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    ENCLOSURE WITH INNER TAMPER-RESPONDENT SENSOR(S) AND PHYSICAL SECURITY ELEMENT(S)
    2.
    发明申请
    ENCLOSURE WITH INNER TAMPER-RESPONDENT SENSOR(S) AND PHYSICAL SECURITY ELEMENT(S) 审中-公开

    公开(公告)号：US20180110165A1

    公开(公告)日：2018-04-19

    申请号：US15835585

    申请日：2017-12-08

    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

    Inventor： Michael J. FISHER ,  David C. LONG ,  Michael T. PEETS ,  Thomas WEISS

    IPC: H05K13/00 ,  H05K3/10

    CPC classification number: H05K13/00 ,  H05K3/10 ,  H05K5/0208

    Abstract: Methods of fabricating tamper-respondent assemblies are provided which include an electronic enclosure, a tamper-respondent electronic circuit structure, and at least one security element. The electronic enclosure encloses, at least in part, at least one electronic component to be protected, and includes an inner surface. The tamper-respondent electronic circuit structure includes a tamper-respondent sensor covering, at least in part, the inner surface of the electronic enclosure, and the at least one security element overlies and physically secures in place, at least in part, the tamper-respondent sensor covering, at least in part, the inner surface of the electronic enclosure. In enhanced embodiments, the electronic enclosure is secured to a multilayer circuit board which includes an embedded tamper-respondent sensor, and together, the tamper-respondent sensor covering the inner surface of the electronic enclosure and the embedded tamper-respondent sensor within the multilayer circuit board define a secure volume about the electronic component(s).

    ENCLOSURE-TO-BOARD INTERFACE WITH TAMPER-DETECT CIRCUIT(S)
    3.
    发明申请
    ENCLOSURE-TO-BOARD INTERFACE WITH TAMPER-DETECT CIRCUIT(S) 审中-公开

    公开(公告)号：US20190261506A1

    公开(公告)日：2019-08-22

    申请号：US16285437

    申请日：2019-02-26

    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

    Inventor： Kathleen Ann FADDEN ,  James A. BUSBY ,  David C. LONG ,  John R. DANGLER ,  Alexandra ECHEGARAY ,  Michael J. FISHER ,  William SANTIAGO-FERNANDEZ

    IPC: H05K1/02 ,  H05K1/18 ,  H05K1/11

    Abstract: Tamper-respondent assemblies and fabrication methods are provided which incorporate enclosure-to-circuit board protection. The tamper-respondent assemblies include a circuit board, and an enclosure mounted to the circuit board along an enclosure-to-board interface. The enclosure facilitates enclosing at least one electronic component coupled to the circuit board within a secure volume. A tamper-respondent electronic circuit structure facilitates defining the secure volume, and includes one or more tamper-detect circuits including at least one conductive trace disposed, at least in part, within the enclosure-to-board interface. The conductive trace(s) includes stress rise regions to facilitate tamper-detection at the enclosure-to-board interface. An adhesive is provided to secure the enclosure to the circuit board. The adhesive contacts, at least in part, the conductive trace(s) of the tamper-detect circuit(s) at the enclosure-to-board interface, including at the stress rise regions of the conductive trace(s).

    TAMPER-RESPONDENT ASSEMBLY WITH INTERCONNECT CHARACTERISTIC(S) OBSCURING CIRCUIT LAYOUT
    8.
    发明申请
    TAMPER-RESPONDENT ASSEMBLY WITH INTERCONNECT CHARACTERISTIC(S) OBSCURING CIRCUIT LAYOUT 审中-公开

    公开(公告)号：US20200045812A1

    公开(公告)日：2020-02-06

    申请号：US16596941

    申请日：2019-10-09

    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

    Inventor： James A. BUSBY ,  John R. DANGLER ,  Michael J. FISHER ,  David C. LONG

    IPC: H05K1/02 ,  G06F21/86 ,  H05K1/11 ,  H05K1/18 ,  H05K5/02 ,  G01N27/04 ,  G06F21/87

    Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include at least one tamper-respondent sensor and a detector. The at least one tamper-respondent sensor includes conductive lines which form, at least in part, at least one tamper-detect network of the tamper-respondent sensor(s). In addition, the tamper-respondent sensor(s) includes at least one interconnect element associated with one or more conductive lines of the conductive lines forming, at least in part, the tamper-detect network(s). The interconnect element(s) includes at least one interconnect characteristic selected to facilitate obscuring a circuit lay of the at least one tamper-detect network. The at least one interconnect element is undetectable by x-ray, and the conductive lines are detectable by x-ray. In operation, the detector monitors the tamper-detect network(s) of the tamper-respondent sensor(s) for a tamper event.

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