manufacturing a solar cell includes the steps of: providing a substrate having a front side, a back side and a doped region; forming a conductor layer on the front side; firing the conductor layer at a temperature such that the conductor layer is formed with a first portion embedded into the doped region and a second portion other than the first portion; forming an anti-reflection coating (ARC) layer on the front side and the second portion, wherein the ARC layer covers the conductor layer so that the second portion of the conductor layer is disposed in the ARC layer; and removing the ARC layer on the conductor layer so that the conductor layer has an exposed surface exposed out of the ARC layer, wherein the exposed surface of the conductor layer is substantially flush with a first exposed surface of the ARC layer.
摘要:
A method of manufacturing a solar cell comprises the steps of: forming a lower conductor layer on a front side of a substrate; firing the lower conductor layer at a first temperature to form a first portion embedded into a doped region of the substrate and a second portion; forming an anti-reflection coating (ARC) layer on the front side and the second portion, wherein the ARC layer covers the lower conductor layer such that the second portion is disposed in the ARC layer; forming an upper conductor layer, corresponding to the lower conductor layer and electrically connected to the lower conductor layer, on the ARC layer; and firing the upper conductor layer at a second temperature to form a first portion embedded into the ARC layer and a second portion, which is exposed out of the ARC layer.