Abstract:
A driving circuit includes a current drive unit and a reset compensation and light emitting control circuit. The current drive unit includes a first transistor and a second transistor. The first transistor and the second transistor are connected in series, wherein the first transistor and the second transistor include a silicon semiconductor layer. The reset compensation and light emitting control circuit is coupled to the current drive unit. The reset compensation and light emitting control circuit includes a third transistor connected to a control terminal of the first transistor, wherein the third transistor is an oxide semiconductor transistor.
Abstract:
A display device is provided. The display device includes a substrate and an insulating layer disposed on the substrate and having a recess. The display device also includes an organic layer disposed on the insulating layer. The display device also includes at least one light emitting unit disposed in the recess and a conductive layer disposed on the light emitting unit.
Abstract:
A touch display device is provided. The touch display device includes a substrate; a driving structure layer disposed on the substrate, wherein the driving structure layer including a first switch and a second switch; a display structure layer disposed on the driving structure layer; an insulating layer disposed on the display structure layer; and a touch structure layer disposed on the insulating layer, wherein the touch structure layer is electrically connected to the first switch, and the first switch is electrically connected to the second switch.
Abstract:
A display device is provided, which includes a substrate including a pixel region; a metal oxide semiconductor transistor disposed over the substrate and including: a metal oxide semiconductor layer, a first gate electrode overlapping with the metal oxide semiconductor layer; and a gate insulating layer disposed between the metal oxide semiconductor layer and the first gate electrode, and the gate insulating layer having a first opening, wherein the first opening and the pixel region overlap; a second insulating layer disposed over the metal oxide semiconductor layer and having a via and a second opening, wherein the second opening and the pixel region overlap; and a pixel electrode electrically connected to the metal oxide semiconductor layer through the via.
Abstract:
A display device is provided. The display device includes a substrate having a surface including a display area and a non-display area adjacent to the display area; a plurality of light-emitting diodes disposed on the display area of the substrate, wherein the light-emitting diode includes a contact electrode; and an anisotropic conductive layer disposed between the substrate and the plurality of light-emitting diodes, wherein the anisotropic conductive layer has a cross-sectional sidewall profile, and at least a part of the cross-sectional sidewall profile of the anisotropic conductive layer is in a shape of curve.
Abstract:
A display device is disclosed, which includes: a first substrate; a first thin film transistor disposed on the first substrate; a second thin film transistor disposed on the first substrate; a first capacitance electrode; and a second capacitance electrode. The first thin film transistor includes: a first semiconductor layer comprising silicon; and a first electrode electrically connected to the first semiconductor layer. The second thin film transistor includes: a second semiconductor layer comprising metal oxide; and a second electrode electrically connected to the second semiconductor layer. The first capacitance electrode is electrically connected to the first electrode, the second capacitance electrode is electrically connected to the second electrode, and the second capacitance electrode and the first capacitance electrode overlap.
Abstract:
A display device is provided. A thin film transistor structure of the display device includes a substrate, a gate electrode disposed on the substrate, a gate insulation layer disposed on the substrate and the gate electrode, a channel layer on the gate insulation layer and corresponding to the gate electrode, and a source electrode and a drain electrode contacting two sides of the channel layer, respectively, and extending onto the gate insulation layer. The channel layer includes a first metal oxide semiconductor layer, which includes (1) tin and (2) at least one of gallium, hafnium, and aluminum.
Abstract:
A display panel and a display are disclosed. A display panel has an active area and a peripheral area disposed adjacent to the active area and comprises a first substrate, a second substrate, a first insulating layer, a second insulating layer and an organic layer. The second substrate is disposed opposite the first substrate. The first insulating layer is disposed on the side of the first substrate facing the second substrate. The organic layer covers the first insulating layer. The second insulating layer covers the organic layer and includes at least a first opening which is disposed in the peripheral area and exposes the organic layer.
Abstract:
An embodiment of the invention provides a thin film transistor substrate includes: a substrate; and a plurality of transistors, wherein each of the transistors includes a gate electrode disposed on the substrate; a first diffusion barrier layer disposed on the substrate and covering an upper surface and a ring sidewall of the gate electrode; a gate insulating layer disposed on the first diffusion barrier layer; an active layer disposed on the gate insulating layer and over the gate electrode; a source electrode disposed on the substrate and electrically connected to the active layer; a drain electrode disposed on the substrate and electrically connected to the active layer; and a protective layer covering the source electrode and the drain electrode.
Abstract:
An embodiment of the invention provides a manufacturing method of a thin-film transistor includes: providing a substrate; sequentially forming a gate electrode, a gate insulating layer, and an active layer on the substrate; forming an insulating metal oxide layer covering the active layer, wherein the insulating metal oxide layer including a metal oxide of a first metal; forming a metal layer covering the active layer, wherein the metal layer includes a second metal; forming a source electrode and a drain electrode on the metal layer with a trench separating therebetween; removing the metal layer exposed by the trench; and performing an annealing process to the metal layer and the insulating metal oxide layer, such that the metal layer reacts with the insulating metal oxide layer overlapping the metal layer to form a conducting composite metal oxide layer including the first metal and the second metal.