公开(公告)号：US10930570B2

公开(公告)日：2021-02-23

申请号：US16723148

申请日：2019-12-20

Applicant: InnoLux Corporation

Inventor： Chia-Hsiung Chang ,  Ting-Kai Hung ,  Hsiao-Lang Lin

IPC: H01L21/00 ,  H01L21/66 ,  H01L25/16 ,  H01L25/00 ,  H01L33/44 ,  H01L33/52 ,  H01L33/62 ,  H01L33/50 ,  H01L33/60 ,  H01L27/12

Abstract: Methods for manufacturing a display device are provided. A representative method includes: providing a substrate having a plurality of sub-pixel locations; providing a carrier substrate supporting a plurality of light emitting diodes (LEDs); conducting a testing to at least one of the plurality of LEDs on the carrier substrate; transferring at least a portion of the plurality of LEDs from the carrier substrate to the substrate; fixing the portion of the plurality of LEDs to the substrate; providing an insulator over the substrate; and providing a first electrode electrically connected to at least one of the portion of the plurality of LEDs.

公开(公告)号：US10483436B2

公开(公告)日：2019-11-19

申请号：US16053786

申请日：2018-08-02

Applicant: Innolux Corporation

Inventor： Kuan-Feng Lee ,  Ting-Kai Hung ,  Yu-Hsien Wu ,  Chia-Hsiung Chang

IPC: H01L29/06 ,  H01L33/46 ,  H01L27/15 ,  H01L33/62 ,  H01L33/22 ,  H01L33/06 ,  H01L33/32 ,  H01L33/00 ,  H01L33/64

Abstract: A display apparatus is provided. The display apparatus includes a substrate, a transistor, a metal layer, and a light-emitting diode. The transistor is disposed on the substrate. The metal layer is disposed on the transistor and electrically connected to the transistor, wherein a first distance is between the upper surface of the metal layer and the substrate in a direction perpendicular to the substrate. The light-emitting diode is disposed on the metal layer, wherein the light-emitting diode includes a light-emitting diode body and an electrode, the light-emitting diode body is electrically connected to the metal layer via the electrode, the light-emitting diode body has a first surface and a second surface opposite to the first surface, the first surface and the second surface are parallel to the substrate, and in the direction above, a second distance is between the first surface and the second surface, wherein the ratio of the second distance to the first distance is greater than or equal to 0.25 and less than or equal to 6.

公开(公告)号：US09791952B2

公开(公告)日：2017-10-17

申请号：US14663879

申请日：2015-03-20

Applicant: InnoLux Corporation

Inventor： Chia-Hsiung Chang ,  Yang-Chen Chen ,  Mei-Chun Shih

IPC: G06F3/041 ,  G06F3/044

CPC classification number: G06F3/0412 ,  G06F3/044 ,  G06F2203/04112

Abstract: Disclosed is a touch display apparatus including a display panel, a substrate and a touch-sensing layer thereon. The substrate is disposed above the display panel and includes a touch-sensing region and a non-touch-sensing region. The touch-sensing layer includes a first trace, and at least a part of the first trace is disposed above the non-touch-sensing region. A mesh pattern is formed on a surface of the first trace.

公开(公告)号：US09681545B2

公开(公告)日：2017-06-13

申请号：US15187371

申请日：2016-06-20

Applicant: INNOLUX CORPORATION

Inventor： Chia-Cheng Liu ,  Chia-Hsiung Chang ,  An-Chang Wang ,  Chao-Hsiang Wang ,  Yang-Chen Chen

IPC: H05K1/11 ,  H05K1/09 ,  H01L23/00 ,  H05K3/32 ,  G02F1/1345 ,  H01L23/492

CPC classification number: H05K1/111 ,  G02F1/1345 ,  G02F1/13458 ,  H01L23/4922 ,  H01L24/06 ,  H01L24/07 ,  H01L24/09 ,  H01L24/26 ,  H01L24/31 ,  H01L24/32 ,  H01L24/33 ,  H01L24/83 ,  H01L2225/1041 ,  H01L2924/13069 ,  H01L2924/365 ,  H05K1/092 ,  H05K1/117 ,  H05K3/323 ,  H05K2201/10136

Abstract: A substrate structure includes a first substrate, a plurality of first bonding pads, a second substrate and a connecting layer. The first substrate has an element configuration area and a peripheral area. The peripheral area is located around the element configuration area. The first bonding pads are configured spacing at the peripheral area, and a gap is provided between two adjacent first bonding pads. The first bonding pads are located between the first substrate and the second substrate. The connecting layer is located between the first bonding pads and the second substrate. The part of the connecting layer close to the element configuration area is configured with a plurality of first arc edges.