公开(公告)号：US20170085173A1

公开(公告)日：2017-03-23

申请号：US15366650

申请日：2016-12-01

申请人： International Business Machines Corporation

发明人： Paul S. Andry ,  Leland Chang ,  Evan G. Colgan ,  John U. Knickerbocker ,  Bucknell C. Webb ,  Robert Wisnieff

IPC分类号： H02M3/156 ,  G06F1/26 ,  H01L25/065 ,  H01L23/64 ,  H01L23/00

CPC分类号： H02M3/156 ,  G05F3/02 ,  G06F1/26 ,  G06F1/263 ,  G06F1/266 ,  H01L23/5286 ,  H01L23/64 ,  H01L23/642 ,  H01L23/645 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L25/065 ,  H01L25/0657 ,  H01L25/16 ,  H01L25/18 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16265 ,  H01L2224/1703 ,  H01L2224/17181 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2924/1436 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19103 ,  H02M1/08 ,  H05K1/00 ,  Y10T29/49117 ,  H01L2224/11 ,  H01L2924/014

摘要： A switching power supply in an integrated circuit, an integrated circuit comprising a switching power supply, and a method of assembling a switching power supply in an integrated circuit are disclosed. In one embodiment, the invention provides a three-dimensional switching power supply in an integrated circuit comprising a device layer. The switching power supply comprises three distinct strata arranged in series with the device layer, the three distinct strata including a switching layer including switching circuits, a capacitor layer including banks of capacitors, and an inductor layer including inductors. This switching power supply further comprises a multitude of connectors electrically and mechanically connecting together the device layer, the switching layer, the capacitor layer, and the inductor layer. The switching circuits, the capacitors and the inductors form a switching power supply for supplying power to the device layer.

公开(公告)号：US09520779B2

公开(公告)日：2016-12-13

申请号：US15072675

申请日：2016-03-17

申请人： International Business Machines Corporation

发明人： Paul S. Andry ,  Leland Chang ,  Evan G. Colgan ,  John U. Knickerbocker ,  Bucknell C. Webb ,  Robert Wisnieff

IPC分类号： G05F3/02 ,  H02M3/156 ,  H01L23/64 ,  H01L23/00 ,  H01L25/065 ,  G06F1/26

CPC分类号： H02M3/156 ,  G05F3/02 ,  G06F1/26 ,  G06F1/263 ,  G06F1/266 ,  H01L23/5286 ,  H01L23/64 ,  H01L23/642 ,  H01L23/645 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L25/065 ,  H01L25/0657 ,  H01L25/16 ,  H01L25/18 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16265 ,  H01L2224/1703 ,  H01L2224/17181 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2924/1436 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19103 ,  H02M1/08 ,  H05K1/00 ,  Y10T29/49117 ,  H01L2224/11 ,  H01L2924/014

摘要： A switching power supply in an integrated circuit, an integrated circuit comprising a switching power supply, and a method of assembling a switching power supply in an integrated circuit are disclosed. In one embodiment, the invention provides a three-dimensional switching power supply in an integrated circuit comprising a device layer. The switching power supply comprises three distinct strata arranged in series with the device layer, the three distinct strata including a switching layer including switching circuits, a capacitor layer including banks of capacitors, and an inductor layer including inductors. This switching power supply further comprises a multitude of connectors electrically and mechanically connecting together the device layer, the switching layer, the capacitor layer, and the inductor layer. The switching circuits, the capacitors and the inductors form a switching power supply for supplying power to the device layer.

公开(公告)号：US20150373879A1

公开(公告)日：2015-12-24

申请号：US14837742

申请日：2015-08-27

申请人： International Business Machines Corporation

发明人： Evan G. Colgan ,  Taryn J. Davis ,  Chenzhou Lian ,  Yi Pan ,  Kamal K. Sikka ,  Jeffrey A. Zitz

IPC分类号： H05K7/20

CPC分类号： H01L23/34 ,  H01L23/36 ,  H01L23/367 ,  H01L23/373 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/3511 ,  H05K7/20509 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Embodiments of the invention comprise a homogeneous heat spreading cap element in chip packages to facilitate better heat spreading and dissipation. The heat spreading cap comprises a single high-K graphite layer supported by a copper frame for increased stability and reduced thermal warpage during handling and operation while minimizing thermal penalty by reducing the amount of material having a relatively low heat conductivity that is needed in conventional heat spreading caps.

