公开(公告)号：US10290805B2

公开(公告)日：2019-05-14

申请号：US15888515

申请日：2018-02-05

Applicant: Infineon Technologies Dresden GmbH

Inventor： Steffen Bieselt ,  Heiko Froehlich ,  Thoralf Kautzsch ,  Maik Stegemann ,  Mirko Vogt

IPC: H01L49/00 ,  G01J3/00 ,  G01J3/10 ,  G01J3/42

Abstract: A method for manufacturing an emitter comprises providing a semiconductor substrate having a main surface, the semiconductor substrate comprising a cavity adjacent to the main surface. A portion of the semiconductor substrate arranged between the cavity and the main surface of the semiconductor substrate forms a support structure. The method comprises arranging an emitting element at the support structure, the emitting element being configured to emit a thermal radiation of the emitter, wherein the cavity provides a reduction of a thermal coupling between the emitting element and the semiconductor substrate.

公开(公告)号：US09887355B2

公开(公告)日：2018-02-06

申请号：US15079472

申请日：2016-03-24

Applicant: Infineon Technologies Dresden GmbH

Inventor： Steffen Bieselt ,  Heiko Froehlich ,  Thoralf Kautzsch ,  Maik Stegemann ,  Mirko Vogt

IPC: H01L27/15 ,  H01L49/00 ,  G01J3/00

CPC classification number: H01L49/00 ,  G01J3/00 ,  G01J3/108 ,  G01J3/42

Abstract: A method for manufacturing an emitter comprises providing a semiconductor substrate having a main surface, the semiconductor substrate comprising a cavity adjacent to the main surface. A portion of the semiconductor substrate arranged between the cavity and the main surface of the semiconductor substrate forms a support structure. The method comprises arranging an emitting element at the support structure, the emitting element being configured to emit a thermal radiation of the emitter, wherein the cavity provides a reduction of a thermal coupling between the emitting element and the semiconductor substrate.

公开(公告)号：US09663355B2

公开(公告)日：2017-05-30

申请号：US14835001

申请日：2015-08-25

Applicant: Infineon Technologies Dresden GmbH

Inventor： Thoralf Kautzsch ,  Heiko Froehlich ,  Mirko Vogt ,  Maik Stegemann

IPC: B32B3/24 ,  B81C1/00 ,  G01N33/487 ,  G01N27/414 ,  G01N27/447 ,  H01L21/306 ,  H01L29/06

CPC classification number: B81C1/00619 ,  B81C1/00047 ,  B81C1/00476 ,  G01N27/414 ,  G01N27/4473 ,  G01N33/48721 ,  H01L21/30604 ,  H01L29/06

Abstract: Embodiments relate to structures, systems and methods for more efficiently and effectively etching sacrificial and other layers in substrates and other structures. In embodiments, a substrate in which a sacrificial layer is to be removed to, e.g., form a cavity comprises an etch dispersion system comprising a trench, channel or other structure in which etch gas or another suitable gas, fluid or substance can flow to penetrate the substrate and remove the sacrificial layer. The trench, channel or other structure can be implemented along with openings or other apertures formed in the substrate, such as proximate one or more edges of the substrate, to even more quickly disperse etch gas or some other substance within the substrate.

公开(公告)号：US20170089790A1

公开(公告)日：2017-03-30

申请号：US15372992

申请日：2016-12-08

Applicant: Infineon Technologies Dresden GmbH

Inventor： Thoralf Kautzsch ,  Heiko Froehlich ,  Mirko Vogt ,  Maik Stegemann ,  Andre Roeth ,  Bernhard Winkler ,  Boris Binder

IPC: G01L9/00

CPC classification number: G01L9/0072 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81C1/00158 ,  G01L9/0041 ,  G01L9/0073

Abstract: Embodiments relate to sensors and more particularly to structures for and methods of forming sensors that are easier to manufacture as integrated components and provide improved deflection of a sensor membrane, lamella or other movable element. In embodiments, a sensor comprises a support structure for a lamella, membrane or other movable element. The support structure comprises a plurality of support elements that hold or carry the movable element. The support elements can comprise individual points or feet-like elements, rather than a conventional interconnected frame, that enable improved motion of the movable element, easier removal of a sacrificial layer between the movable element and substrate during manufacture and a more favorable deflection ratio, among other benefits.

公开(公告)号：US09452923B2

公开(公告)日：2016-09-27

申请号：US13722248

申请日：2012-12-20

Applicant: Infineon Technologies Dresden GmbH

Inventor： Thoralf Kautzsch ,  Heiko Froehlich ,  Mirko Vogt ,  Maik Stegemann

IPC: H01L41/00 ,  B81C1/00 ,  H01L41/09

CPC classification number: B81C1/00158 ,  B81C1/00476 ,  B81C2203/0145 ,  H01L41/0933

Abstract: A method for manufacturing a micromechanical system includes creating a sacrificial layer at a substrate surface. A structural material is deposited at a sacrificial layer surface and at a support structure for later supporting the structural material. At least one hole is created in the structural material extending from an exposed surface of the structural material to the surface of the sacrificial layer. The at least one hole leads to a margin region of the sacrificial layer. The sacrificial layer is removed using a removal process through the at least one hole, to obtain a cavity between the surface of the substrate and the structural material. The method also includes filling the at least one hole and a portion of the cavity beneath the at least one hole close to the cavity. A corresponding micromechanical system and a microelectromechanical transducer are also described.

Abstract translation: 微机械系统的制造方法包括在基板表面上形成牺牲层。 结构材料沉积在牺牲层表面和支撑结构处，用于稍后支撑结构材料。 在从结构材料的暴露表面延伸到牺牲层的表面的结构材料中产生至少一个孔。 至少一个孔通向牺牲层的边缘区域。 使用通过至少一个孔的去除工艺去除牺牲层，以在基材的表面和结构材料之间获得空腔。 该方法还包括在靠近空腔的至少一个孔的下方填充至少一个孔和空腔的一部分。 还描述了相应的微机械系统和微机电换能器。

公开(公告)号：US20160104625A1

公开(公告)日：2016-04-14

申请号：US14512916

申请日：2014-10-13

Applicant: Infineon Technologies Dresden GmbH

Inventor： Thoralf Kautzsch ,  Heiko Fröhlich ,  Mirko Vogt ,  Maik Stegemann ,  Andre Röth ,  Steffen Bieselt

IPC: H01L21/3065 ,  H01L29/84

CPC classification number: B81B7/02 ,  B81B2201/0235 ,  B81B2201/0264 ,  B81B2207/015 ,  B81C1/00246 ,  B81C2203/0764 ,  H01L21/3065 ,  H01L29/84

Abstract: Embodiments relate to integrated circuit sensors, and more particularly to sensors integrated in an integrated circuit structure and methods for producing the sensors. In an embodiment, a sensor device comprises a substrate; a first trench in the substrate; a first moveable element suspended in the first trench by a first plurality of support elements spaced apart from one another and arranged at a perimeter of the first moveable element; and a first layer arranged on the substrate to seal the first trench, thereby providing a first cavity containing the first moveable element and the first plurality of support elements

Abstract translation: 实施例涉及集成电路传感器，更具体地涉及集成在集成电路结构中的传感器和用于产生传感器的方法。 在一个实施例中，传感器装置包括衬底; 衬底中的第一沟槽; 第一可移动元件，其通过彼此间隔开并布置在第一可移动元件的周边的第一多个支撑元件悬挂在第一沟槽中; 以及布置在所述基板上以密封所述第一沟槽的第一层，从而提供包含所述第一可移动元件和所述第一多个支撑元件的第一空腔