公开(公告)号：US06718478B2

公开(公告)日：2004-04-06

申请号：US09740453

申请日：2000-12-19

申请人： Sang Ho Yoon ,  Jin Young Jeong ,  Yong Il Kim

发明人： Sang Ho Yoon ,  Jin Young Jeong ,  Yong Il Kim

IPC分类号： G06F104

CPC分类号： G09G3/3611 ,  G09G5/18

摘要： A circuit for generating a start pulse signal for a source driver IC in a TFT-LCD includes: a first latch unit for receiving a data enable signal and a reset signal, extracting a leading edge of the data enable signal in a leading edge of a main clock signal, and latching the data enable signal in a trailing edge thereof; a logic gate unit for receiving a complementary signal of the output signal from the first latch unit and the data enable signal, and generating a pulse signal in a leading edge of the data enable signal; and a second latch unit for receiving the output signal from the logic gate unit and the reset signal, outputting the output signal from the logic gate unit as a start pulse signal in the leading edge of the main clock signal, and latching the output signal from the logic gate unit in the trailing edge thereof.

摘要翻译： 用于在TFT-LCD中产生源极驱动器IC的起始脉冲信号的电路包括：用于接收数据使能信号和复位信号的第一锁存单元，提取数据使能信号的前沿， 主时钟信号，并在其后沿锁存数据使能信号; 逻辑门单元，用于接收来自第一锁存单元的输出信号和数据使能信号的互补信号，并在数据使能信号的前沿产生脉冲信号; 以及第二锁存单元，用于接收来自逻辑门​​单元和复位信号的输出信号，将来自逻辑门​​单元的输出信号作为主时钟信号的前沿中的起始脉冲信号输出，并将来自 其后缘的逻辑门单元。

公开(公告)号：US08946748B2

公开(公告)日：2015-02-03

申请号：US13478849

申请日：2012-05-23

申请人： Tae Hun Kim ,  Seung Wan Chae ,  Yong Il Kim ,  Seung Jae Lee ,  Tae Sung Jang ,  Jong Rak Sohn ,  Bo Kyoung Kim

发明人： Tae Hun Kim ,  Seung Wan Chae ,  Yong Il Kim ,  Seung Jae Lee ,  Tae Sung Jang ,  Jong Rak Sohn ,  Bo Kyoung Kim

IPC分类号： H01L33/00 ,  H01L27/15 ,  H01L33/46 ,  H01L33/20

CPC分类号： H01L33/46 ,  H01L33/20 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2924/00014 ,  H01L2924/00

摘要： There is provided a semiconductor light emitting device including: a light transmissive substrate; a light emitting part; first and second electrodes electrically connected to the first and second conductivity type semiconductor layers, respectively; and a rear reflective part including a reflective metallic layer, and a light transmissive dielectric layer interposed between the light transmissive substrate and the reflective metallic layer.

摘要翻译： 提供了一种半导体发光器件，包括：透光衬底; 发光部分; 分别与第一和第二导电类型半导体层电连接的第一和第二电极; 以及包括反射金属层的后反射部分和介于透光基板和反射金属层之间的透光电介质层。

公开(公告)号：US08375479B2

公开(公告)日：2013-02-19

申请号：US12582109

申请日：2009-10-20

申请人： Yong Il Kim

发明人： Yong Il Kim

IPC分类号： A47K3/022

CPC分类号： F28D7/04 ,  E03C2001/005 ,  E03F5/04 ,  F24D17/0005 ,  F24D2200/20 ,  F28D21/0012 ,  F28F2210/10 ,  Y02B30/566

摘要： The present invention relates to an apparatus for recycling wasted heat using waste hot water that includes: a tub that charges and discharges waste hot water; a heat exchange unit that transfers the heat of waste hot water to cold water supplied to a shower bat; and an upper cover that the open upper portion of the tub, and is friendly to the environment by reducing the amount of fuel consumed to supply hot water and it is possible to reduce the fuel cost by the reduced amount of fuel consumption.

