公开(公告)号：US08408724B2

公开(公告)日：2013-04-02

申请号：US12641841

申请日：2009-12-18

申请人： Kozo Ogawa ,  Yusuke Shibahara ,  Kiyoshi Nishimura ,  Seiko Kawashima ,  Tsuyoshi Oyaizu ,  Haruki Takei

发明人： Kozo Ogawa ,  Yusuke Shibahara ,  Kiyoshi Nishimura ,  Seiko Kawashima ,  Tsuyoshi Oyaizu ,  Haruki Takei

IPC分类号： F21V8/00

CPC分类号： F21S8/02 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L2924/0002 ,  H01L2924/00

摘要： A light source module includes a module substrate, a metal conductor, a plurality of semiconductor light emitting elements, a white diffuse reflection layer, and translucent sealing members. The metal conductor is provided in a predetermined pattern on a front surface of the module substrate. The semiconductor light emitting elements are electrically connected to the metal conductor and mounted on the front surface of the module substrate. The white diffuse reflection layer includes a plurality of holes in which the semiconductor light emitting elements are located, is thinner than the semiconductor light emitting elements, and is laminated to the front surface of the module substrate. The translucent sealing members bury the semiconductor light emitting elements, project below the diffuse reflection layer, and are mixed with a phosphor.

摘要翻译： 光源模块包括模块衬底，金属导体，多个半导体发光元件，白色漫反射层和半透明密封构件。 金属导体以预定图案设置在模块基板的前表面上。 半导体发光元件电连接到金属导体并安装在模块基板的前表面上。 白色漫反射层包括半导体发光元件所在的多个孔，比半导体发光元件薄，并且层叠在模块基板的前表面。 半透明密封件将半导体发光元件埋入漫射反射层下方，并与荧光体混合。

公开(公告)号：US20120224372A1

公开(公告)日：2012-09-06

申请号：US13470593

申请日：2012-05-14

申请人： Kozo Ogawa ,  Kyoshi Nishimura ,  Nobuhiko Betsuda ,  Hiroki Tamai ,  Akiko Saito

发明人： Kozo Ogawa ,  Kyoshi Nishimura ,  Nobuhiko Betsuda ,  Hiroki Tamai ,  Akiko Saito

IPC分类号： F21V29/00

CPC分类号： F21K9/00 ,  F21S2/005 ,  F21V17/12 ,  F21V19/0035 ,  F21V19/0055 ,  F21V23/005 ,  F21V29/505 ,  F21V29/507 ,  F21V29/713 ,  F21V29/74 ,  F21Y2105/10 ,  F21Y2113/00 ,  F21Y2115/10 ,  H01L33/60 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： The light source unit is provided with a substrate and a decorative cover having thermal conductivity. The substrate includes a circuit pattern area, in which a plurality of LED chips are disposed, at the middle part thereof, has thermal conductivity, and transmits heat from the circuit pattern area to an area in the outer circumferential direction thereof. The decorative cover encloses the substrate, is electrically insulated from the circuit pattern area, and is thermally coupled to the surface side of the substrate at the periphery of the circuit pattern area by being face-contacted thereto. Heat of the substrate can be radiated by the decorative cover while securing an electric insulation property with respect to the circuit pattern area.

摘要翻译： 光源单元设置有基板和具有导热性的装饰盖。 基板包括在其中间部分设置有多个LED芯片的电路图形区域，具有导热性，并且将热量从电路图案区域传递到其外周方向的区域。 装饰盖包围基板，与电路图形区域电绝缘，并且通过与电路图形区域的周边面接触而与基板的表面侧热耦合。 可以通过装饰盖辐射基板的热量，同时确保相对于电路图案区域的电绝缘性能。

公开(公告)号：US20110254023A1

公开(公告)日：2011-10-20

申请号：US13090645

申请日：2011-04-20

申请人： Soichi SHIBUSAWA ,  Kiyoshi Nishimura ,  Kozo Ogawa ,  Nobuhiko Betsuda ,  Shuhei Matsuda ,  Masatoshi Kumagai

发明人： Soichi SHIBUSAWA ,  Kiyoshi Nishimura ,  Kozo Ogawa ,  Nobuhiko Betsuda ,  Shuhei Matsuda ,  Masatoshi Kumagai

IPC分类号： H01L27/15

CPC分类号： F21V19/0055 ,  F21K9/20 ,  F21S8/04 ,  F21V23/06 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/505 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2933/0041 ,  H05K1/0209 ,  H05K1/0289 ,  H05K3/284 ,  H05K2201/10106 ,  H01L2924/00014

摘要： According to one embodiment, the light-emitting apparatus is provided with a substrate, a plurality of light-emitting devices, and a phosphor layer. The plurality of light-emitting devices are mounted on the substrate. The phosphor layer is formed of a translucent resin containing a phosphor and includes a phosphor portion that is formed in a convex shape and covers a predetermined number of the light-emitting device. Bases of the adjacent phosphor portions are formed by being linked with one another.

