-
公开(公告)号：US10984955B2
公开(公告)日：2021-04-20
申请号：US16439237
申请日：2019-06-12
Applicant: KEMET Electronics Corporation
Inventor： John Bultitude , John E. McConnell , Galen W. Miller
IPC: H01G4/30 , B23K1/00 , B23K1/005 , B23K1/008 , B23K1/20 , B23K35/36 , B23K35/02 , H01G4/38 , H01G4/232 , H01G4/008 , H01G4/12 , B23K101/40 , B23K101/42
Abstract: An electronic device is described wherein the electronic device comprises a substrate with a first conductive metal layer and a second conductive metal layer. A first microphonic noise reduction structure is in electrical contact with the first conductive metal layer wherein the first microphonic noise reduction layer comprises at least one of the group consisting of a compliant non-metallic layer and a shock absorbing conductor comprising offset mounting tabs with a space there between coupled with at least one stress relieving portion. An electronic component comprising a first external termination of a first polarity and a second external termination of a second polarity is integral to the electronic device and the first microphonic noise reduction structure and the first external termination are adhesively bonded by a transient liquid phase sintering adhesive.
-
公开(公告)号：US20190304698A1
公开(公告)日：2019-10-03
申请号：US16439237
申请日：2019-06-12
Applicant: KEMET Electronics Corporation
Inventor： John Bultitude , John E. McConnell , Galen W. Miller
IPC: H01G4/30 , H01G4/232 , B23K1/00 , B23K1/005 , B23K1/008 , B23K35/36 , B23K35/02 , H01G4/38 , B23K1/20
Abstract: An electronic device is described wherein the electronic device comprises a substrate with a first conductive metal layer and a second conductive metal layer. A first microphonic noise reduction structure is in electrical contact with the first conductive metal layer wherein the first microphonic noise reduction layer comprises at least one of the group consisting of a compliant non-metallic layer and a shock absorbing conductor comprising offset mounting tabs with a space there between coupled with at least one stress relieving portion. An electronic component comprising a first external termination of a first polarity and a second external termination of a second polarity is integral to the electronic device and the first microphonic noise reduction structure and the first external termination are adhesively bonded by a transient liquid phase sintering adhesive.
-
公开(公告)号：US20180190430A1
公开(公告)日：2018-07-05
申请号：US15909735
申请日：2018-03-01
Applicant: KEMET Electronics Corporation
Inventor： John E. McConnell , Garry L. Renner , John Bultitude , Allen Hill
IPC: H01G4/228 , H01G4/12 , H01G4/008 , H01G4/38 , B23K1/00 , B23K1/005 , B23K1/008 , B23K1/20 , B23K35/36
CPC classification number: H01G4/228 , B23K1/0016 , B23K1/0053 , B23K1/008 , B23K1/203 , B23K35/0227 , B23K35/3613 , B23K2101/40 , B23K2101/42 , H01G4/0085 , H01G4/12 , H01G4/2325 , H01G4/30 , H01G4/38 , H01L2224/83825 , H01L2924/01322 , H01L2924/01327 , H01L2924/1461 , Y10T29/435 , H01L2924/00012 , H01L2924/00015 , H01L2924/00
Abstract: A stacked MLCC capacitor is provided wherein the capacitor stack comprises multilayered ceramic capacitors wherein each multilayered ceramic capacitor comprises first electrodes and second electrodes in an alternating stack with a dielectric between each first electrode and each adjacent second electrode. The first electrodes terminate at a first side and the second electrodes second side. A first transient liquid phase sintering conductive layer is the first side and in electrical contact with each first electrode; and a second transient liquid phase sintering conductive layer is on the second side and in electrical contact with each second electrode.
-
Patent Agency Ranking
公开(公告)号：US09748043B2
公开(公告)日：2017-08-29
申请号：US13959995
申请日：2013-08-06
Applicant: Kemet Electronics Corporation
Inventor： Antony P. Chacko , John E. McConnell , Robert Ramsbottom , Philip M. Lessner , Randolph S. Hahn , John Bultitude
CPC classification number: H01G9/048 , H01G9/0029 , H01G9/012 , H01G9/04 , H01G9/0425 , H01G11/26 , Y10T29/417
Abstract: A solid electrolytic capacitor is described which comprises an anode, a dielectric on the anode and a cathode on the dielectric. A conductive coating is on the cathode wherein the conductive layer comprises an exterior surface of a first high melting point metal. An adjacent layer is provided comprising a second high melting point metal, wherein the first high melting point metal and the second high melting point metal are metallurgically bonded with a low melting point metal.
-
公开(公告)号：US20170169955A1
公开(公告)日：2017-06-15
申请号：US14963766
申请日：2015-12-09
Applicant: Kemet Electronics Corporation
Inventor： Galen W. Miller , John E. McConnell , John Bultitude , Garry L. Renner
Abstract: An improved module is provided. The module comprises a multiplicity of electronic components wherein each electronic component comprises a first external termination with at least one first longitudinal edge and a second external termination with at least one second longitudinal edge. A first lead is connected to the first longitudinal edge by a first interconnect and a second lead is connected to the second longitudinal edge by a second interconnect.