摘要翻译： 本发明涉及使用废热回收浪费热量的装置，其包括：对废热水进行充放电的桶; 热交换单元，其将废热水的热量转移到供应到淋浴杆的冷水中; 以及桶的敞开的上部的上盖，并且通过减少供应热水所消耗的燃料量而对环境友好，并且可以通过减少燃料消耗量来降低燃料成本。

公开(公告)号：US08158100B2

公开(公告)日：2012-04-17

申请号：US12811664

申请日：2009-03-06

申请人： Se In Yang ,  Kyung Keun Yoo ,  Yong Il Kim ,  Tae Hee Shin ,  Deok Yun Kim ,  Sun Ki Seo ,  Rae Sung Chung ,  Do Sun Baik

发明人： Se In Yang ,  Kyung Keun Yoo ,  Yong Il Kim ,  Tae Hee Shin ,  Deok Yun Kim ,  Sun Ki Seo ,  Rae Sung Chung ,  Do Sun Baik

IPC分类号： C01B15/023

CPC分类号： C01B15/023

摘要： The present invention relates to a method for the preparation of hydrogen peroxide through a continuous process, extracting hydrogen peroxide produced from reduction and oxidation of a working solution and recycling the oxidized working solution back to the reduction process, wherein the composition of the working solution, i.e. the composition of 2-alkylanthraquinone and 2-tetrahydroalkylanthraquinone, is optimized to increase the solubility of the quinones and to improve the reaction rate. The working solution comprises 2-alkylanthraquinone, 2-tetrahydroalkylanthraquinone and an organic solvent, wherein 65-95 mol % of the alkyl group of 2-alkylanthraquinone and 2-tetrahydroalkylanthraquinone is amyl and the remaining 5-35 mol % of the alkyl group is ethyl, and the molar ratio of 2-alkylanthraquinone to 2-tetrahydroalkylanthraquinone is from 4:6 to 1:9.

摘要翻译： 本发明涉及通过连续方法制备过氧化氢的方法，提取由还原和氧化工作溶液产生的过氧化氢，并将氧化的工作溶液再循环回还原过程，其中工作溶液的组成， 即2-烷基蒽醌和2-四氢烷基蒽醌的组成被优化以增加醌的溶解度并提高反应速率。 工作溶液包括2-烷基蒽醌，2-四氢烷基蒽醌和有机溶剂，其中65-95摩尔％的2-烷基蒽醌和2-四氢烷基蒽醌的烷基是戊基，剩余的5-35摩尔％的烷基是乙基 ，2-烷基蒽醌与2-四氢烷基蒽醌的摩尔比为4：6〜1：9。

公开(公告)号：US20110175078A1

公开(公告)日：2011-07-21

申请号：US13119308

申请日：2010-03-25

申请人： Yong Il Kim ,  In Jung Kim ,  Yun-Hee Lee ,  Kyoung Seok Lee ,  Seung Hoon Nahm

发明人： Yong Il Kim ,  In Jung Kim ,  Yun-Hee Lee ,  Kyoung Seok Lee ,  Seung Hoon Nahm

IPC分类号： H01L51/30 ,  H01L29/16

CPC分类号： C21D3/00 ,  C01B3/503 ,  C01B3/508

摘要： Provided is a hydrogen penetration barrier for preventing hydrogen from being diffused and discharged through a barrier and preventing hydrogen embrittlement of a material due to diffusion of hydrogen ions into a material. In detail, the hydrogen penetration barrier prevents penetration of hydrogen ions by using a built-in potential of a semiconductor layer doped with a p-type impurity and a semiconductor layer doped with an n-type impurity and a potential applied by a reverse biased voltage and includes an absorption layer absorbing the hydrogen molecules to primarily prevent the penetration of the hydrogen molecules and uses the absorption layer made of the conductive material as an application electrode of the reverse biased voltage and ionizes the hydrogen absorbed to the absorption layer to secondarily prevent the penetration of the hydrogen molecules and prevent the hydrogen embrittlement.

摘要翻译： 提供了一种用于防止氢通过阻挡层扩散和排出的氢穿透阻挡层，并且防止由于氢离子扩散到材料中的材料的氢脆化。 详细地说，氢穿透阻挡层通过使用掺杂有p型杂质的半导体层和掺杂有n型杂质的半导体层和通过反向偏置电压施加的电位的内置电位来防止氢离子渗透 并且包括吸收氢分子以吸收氢分子的吸收层，并且使用由导电材料制成的吸收层作为反向偏置电压的施加电极，并将吸收到吸收层的氢电离并二次防止 渗透氢分子并防止氢脆化。