公开(公告)号：US20150371919A1

公开(公告)日：2015-12-24

申请号：US14838524

申请日：2015-08-28

申请人： International Business Machines Corporation

发明人： Evan G. Colgan ,  Taryn J. Davis ,  Chenzhou Lian ,  Yi Pan ,  Kamal K. Sikka ,  Jeffrey A. Zitz

IPC分类号： H01L23/367

CPC分类号： H01L23/34 ,  H01L23/36 ,  H01L23/367 ,  H01L23/373 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/3511 ,  H05K7/20509 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Embodiments of the invention comprise a homogeneous heat spreading cap element in chip packages to facilitate better heat spreading and dissipation. The heat spreading cap comprises a single high-K graphite layer supported by a copper frame for increased stability and reduced thermal warpage during handling and operation while minimizing thermal penalty by reducing the amount of material having a relatively low heat conductivity that is needed in conventional heat spreading caps.

公开(公告)号：US20150371918A1

公开(公告)日：2015-12-24

申请号：US14837871

申请日：2015-08-27

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： Evan G. Colgan ,  Taryn J. Davis ,  Chenzhou Lian ,  Yi Pan ,  Kamal K. Sikka ,  Jeffrey A. Zitz

IPC分类号： H01L23/367

CPC分类号： H01L23/34 ,  H01L23/36 ,  H01L23/367 ,  H01L23/373 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/3511 ,  H05K7/20509 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Embodiments of the invention comprise a homogeneous heat spreading cap element in chip packages to facilitate better heat spreading and dissipation. The heat spreading cap comprises a single high-K graphite layer supported by a copper frame for increased stability and reduced thermal warpage during handling and operation while minimizing thermal penalty by reducing the amount of material having a relatively low heat conductivity that is needed in conventional heat spreading caps.

公开(公告)号：US20150371917A1

公开(公告)日：2015-12-24

申请号：US14837491

申请日：2015-08-27

申请人： International Business Machines Corporation

发明人： Evan G. Colgan ,  Taryn J. Davis ,  Chenzhou Lian ,  Yi Pan ,  Kamal K. Sikka ,  Jeffrey A. Zitz

IPC分类号： H01L23/34

CPC分类号： H01L23/34 ,  H01L23/36 ,  H01L23/367 ,  H01L23/373 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/3511 ,  H05K7/20509 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Embodiments of the invention comprise a homogeneous heat spreading cap element in chip packages to facilitate better heat spreading and dissipation. The heat spreading cap comprises a single high-K graphite layer supported by a copper frame for increased stability and reduced thermal warpage during handling and operation while minimizing thermal penalty by reducing the amount of material having a relatively low heat conductivity that is needed in conventional heat spreading caps.

摘要翻译： 本发明的实施例包括芯片封装中均匀的散热帽元件，以便于更好的散热和散热。 散热帽包括由铜框架支撑的单个高K石墨层，用于在操作和操作期间增加稳定性和降低的热翘曲，同时通过减少常规热量所需的相对较低的热导率的材料的量来最小化热损失 散布帽

公开(公告)号：US09153460B2

公开(公告)日：2015-10-06

申请号：US14011218

申请日：2013-08-27

申请人： International Business Machines Corporation

发明人： Evan G. Colgan ,  Michael A. Gaynes ,  Jeffrey A. Zitz

IPC分类号： H01L23/00 ,  H01L21/50 ,  H01L23/433 ,  H01L23/31

CPC分类号： H01L21/50 ,  H01L23/3128 ,  H01L23/433 ,  H01L24/16 ,  H01L24/32 ,  H01L24/72 ,  H01L24/73 ,  H01L24/90 ,  H01L24/92 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2224/81815 ,  H01L2224/83104 ,  H01L2224/83901 ,  H01L2224/921 ,  H01L2924/10253 ,  H01L2924/15787 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/83 ,  H01L2224/90 ,  H01L2924/014

摘要： An assembly process for a heatsink attachment module for a chip packaging apparatus is provided and includes attaching a semiconductor chip to a substrate to form a module subassembly, placing a load frame and shim in a fixture, dispensing adhesive to the load frame and loadably placing the module subassembly chip face down in the fixture.