-
公开(公告)号：US09472342B2
公开(公告)日：2016-10-18
申请号：US13959954
申请日：2013-08-06
Applicant: Kemet Electronics Corporation
Inventor： John E. McConnell , Garry L. Renner , John Bultitude , Allen Hill
IPC: H01G4/228 , H01G4/06 , B23K1/00 , B23K1/005 , B23K1/008 , B23K1/20 , B23K35/36 , B23K35/02 , H01G4/30 , H01G4/232 , H01G4/008 , H01G4/12 , H01G4/38
CPC classification number: H01G4/228 , B23K1/0016 , B23K1/0053 , B23K1/008 , B23K1/203 , B23K35/0227 , B23K35/3613 , B23K2101/40 , B23K2101/42 , H01G4/0085 , H01G4/12 , H01G4/2325 , H01G4/30 , H01G4/38 , H01L2224/83825 , H01L2924/01322 , H01L2924/01327 , H01L2924/1461 , Y10T29/435 , H01L2924/00012 , H01L2924/00015 , H01L2924/00
Abstract: A stacked MLCC capacitor is provided wherein the capacitor stack comprises multilayered ceramic capacitors wherein each multilayered ceramic capacitor comprises first electrodes and second electrodes in an alternating stack with a dielectric between each first electrode and each adjacent second electrode. The first electrodes terminate at a first side and the second electrodes second side. A first transient liquid phase sintering conductive layer is the first side and in electrical contact with each first electrode; and a second transient liquid phase sintering conductive layer is on the second side and in electrical contact with each second electrode.
Abstract translation: 提供堆叠的MLCC电容器，其中电容器堆叠包括多层陶瓷电容器，其中每个多层陶瓷电容器包括第一电极和交替堆叠的第二电极，每个第一电极和每个相邻的第二电极之间具有电介质。 第一电极在第一侧和第二电极的第二侧终止。 第一瞬态液相烧结导电层是第一侧并与每个第一电极电接触; 并且第二瞬态液相烧结导电层位于第二侧上并与每个第二电极电接触。
-
公开(公告)号：US09357634B2
公开(公告)日：2016-05-31
申请号：US13870414
申请日：2013-04-25
Applicant: KEMET Electronics Corporation
Inventor： John E. McConnell , Alan P. Webster , John Bultitude , Abhijit Gurav
IPC: H05K7/04 , H01L23/49 , H05K1/02 , H05K3/30 , H01G4/38 , H01C1/014 , H01C1/14 , H01C7/18 , H01G2/06 , H01G4/232 , H05K1/18
CPC classification number: H05K1/0271 , H01C1/014 , H01C1/14 , H01C7/18 , H01G2/06 , H01G4/232 , H01G4/38 , H05K1/181 , H05K1/182 , H05K3/30 , H05K3/301 , H05K2201/049 , H05K2201/10015 , H05K2201/10454 , Y10T29/49121
Abstract: An improved discrete electronic device and method of making the improved discrete electronic device is described. The discrete electronic device has an electronic passive component with a termination and a lead frame. A compensating compliant component is between the termination and the lead frame. The compensating compliant component has a composite core and a first conductor on the composite core. The first conductor is in electrical contact with the termination. A second conductor is also on the composite core wherein the second conductor is in electrical contact with the lead frame.
Abstract translation: 描述了一种改进的离散电子设备和制造改进的分立电子设备的方法。 分立的电子设备具有带终端和引线框架的电子无源部件。 补偿兼容部件在终端和引线框架之间。 补偿柔性部件具有复合芯和复合芯上的第一导体。 第一个导线与端子电接触。 第二导体也在复合芯上，其中第二导体与引线框架电接触。
-
公开(公告)号：US20140160624A1
公开(公告)日：2014-06-12
申请号：US14096605
申请日：2013-12-04
Applicant: Kemet Electronics Corporation
Inventor： John E. McConnell , Alan P. Webster , Lonnie G. Jones , Garry L. Renner , Jeffrey W. Bell
CPC classification number: H01G4/30 , H01G4/232 , H01G4/38 , H01G13/006 , Y10T29/43
Abstract: An improved capacitor utilizing stacked MLCC's is provided. The capacitor comprising at least one MLCC sandwiched between a first lead and a second lead. Each lead comprises at least one integral lead crimp.
Abstract translation: 提供了一种利用堆叠MLCC的改进的电容器。 所述电容器包括夹在第一引线和第二引线之间的至少一个MLCC。 每个引线包括至少一个整体引线压接。
-
-
-
-
-
-
-
Search Results
38
records
(took 0.022 seconds)