公开(公告)号：US20100155659A1

公开(公告)日：2010-06-24

申请号：US11993622

申请日：2005-09-23

申请人： Se In Yang ,  Kyung Keun Yoo ,  Yong Il Kim ,  Young Ran Lee

发明人： Se In Yang ,  Kyung Keun Yoo ,  Yong Il Kim ,  Young Ran Lee

IPC分类号： D06L3/02

CPC分类号： D06L1/04 ,  C11D1/83 ,  C11D3/3947 ,  C11D3/43 ,  C11D17/0013 ,  D06L4/12 ,  D06L4/15 ,  D06L4/17

摘要： This invention relates to a novel non-aqueous liquid oxygen bleach composition prepared by dispersing solid peroxygen compound in the liquid in which the content of an anhydrous non-polar organic solvent and a non-ionic and anionic surfactant is controlled. The composition is formed in a high viscous paste or a gel-type suspension and can be used as a multi-purpose composition, for example, the bleach and stain remover of clothes and the cleanser of bathroom and kitchen since they have a chemical/physical stability of no loss of available oxygen, an excellent bleaching and cleaning ability due to their alkaline pH range, no change of viscosity or no phase separation during the storage and so on.

摘要翻译： 本发明涉及通过将固体过氧化合物分散在其中控制无水非极性有机溶剂和非离子和阴离子表面活性剂的含量的液体中制备的新型非水液氧漂白组合物。 该组合物形成为高粘度糊状物或凝胶型悬浮液，并且可以用作多用途组合物，例如衣物的漂白和去污剂以及浴室和厨房的清洁剂，因为它们具有化学/物理 稳定性不损失可用氧气，由于其碱性pH范围，优异的漂白和清洁能力，粘度无变化或储存期间无相分离等优点。

公开(公告)号：US07098533B2

公开(公告)日：2006-08-29

申请号：US10934556

申请日：2004-09-07

申请人： Sung Gue Lee ,  Yong Il Kim

发明人： Sung Gue Lee ,  Yong Il Kim

IPC分类号： H01L23/10 ,  H01L23/34 ,  H01L23/043 ,  H01L23/495 ,  H01L31/024

CPC分类号： H05K1/021 ,  H01L23/3128 ,  H01L23/36 ,  H01L23/49816 ,  H01L23/49822 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15321 ,  H01L2924/181 ,  H05K1/056 ,  H05K1/182 ,  H05K3/0061 ,  H05K3/0097 ,  H05K3/321 ,  H05K3/4644 ,  H05K2203/0315 ,  H05K2203/049 ,  H05K2203/1536 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49165 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/00012 ,  H01L2924/00

摘要： A printed circuit board (PCB) with a heat dissipation element, a method for manufacturing the PCB, and a semiconductor package using the PCB dissipates heat generated from the semiconductor chip and reduces a printed circuit board height. The PCB includes a heat sink panel, an alloy panel attached to one surface of the heat sink panel serving to ground and to dissipate heat, a circuit pattern layer having via holes formed on one surface of the alloy panel and electrically coupled to the alloy panel, and a cavity formed by perforating the circuit pattern layer and the alloy panel. A semiconductor chip is on the heat sink panel in the cavity and electrically coupled to the circuit pattern layer. The alloy panels with the circuit patterns can be manufactured in pairs with an insulation carrier therebetween. A plurality of dissipation protrusions can be formed on the surface of the alloy panel or the surface of the heat sink panel to couple the same.

摘要翻译： 具有散热元件的印刷电路板（PCB），PCB的制造方法以及使用该PCB的半导体封装消耗了半导体芯片产生的热量并降低了印刷电路板的高度。 PCB包括散热面板，附接到用于接地并散热的散热板的一个表面的合金面板，具有形成在合金面板的一个表面上并且电耦合到合金面板的通孔的电路图案层 以及通过对电路图案层和合金面板进行穿孔而形成的空腔。 半导体芯片位于空腔中的散热板上并电耦合到电路图案层。 具有电路图案的合金面板可以与它们之间的绝缘载体成对地制造。 可以在合金面板的表面或散热面板的表面上形成多个耗散突起，以将其连接。

公开(公告)号：US07049178B2

公开(公告)日：2006-05-23

申请号：US10743302

申请日：2003-12-23

申请人： Yong Il Kim ,  Sung Gue Lee ,  Yu Seock Yang

发明人： Yong Il Kim ,  Sung Gue Lee ,  Yu Seock Yang

IPC分类号： H01L21/44 ,  H01L21/58 ,  H01L21/50

CPC分类号： H01L23/49816 ,  H01L21/4857 ,  H01L23/49833 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48464 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method of fabricating a semiconductor package is disclosed in which a first Ni—Au plating is formed on a bonding pad for connection with a semiconductor chip, without a mechanical process or a masking operation. The method applies a copper plating on a through bore and the bonding pad, where the copper plated layer formed on the bonding pad is selectively removed, and then a second Ni—Au plating is formed on the bonding pad and a ball pad.