Abstract:
A novel method of producing a porous product is provided, including the steps of: preparing a molded product by subjecting a molding material comprising a polymer component and a pore-forming agent dispersed in the polymer component, the pore-forming agent assuming a solid state at a room temperature, to molding at a temperature which causes the pore-forming agent to melt; and soaking the molded product with a solvent which dissolves the pore-forming agent but fails to dissolve the polymer component, to form pores.
Abstract:
This invention relates to a transparent coating member mountable on a light-emitting diode including a fluorescent substance and a light diffusion substance including calcium carbonate in order to reduce color variation at various locations of a transparent coating member and also reduce manufacturing costs of the transparent coating member without significantly lower the level of chromaticity. Furthermore, this invention relates to a transparent coating member mountable on a light-emitting diode (LED) including a fluorescent substance and a light storing pigment. This structure allows an exhibition of afterglow of the transparent coating member after turning off the light in a room so that locating the position of the transparent coating member is made easier thereafter. The light diffusion substance and the light storing pigment can be added to the transparent coating member to acquire both advantages derived from respective substances.
Abstract:
An optical semiconductor device includes an active layer through which light travels, having opposed first and second surfaces; a semiconductor layer of a first conductivity type disposed on the first surface of the active layer; a first electrode contacting the first conductivity type semiconductor layer; a semiconductor layer of a second conductivity type, opposite the first conductivity type, disposed on the second surface of the active layer; a second electrode contacting the second conductivity type semiconductor layer; a wire bonded to one of the first and second electrodes at a position in the resonator length direction corresponding to a localized maximum of a light density distribution in the active layer along the resonator length direction. Current is injected into the device opposite the localized maximum point of the light density distribution in the active layer so that the current density distribution in the active layer along the resonator length direction is proportional to the light density distribution and has a localized maximum at a position approximately at the localized maximum of the light density distribution. Therefore, the carrier density distribution caused by the light density distribution along the resonator length direction is canceled by the current density distribution, whereby the carrier density in the active layer along the resonator length direction is made uniform.
Abstract:
A semiconductor laser includes a p type cladding layer and an n type cladding layer sandwiching an active layer serially disposed on a semiconductor substrate. The p type cladding layer includes a first dopant impurity producing p type conductivity and a smaller quantity of a second impurity that produces n type conductivity and ionically bonds to the first impurity. The first and second dopant impurities attract each other and cannot move individually during a crystal growth step at high temperature whereby the diffusion of those impurities into the active layer is suppressed, preventing formation of a deep impurity level in the active layer, resulting in a semiconductor laser with a reduced threshold current.
Abstract:
An optical semiconductor device includes: a semiconductor substrate; a semiconductor laser part on the semiconductor substrate and having a vertical ridge; and an optical modulator part on the semiconductor substrate, having an inverted-mesa ridge, and modulating light emitted by the semiconductor laser part.
Abstract:
An optical device includes: a substrate; an optical branching filter on the substrate and dividing input light into first and second input lights; first and second Mach-Zehnder optical modulators on the substrate and respectively modulating the first and second input lights; and an optical coupler on the substrate and combining light modulated by the first Mach-Zehnder optical modulator and light modulated by the second Mach-Zehnder optical modulator. Each of the first and second Mach-Zehnder optical modulator includes two optical waveguides, a phase modulation electrode applying a modulation voltage across the optical waveguides to change phases of light in the optical waveguides, and a feed line and a terminal line respectively connected to opposite ends of the phase modulation electrode to supply the modulation voltage to the phase modulation electrode. The feed lines and the terminal lines respectively extend to peripheral portions of the substrate.
Abstract:
An optical modulator includes: a semiconductor chip; a waveguide in the semiconductor chip; a traveling wave electrode including an input portion and an output portion, to which a signal is applied for modulating light passing through the waveguide; a power supply line connected to the input portion via a first wire; and a termination resistor connected to the output portion via a second wire. Capacitance between the output portion and a grounding point is larger than capacitance between the input portion and the grounding point.
Abstract:
A semiconductor optical element has an active layer including quantum dots. The density of quantum dots in the resonator direction in a portion of the active layer in which the density of photons is relatively high is increased relative to the density of quantum dots in a portion of the active layer in which the density of photons is relatively low.
Abstract:
A base material for adhesion to be adhered to a solid body comprising; a substrate made from metal, polymer resin, glass or ceramics whose surface is adhesive to the solid body by silyl-ether-linkage that at least one active silyl group selected from the group consisting of a hydrosilyl-containing silyl group, a vinyl-containing silyl group, an alkoxysilyl-containing silyl group and a hydrolytic group-containing silyl group having reactivity with a reactive group on the surface of the solid body is bound to a dehydrogenated residue of hydroxyl group on the surface of the substrate.
Abstract:
A semiconductor laser comprises: a substrate; an n-cladding layer disposed on the substrate; an active layer disposed on the n-cladding layer; a p-cladding layer disposed on the active layer and forming a waveguide ridge; and a diffraction grating layer disposed between the active layer and the n-cladding layer or the p-cladding layer and including a phase shift structure in a part of the diffraction grating layer in an optical waveguide direction. The width of the p-cladding layer is increased in a portion corresponding to the phase shift structure of the diffraction grating layer.