公开(公告)号：US20190017844A1

公开(公告)日：2019-01-17

申请号：US16136589

申请日：2018-09-20

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： William L. BRODSKY ,  Silvio DRAGONE ,  Roger S. KRABBENHOFT ,  David C. LONG ,  Stefano S. OGGIONI ,  Michael T. PEETS ,  William SANTIAGO-FERNANDEZ

IPC: G01D5/16 ,  H05K1/02 ,  H05K3/32 ,  H05K3/30 ,  H05K1/18

CPC classification number: G01D5/16 ,  H05K1/0275 ,  H05K1/0298 ,  H05K1/182 ,  H05K3/30 ,  H05K3/32 ,  H05K2201/09263 ,  H05K2201/096 ,  H05K2201/10151 ,  H05K2201/10371

Abstract: Methods of fabricating electronic circuits and electronic packages are provided. The electronic circuit includes a multilayer circuit board, and a tamper-respondent sensor embedded within the circuit board. The tamper-respondent sensor defines, at least in part, a secure volume associated with the multilayer circuit board. In certain implementations, the tamper-respondent sensor includes multiple tamper-respondent layers embedded within the circuit board including, for instance, one or more tamper-respondent frames and one or more tamper-respondent mat layers, with the tamper-respondent frame(s) being disposed, at least in part, above the tamper-respondent mat layer(s), which together define the secure volume where extending into the multilayer circuit board. In certain embodiments, one or more of the tamper-respondent layers are divided into multiple, separate tamper-respondent circuit zones, with the tamper-respondent layers, including the circuit zones, being electrically connected to monitor circuitry within the secure volume.

公开(公告)号：US20180235081A1

公开(公告)日：2018-08-16

申请号：US15430842

申请日：2017-02-13

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： William L. BRODSKY ,  James A. BUSBY ,  John R. DANGLER ,  Silvio DRAGONE ,  Michael J. FISHER ,  David C. LONG

IPC: H05K1/02 ,  H05K1/18 ,  G01N27/20

CPC classification number: H05K1/0275 ,  H05K1/185 ,  H05K2201/10151

Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include an enclosure, an in-situ-formed tamper-detect sensor, and one or more flexible tamper-detect sensors. The enclosure encloses, at least in part, one or more electronic components to be protected, and the in-situ-formed tamper-detect sensor is formed in place over an inner surface of the enclosure. The flexible tamper-detect sensor(s) is disposed over the in-situ-formed tamper-detect sensor, such that the in-situ-formed tamper-detect sensor is between the inner surface of the enclosure and the flexible tamper-detect sensor(s). Together the in-situ-formed tamper-detect sensor and flexible tamper-detect sensor(s) facilitate defining, at least in part, a secure volume about the one or more electronic components.

公开(公告)号：US20180110165A1

公开(公告)日：2018-04-19

申请号：US15835585

申请日：2017-12-08

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Michael J. FISHER ,  David C. LONG ,  Michael T. PEETS ,  Thomas WEISS

IPC: H05K13/00 ,  H05K3/10

CPC classification number: H05K13/00 ,  H05K3/10 ,  H05K5/0208

Abstract: Methods of fabricating tamper-respondent assemblies are provided which include an electronic enclosure, a tamper-respondent electronic circuit structure, and at least one security element. The electronic enclosure encloses, at least in part, at least one electronic component to be protected, and includes an inner surface. The tamper-respondent electronic circuit structure includes a tamper-respondent sensor covering, at least in part, the inner surface of the electronic enclosure, and the at least one security element overlies and physically secures in place, at least in part, the tamper-respondent sensor covering, at least in part, the inner surface of the electronic enclosure. In enhanced embodiments, the electronic enclosure is secured to a multilayer circuit board which includes an embedded tamper-respondent sensor, and together, the tamper-respondent sensor covering the inner surface of the electronic enclosure and the embedded tamper-respondent sensor within the multilayer circuit board define a secure volume about the electronic component(s).

公开(公告)号：US20170094805A1

公开(公告)日：2017-03-30

申请号：US15249676

申请日：2016-08-29

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： John R. DANGLER ,  David C. LONG ,  Michael T. PEETS

IPC: H05K3/10

CPC classification number: H05K3/10 ,  H05K1/0213 ,  H05K1/0275 ,  H05K1/028 ,  H05K1/09 ,  H05K2201/055 ,  H05K2201/09263

Abstract: Methods of fabricating tamper-respondent assemblies provided which include a tamper-respondent electronic circuit structure. The tamper-respondent electronic circuit structure includes a tamper-respondent sensor. The tamper-respondent sensor includes, for instance, at least one flexible layer having opposite first and second sides, and circuit lines forming, at least in part, at least one tamper-detect network, such as one or more resistive networks. The circuit lines are disposed on at least one of the first side or the second side of the at least one flexible layer. At least one region of the tamper-respondent sensor is fabricated with increased susceptibility to damage from mechanical stress associated with a tamper event. The at least one region of increased susceptibility to damage facilitates detection of the tamper event by the tamper-respondent sensor.

