Semiconductor device and method for manufacturing the same
    31.
    发明授权
    Semiconductor device and method for manufacturing the same 有权
    半导体装置及其制造方法

    公开(公告)号:US07465677B2

    公开(公告)日:2008-12-16

    申请号:US11410070

    申请日:2006-04-25

    IPC分类号: H01L21/31 H01L21/469

    摘要: A manufacturing method of a semiconductor device of the present invention includes the steps of forming a first insulating film over a substrate, forming a semiconductor film over the first insulating film, oxidizing or nitriding the semiconductor film by conducting a plasma treatment to the semiconductor film under a condition of an electron density of 1×1011 cm−3 or more and 1×1013 cm−3 or less and an electron temperature of 0.5 eV or more and 1.5 eV or less, using a high frequency wave, forming a second insulating film to cover the semiconductor film, forming a gate electrode over the second insulating film, forming a third insulating film to cover the gate electrode, and forming a conductive film over the third insulating film.

    摘要翻译: 本发明的半导体器件的制造方法包括以下步骤:在衬底上形成第一绝缘膜,在第一绝缘膜上形成半导体膜,通过对半导体膜进行等离子体处理来对半导体膜进行氧化或氮化 使用高频波,电子密度为1×10 11 cm -3以上且1×10 13 cm -3以下,电子温度为0.5eV以上且1.5eV以下的条件,形成覆盖半导体的第2绝缘膜 在所述第二绝缘膜上形成栅电极,形成第三绝缘膜以覆盖所述栅电极,以及在所述第三绝缘膜上形成导电膜。

    Capacitor, semiconductor device and manufacturing method thereof
    33.
    发明申请
    Capacitor, semiconductor device and manufacturing method thereof 有权
    电容器,半导体器件及其制造方法

    公开(公告)号:US20080174710A1

    公开(公告)日:2008-07-24

    申请号:US12077161

    申请日:2008-03-14

    IPC分类号: G02F1/136

    摘要: A highly reliable capacitor, a semiconductor device having high operating performance and reliability, and a manufacturing method thereof are provided. A capacitor formed of a first conductive film 102, a dielectric 103 made of an insulating material, and a second conductive film 104 is characterized in that a pin hole 106 formed by chance in the dielectric 103 is filled up with an insulating material (filler) 107 made of a resin material. This can prevent short circuit between the first conductive film 102 and the second conductive film 104. The capacitor is used as a storage capacitor provided in a pixel of a semiconductor device.

    摘要翻译: 提供了高度可靠的电容器,具有高操作性能和可靠性的半导体器件及其制造方法。 由第一导电膜102,由绝缘材料制成的电介质103和第二导电膜104形成的电容器的特征在于,在电介质103中偶然形成的销孔106填充有绝缘材料(填料) 107由树脂材料制成。 这可以防止第一导电膜102和第二导电膜104之间的短路。 电容器用作设置在半导体器件的像素中的存储电容器。

    Semiconductor Device and Method of Manufacturing the Same
    34.
    发明申请
    Semiconductor Device and Method of Manufacturing the Same 有权
    半导体器件及其制造方法

    公开(公告)号:US20080164478A1

    公开(公告)日:2008-07-10

    申请号:US11957641

    申请日:2007-12-17

    IPC分类号: H01L27/12

    摘要: In manufacturing a semiconductor device, static electricity is generated while contact holes are formed in an interlayer insulating film by dry etching. Damage to a pixel region or a driving circuit region due to travel of the static electricity generated is prevented. Gate signal lines are spaced apart from each other above a crystalline semiconductor film. Therefore a first protective circuit is not electrically connected when contact holes are opened in an interlayer insulating film. The static electricity generated during dry etching for opening the contact holes moves from the gate signal line, damages a gate insulating film, passes the crystalline semiconductor film, and again damages the gate insulating film before it reaches the gate signal line. As the static electricity generated during the dry etching damages the first protective circuit, the energy of the static electricity is reduced until it loses the capacity of damaging a driving circuit TFT. The driving circuit TFT is thus prevented from suffering electrostatic discharge damage.

    摘要翻译: 在制造半导体器件时,通过干蚀刻在层间绝缘膜中形成接触孔时产生静电。 防止了由于所产生的静电的行进而对像素区域或驱动电路区域的损害。 栅极信号线在结晶半导体膜之上彼此间隔开。 因此,当在层间绝缘膜中打开接触孔时,第一保护电路不电连接。 在干蚀刻期间产生的用于打开接触孔的静电从栅极信号线移动,损坏栅极绝缘膜,通过晶体半导体膜,并且在栅极绝缘膜到达栅极信号线之前再次损坏栅极绝缘膜。 由于在干蚀刻期间产生的静电损害第一保护电路,所以静电的能量减小,直到损失驱动电路TFT的能力。 从而防止了驱动电路TFT遭受静电放电损坏。

    Semiconductor device
    36.
    发明授权
    Semiconductor device 有权
    半导体器件

    公开(公告)号:US07330234B2

    公开(公告)日:2008-02-12

    申请号:US11079840

    申请日:2005-03-14

    IPC分类号: G02F1/1339

    摘要: A highly reliable capacitor, a semiconductor device having high operating performance and reliability, and a manufacturing method thereof are provided. A capacitor formed of a first conductive film 102, a dielectric 103 made of an insulating material, and a second conductive film 104 is characterized in that a pin hole 106 formed by chance in the dielectric 103 is filled up with an insulating material (filler) 107 made of a resin material. This can prevent short circuit between the first conductive film 102 and the second conductive film 104. The capacitor is used as a storage capacitor provided in a pixel of a semiconductor device.

    摘要翻译: 提供了高度可靠的电容器,具有高操作性能和可靠性的半导体器件及其制造方法。 由第一导电膜102,由绝缘材料制成的电介质103和第二导电膜104形成的电容器的特征在于,在电介质103中偶然形成的销孔106填充有绝缘材料(填料) 107由树脂材料制成。 这可以防止第一导电膜102和第二导电膜104之间的短路。 电容器用作设置在半导体器件的像素中的存储电容器。

    Light emitting structure including an exposed electrode overlapping a wiring or conductive layer
    38.
    发明授权
    Light emitting structure including an exposed electrode overlapping a wiring or conductive layer 有权
    发光结构包括与布线或导电层重叠的曝光电极

    公开(公告)号:US07282736B2

    公开(公告)日:2007-10-16

    申请号:US10731033

    申请日:2003-12-10

    摘要: (Object) In a light-emitting device, it is preferable that a surface of a film below a light-emitting element has flatness. Therefore, treatment such as planarization of a surface of a film is performed after forming the film. The present invention proposes a structure of a light-emitting device that can make the foregoing planarization easier. (Solving Means) The same layer as a wiring formed on a first film is used to manufacture a second film. Herewith, a portion of the first film below a light-emitting element can be prevented from being etched to form unevenness at a surface of the first film during the formation of the wiring. In addition, a surface of a third film is made higher by providing the second film to enable local planarization.

    摘要翻译: (对象物)在发光装置中,优选的是,发光元件下方的膜的表面具有平坦度。 因此,在形成膜之后进行膜表面的平坦化处理。 本发明提出能够使上述平坦化容易的发光装置的结构。 (解决方案)使用与形成在第一膜上的布线相同的层来制造第二膜。 由此,可以防止在形成布线期间在发光元件下方的第一膜的一部分被蚀刻以在第一膜的表面形成不均匀性。 此外,通过提供第二膜以使局部平坦化,使第三膜的表面更高。