摘要翻译： 根据一个实施例，发光装置设置有基板，多个发光装置和荧光体层。 多个发光装置安装在基板上。 荧光体层由含有荧光体的半透明树脂形成，并且包括形成为凸形并覆盖预定数量的发光器件的荧光体部分。 相邻的荧光体部分的基底通过彼此连接而形成。

公开(公告)号：USD624888S1

公开(公告)日：2010-10-05

申请号：US29358969

申请日：2010-04-02

申请人： Akimichi Takahashi ,  Kazuto Morikawa ,  Yusuke Shibahara ,  Kozo Ogawa

设计人： Akimichi Takahashi ,  Kazuto Morikawa ,  Yusuke Shibahara ,  Kozo Ogawa

公开(公告)号：US20100165624A1

公开(公告)日：2010-07-01

申请号：US12641841

申请日：2009-12-18

申请人： Kozo Ogawa ,  Yusuke Shibahara ,  Kiyoshi Nishimura ,  Seiko Kawashima ,  Tsuyoshi Oyaizu ,  Haruki Takei

发明人： Kozo Ogawa ,  Yusuke Shibahara ,  Kiyoshi Nishimura ,  Seiko Kawashima ,  Tsuyoshi Oyaizu ,  Haruki Takei

IPC分类号： F21V1/00

CPC分类号： F21S8/02 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L2924/0002 ,  H01L2924/00

摘要： A light source module includes a module substrate, a metal conductor, a plurality of semiconductor light emitting elements, a white diffuse reflection layer, and translucent sealing members. The metal conductor is provided in a predetermined pattern on a front surface of the module substrate. The semiconductor light emitting elements are electrically connected to the metal conductor and mounted on the front surface of the module substrate. The white diffuse reflection layer includes a plurality of holes in which the semiconductor light emitting elements are located, is thinner than the semiconductor light emitting elements, and is laminated to the front surface of the module substrate. The translucent sealing members bury the semiconductor light emitting elements, project below the diffuse reflection layer, and are mixed with a phosphor.

摘要翻译： 光源模块包括模块衬底，金属导体，多个半导体发光元件，白色漫反射层和半透明密封构件。 金属导体以预定图案设置在模块基板的前表面上。 半导体发光元件电连接到金属导体并安装在模块基板的前表面上。 白色漫反射层包括半导体发光元件所在的多个孔，比半导体发光元件薄，并且层叠在模块基板的前表面。 半透明密封件将半导体发光元件埋入漫射反射层下方，并与荧光体混合。

公开(公告)号：US20100117100A1

公开(公告)日：2010-05-13

申请号：US12612373

申请日：2009-11-04

申请人： Kozo Ogawa ,  Kiyoshi Nishimura

发明人： Kozo Ogawa ,  Kiyoshi Nishimura

IPC分类号： H01L33/00

CPC分类号： H01L25/0753 ,  F21K9/68 ,  F21V21/30 ,  F21Y2103/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L33/54 ,  H01L33/641 ,  H01L2924/0002 ,  H01L2924/00

摘要： There is provided a light-emitting module which makes it difficult to sense glare and which suppresses the temperature rise of light-emitting diode chips and has a cost advantage. The light-emitting module is provided with a base body formed with a non-metallic member having a thermal conductivity of 1 W/mk or less. In the base body, a plurality of LED chips are spaced 10 to 30 mm apart from each other, and their junction temperature when they are normally lit is preferably set at 90° C. or less. A translucent sealing member covering an area between the adjacent light-emitting diode chips is provided.

摘要翻译： 提供了使得难以感测眩光并抑制发光二极管芯片的温度升高的发光模块，并且具有成本优势。 发光模块设置有形成有导热率为1W / mk以下的非金属构件的基体。 在基体中，多个LED芯片彼此间隔开10〜30mm，其通常点亮时的结温优选为90℃以下。 提供了覆盖相邻的发光二极管芯片之间的区域的半透明密封构件。

公开(公告)号：US20090296412A1

公开(公告)日：2009-12-03

申请号：US12471579

申请日：2009-05-26

申请人： Kozo Ogawa ,  Aiko Takahashi ,  Nobuhiko Betsuda ,  Hiroki Tamai ,  Kiyoshi Nishimura ,  Akiko Saito ,  Ryotaro Matsuda

发明人： Kozo Ogawa ,  Aiko Takahashi ,  Nobuhiko Betsuda ,  Hiroki Tamai ,  Kiyoshi Nishimura ,  Akiko Saito ,  Ryotaro Matsuda

IPC分类号： F21V29/00 ,  F21S8/08

CPC分类号： F21V29/004 ,  F21S8/043 ,  F21S8/06 ,  F21V21/29 ,  F21V21/30 ,  F21V23/005 ,  F21V29/507 ,  F21V29/73 ,  F21V29/75 ,  F21V29/763 ,  F21V29/773 ,  F21V29/89 ,  F21Y2105/00 ,  F21Y2115/10 ,  F21Y2115/15

摘要： A spotlight is provided with a substrate having LEDs disposed thereon and a main body casing on which the substrate is provided. The main body casing has a rear side portion having thermal conductivity, which is thermally coupled to the substrate, and is capable of changing the irradiation angle of light emitted from the LEDs. A plurality of heat-radiating fins for forming grooves operating as a plurality of convection paths along the direction of changing the irradiation angle are provided on the rear side portion of the main body casing.