公开(公告)号：US20170094804A1

公开(公告)日：2017-03-30

申请号：US15249671

申请日：2016-08-29

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： William L. BRODSKY ,  John R. DANGLER ,  Phillip Duane ISAACS ,  David C. LONG ,  Michael T. PEETS

IPC: H05K3/10

CPC classification number: G06F21/87 ,  G06F21/75 ,  H01R12/59 ,  H05K1/0275 ,  H05K5/0208 ,  H05K5/03 ,  H05K2201/055 ,  H05K2201/056

Abstract: Methods of fabricating tamper-respondent assemblies and electronic assembly packages are provided which include multiple, discrete tamper-respondent sensors that overlap, at least in part, and facilitate defining a secure volume about one or more electronic components to be protected, such as an electronic assembly. The tamper-respondent sensors include a first tamper-respondent sensor and a second tamper-respondent sensor, which may be similarly constructed or differently constructed. In certain embodiments, the tamper-respondent sensors wrap, at least in part, over an electronic enclosure, and in other embodiments, the tamper-respondent sensors cover, at least in part, an inner surface of an electronic enclosure to facilitate defining a secure volume in association with a multilayer circuit board to which the electronic enclosure is mounted.

公开(公告)号：US20170094784A1

公开(公告)日：2017-03-30

申请号：US14865632

申请日：2015-09-25

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： William L. BRODSKY ,  James A. BUSBY ,  Phillip Duane ISAACS ,  David C. LONG

IPC: H05K1/02 ,  H05K3/30 ,  H05K1/09 ,  H05K7/02 ,  H05K1/03 ,  H05K1/18

CPC classification number: H05K1/0275 ,  H05K1/0298 ,  H05K1/034 ,  H05K1/09 ,  H05K1/183 ,  H05K3/12 ,  H05K3/30 ,  H05K3/301 ,  H05K3/46 ,  H05K5/0208 ,  H05K7/023 ,  H05K2201/015 ,  H05K2201/05 ,  H05K2201/055 ,  H05K2201/056

Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include a tamper-respondent electronic circuit structure. The tamper-respondent electronic circuit structure includes a tamper-respondent sensor. The tamper-respondent sensor includes, for instance, at least one flexible layer having opposite first and second sides, and circuit lines forming at least one resistive network. The circuit lines are disposed on at least one of the first or second side of the at least one flexible layer, and have a line width Wl≦200 μm, as well as a line-to-line spacing width Ws≦200 μm. In certain enhanced embodiments, the tamper-respondent sensor includes multiple flexible layers, with a first flexible layer having first circuit lines, and a second flexible layer having second circuit lines, where the first and second circuit lines may have different line widths, different line-to-line spacings, and/or be formed of different materials.

公开(公告)号：US20170094783A1

公开(公告)日：2017-03-30

申请号：US14865591

申请日：2015-09-25

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： John R. DANGLER ,  David C. LONG ,  Michael T. PEETS

IPC: H05K1/02 ,  H05K3/10 ,  H05K1/09

CPC classification number: H05K1/0275 ,  H05K1/0213 ,  H05K1/028 ,  H05K1/09 ,  H05K3/10 ,  H05K2201/055 ,  H05K2201/09263

Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include a tamper-respondent electronic circuit structure. The tamper-respondent electronic circuit structure includes a tamper-respondent sensor. The tamper-respondent sensor includes, for instance, at least one flexible layer having opposite first and second sides, and circuit lines forming, at least in part, at least one tamper-detect network, such as one or more resistive networks. The circuit lines are disposed on at least one of the first side or the second side of the at least one flexible layer. At least one region of the tamper-respondent sensor is fabricated with increased susceptibility to damage from mechanical stress associated with a tamper event. The at least one region of increased susceptibility to damage facilitates detection of the tamper event by the tamper-respondent sensor.

公开(公告)号：US20170089729A1

公开(公告)日：2017-03-30

申请号：US14865610

申请日：2015-09-25

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： William L. BRODSKY ,  Silvio DRAGONE ,  Roger S. KRABBENHOFT ,  David C. LONG ,  Stefano S. OGGIONI ,  Michael T. PEETS ,  William SANTIAGO-FERNANDEZ

IPC: G01D5/16 ,  H05K1/02 ,  H05K1/18

CPC classification number: G01D5/16 ,  H05K1/0275 ,  H05K1/0298 ,  H05K1/182 ,  H05K3/30 ,  H05K3/32 ,  H05K2201/09263 ,  H05K2201/096 ,  H05K2201/10151 ,  H05K2201/10371

Abstract: Electronic circuits, electronic packages, and methods of fabrication are provided. The electronic circuit includes a multilayer circuit board, and a tamper-respondent sensor embedded within the circuit board. The tamper-respondent sensor defines, at least in part, a secure volume associated with the multilayer circuit board. In certain implementations, the tamper-respondent sensor includes multiple tamper-respondent layers embedded within the circuit board including, for instance, one or more tamper-respondent frames and one or more tamper-respondent mat layers, with the tamper-respondent frame(s) being disposed, at least in part, above the tamper-respondent mat layer(s), which together define the secure volume where extending into the multilayer circuit board. In certain embodiments, one or more of the tamper-respondent layers are divided into multiple, separate tamper-respondent circuit zones, with the tamper-respondent layers, including the circuit zones, being electrically connected to monitor circuitry within the secure volume.