Three-dimensional nanoribbon-based logic

    公开(公告)号:US11018264B1

    公开(公告)日:2021-05-25

    申请号:US16715135

    申请日:2019-12-16

    Abstract: Described herein are three-dimensional nanoribbon-based logic ICs that include one of more of 1) individual gate control in a vertical stack of nanoribbons, 2) inter-ribbon interconnects in a vertical stack of nanoribbons, and 3) both P- and N-type nanoribbons in a vertical stack of nanoribbons. Using one or more of these features may help realize unique monolithic 3D logic architectures that were not possible with conventional logic circuits and may allow realizing logic devices with favorable metrics in terms of power and performance while preserving the substrate area and cost.

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