摘要:
A backlight unit including a substrate disposed thereon with conductive lines, a plurality of light emitting diodes each bonded to an upper surface of the substrate and spaced a predetermined distance apart from the substrate, and electrically connected to the conductive lines of the substrate; a transparent resin encompassing the plurality of light emitting diodes and formed on the upper surface of the substrate, and an optical transmission arrangement disposed on an upper surface of the transparent resin. Further, the arrangement includes a first layer for preventing light emitted from the light emitting diodes from being totally reflected by allowing an incident angle of the light to be less than a threshold angle, and a second layer for diffusing and emitting the light.
摘要:
A light emitting device having a vertical structure and a method for manufacturing the same, which are capable of increasing light extraction efficiency, are disclosed. The method includes forming a light extraction layer on a substrate, forming a plurality of semiconductor layers on the light extraction layer, forming a first electrode on the semiconductor layers, forming a support layer on the first electrode, removing the substrate, and forming a second electrode on a surface from which the substrate is removed.
摘要:
A light emitting device having a vertical structure and a method for manufacturing the same, which are capable of increasing light extraction efficiency, are disclosed. The method includes forming a light extraction layer on a substrate, forming a plurality of semiconductor layers on the light extraction layer, forming a first electrode on the semiconductor layers, forming a support layer on the first electrode, removing the substrate, and forming a second electrode on a surface from which the substrate is removed.
摘要:
A light emitting device having a vertical structure, a package thereof and a method for manufacturing the same, which are capable of damping impact generated in a substrate separation process, and achieving an improvement in mass productivity, are disclosed. The method includes growing a semiconductor layer having a multilayer structure over a substrate, forming a first electrode on the semiconductor layer, separating the substrate including the grown semiconductor layer into unit devices, bonding each of the separated unit devices on a sub-mount, separating the substrate from the semiconductor layer, and forming a second electrode on a surface of the semiconductor layer exposed in accordance with the separation of the substrate.
摘要:
A light emitting device having a vertical structure, which includes a semiconductor layer having a first surface and a second surface, a first electrode arranged on the first surface of the semiconductor layer, a transparent conductive oxide (TCO) layer arranged on the second surface of the semiconductor layer and a second electrode arranged on the TCO layer.
摘要:
A light emitting device having a vertical structure and a method for manufacturing the same, which are capable of increasing light extraction efficiency, are disclosed. The method includes forming a light extraction layer on a substrate, forming a plurality of semiconductor layers on the light extraction layer, forming a first electrode on the semiconductor layers, forming a support layer on the first electrode, removing the substrate, and forming a second electrode on a surface from which the substrate is removed.
摘要:
An optical lens, a light emitting device package using the optical lens and a backlight unit are disclosed, whereby light irradiated upward of a light emitting device is refracted from a bottom refraction surface to allow reaching a reflection surface, and an optical lens is mounted for reflecting the light sideways of the lens from the reflection surface to minimize an amount of light irradiated upward of the lens while increasing the amount of light irradiated toward the lateral surface of the lens, thereby limiting the generation of a hot spot to the maximum. The present invention dispenses with a hot spot baffle plate and a complicated assembly process to enable to reduce the number of parts and to decrease the thickness of a panel.
摘要:
A light emitting device having a vertical structure, a package thereof and a method for manufacturing the same, which are capable of damping impact generated in a substrate separation process, and achieving an improvement in mass productivity, are disclosed. The method includes growing a semiconductor layer having a multilayer structure over a substrate, forming a first electrode on the semiconductor layer, separating the substrate including the grown semiconductor layer into unit devices, bonding each of the separated unit devices on a sub-mount, separating the substrate from the semiconductor layer, and forming a second electrode on a surface of the semiconductor layer exposed in accordance with the separation of the substrate.