摘要翻译： 提供了一种用于芯片封装设备的散热器连接模块的组装过程，包括将半导体芯片附接到基板以形成模块子组件，将负载框架和垫片放置在固定装置中，将粘合剂分配到负载框架并且可负载地将 模块组件芯片正面朝下。

公开(公告)号：US20150229295A1

公开(公告)日：2015-08-13

申请号：US14178791

申请日：2014-02-12

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： Paul S. Andry ,  Leland Chang ,  Evan G. Colgan ,  John U. Knickerbocker ,  Bucknell C. Webb ,  Robert Wisnieff

IPC分类号： H03K3/012 ,  H02M3/156 ,  H02M1/08

CPC分类号： H02M3/156 ,  G05F3/02 ,  G06F1/26 ,  G06F1/263 ,  G06F1/266 ,  H01L23/5286 ,  H01L23/64 ,  H01L23/642 ,  H01L23/645 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L25/065 ,  H01L25/0657 ,  H01L25/16 ,  H01L25/18 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16265 ,  H01L2224/1703 ,  H01L2224/17181 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2924/1436 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19103 ,  H02M1/08 ,  H05K1/00 ,  Y10T29/49117 ,  H01L2224/11 ,  H01L2924/014

摘要： A switching power supply in an integrated circuit, an integrated circuit comprising a switching power supply, and a method of assembling a switching power supply in an integrated circuit are disclosed. In one embodiment, the invention provides a three-dimensional switching power supply in an integrated circuit comprising a device layer. The switching power supply comprises three distinct strata arranged in series with the device layer, the three distinct strata including a switching layer including switching circuits, a capacitor layer including banks of capacitors, and an inductor layer including inductors. This switching power supply further comprises a multitude of connectors electrically and mechanically connecting together the device layer, the switching layer, the capacitor layer, and the inductor layer. The switching circuits, the capacitors and the inductors form a switching power supply for supplying power to the device layer.

摘要翻译： 公开了一种集成电路中的开关电源，包括开关电源的集成电路和集成电路中的开关电源的组装方法。 在一个实施例中，本发明提供了一种包括器件层的集成电路中的三维开关电源。 开关电源包括与器件层串联布置的三个不同的层，三个不同的层包括包括开关电路的开关层，包括电容器组的电容器层和包括电感器的电感器层。 该开关电源还包括将器件层，开关层，电容层和电感层电连接和机械连接在一起的大量连接器。 开关电路，电容器和电感器形成用于向器件层供电的开关电源。

公开(公告)号：US20140078704A1

公开(公告)日：2014-03-20

申请号：US13623873

申请日：2012-09-20

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： Paul S. Andry ,  Evan G. Colgan ,  Robert L. Wisnieff

IPC分类号： H05K1/03 ,  H05K1/18

CPC分类号： H01L23/49827 ,  H01L23/15 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15311 ,  H01L2924/15788 ,  H05K1/0284 ,  H05K1/14 ,  H05K1/18 ,  H01L2924/00012 ,  H01L2924/00

摘要： A composite wiring circuit with electrical through connections and method of manufacturing the same. The composite wiring circuit includes a glass with first electrically-conducting through vias. The first electrically-conducting through vias pass from a top surface of the glass layer to a bottom surface of the glass layer. The composite wiring circuit further includes an interposer layer with second electrically-conducting through vias. The second electrically-conducting through vias pass from a top surface of the interposer layer to a bottom surface of the interposer layer. The second electrically-conducting through vias are electrically coupled to the first electrically-conducting through vias.

摘要翻译： 一种具有电气连接的复合布线电路及其制造方法。 复合布线电路包括具有第一导电通孔的玻璃。 第一导电通孔从玻璃层的顶表面传递到玻璃层的底表面。 复合布线电路还包括具有第二导电通孔的插入层。 第二导电通孔从中介层的顶表面传递到插入层的底表面。 第二导电通孔电耦合到第一导电通孔。

公开(公告)号：US10727159B2

公开(公告)日：2020-07-28

申请号：US16705278

申请日：2019-12-06

申请人： International Business Machines Corporation

发明人： Thomas J. Brunschwiler ,  Timothy J. Chainer ,  Evan G. Colgan ,  Arvind Raj Mahankali Sridhar ,  Chin Lee Ong ,  Pritish R. Parida ,  Gerd Schlottig ,  Mark D. Schultz ,  Joel A. Silberman

IPC分类号： H01L23/473 ,  H01L23/427 ,  H01L21/48 ,  H01L23/00 ,  H01L25/065

摘要： A structure for cooling an integrated circuit. The structure may include; an interposer cold plate having at least two expanding channels, each expanding channel having a flow direction from a channel inlet to a channel outlet, the flow direction having different directions for at least two of the at least two expanding channels, the channel inlet having an inlet width and the channel outlet having an outlet width, wherein the inlet width is less than the outlet width.