摘要翻译： 聚光灯具有设置有LED的基板和设置有基板的主体外壳。 主体外壳具有热传导性的后侧部分，其热耦合到基板，并且能够改变从LED发射的光的照射角度。 在主体壳体的后侧部分设置有用于形成沿着改变照射角度的方向作为多个对流路径工作的槽的多个散热片。

公开(公告)号：US08963190B2

公开(公告)日：2015-02-24

申请号：US13392107

申请日：2010-08-25

申请人： Ryotaro Matsuda ,  Kozo Ogawa ,  Makoto Sakai ,  Akiko Takahashi ,  Keiichi Shimizu ,  Kiyoshi Nishimura

发明人： Ryotaro Matsuda ,  Kozo Ogawa ,  Makoto Sakai ,  Akiko Takahashi ,  Keiichi Shimizu ,  Kiyoshi Nishimura

IPC分类号： H01L33/64 ,  F21V3/04 ,  F21S8/04 ,  F21V29/00 ,  F21Y101/02 ,  F21Y105/00

CPC分类号： H01L33/64 ,  F21S8/04 ,  F21V3/04 ,  F21V29/004 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L2224/48091 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A light-emitting device includes a substrate having a front surface on which a semiconductor light-emitting element is mounted. A front cover is provided which thermally contacts the front surface of the substrate at a periphery of the semiconductor light-emitting element and is disposed on a front side of the substrate. A heat conduction path is formed along which heat generated by the semiconductor light-emitting element is conducted in order of the substrate and the front cover and the heat is radiated from a front surface of the front cover, so that a heat radiation property from a front surface of the light-emitting device is improved.

摘要翻译： 发光装置包括其上安装有半导体发光元件的正面的基板。 提供了一种前盖，其在半导体发光元件的周围与基板的前表面热接触并设置在基板的前侧。 形成热传导路径，沿着该热传导路径，由半导体发光元件产生的热量按照基板和前盖的顺序进行，并且热量从前盖的前表面辐射，使得来自 改善了发光装置的前表面。

公开(公告)号：US08816381B2

公开(公告)日：2014-08-26

申请号：US12912434

申请日：2010-10-26

申请人： Nobuhiko Betsuda ,  Kozo Ogawa ,  Koyoshi Nishimura ,  Soichi Shibusawa

发明人： Nobuhiko Betsuda ,  Kozo Ogawa ,  Koyoshi Nishimura ,  Soichi Shibusawa

IPC分类号： H01L33/00

CPC分类号： H01L25/0753 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2933/0066 ,  H05K3/242 ,  H05K2201/09036 ,  H05K2201/10106 ,  H05K2201/2054 ,  H05K2203/175 ,  H01L2924/00014 ,  H01L2924/00

摘要： According to one embodiment, a light-emitting device includes a substrate, a plurality of pads and a plurality of light-emitting elements. The pads has electric conductance, and are arranged on the substrate. A reflecting layer which is formed by electroplating is provided on a surface of each of the pads. The light-emitting elements are mounted on the pads. A depressed part is left on the substrate. The depressed part is formed on the substrate by removing a pattern on the substrate, by which the pads are electrically connected.

摘要翻译： 根据一个实施例，发光器件包括衬底，多个焊盘和多个发光元件。 焊盘具有导电性，并且布置在基板上。 通过电镀形成的反射层设置在每个焊盘的表面上。 发光元件安装在焊盘上。 凹陷部分留在基板上。 凹陷部分通过去除衬底上的图案而形成在衬底上，衬垫被电连接。

公开(公告)号：US08616732B2

公开(公告)日：2013-12-31

申请号：US13024376

申请日：2011-02-10

申请人： Soichi Shibusawa ,  Kozo Ogawa ,  Kiyoshi Nishimura ,  Nobuhiko Betsuda

发明人： Soichi Shibusawa ,  Kozo Ogawa ,  Kiyoshi Nishimura ,  Nobuhiko Betsuda

IPC分类号： F21V7/00

CPC分类号： H01L25/0753 ,  F21K9/68 ,  F21S8/04 ,  F21V19/001 ,  F21V19/0055 ,  F21V31/04 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01L33/54 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/73265 ,  H05K3/284 ,  H05K2201/10106 ,  H01L2924/00014 ,  H01L2924/00

摘要： According to one embodiment, a light-emitting device comprises a substrate on a surface of which a light-emitting element is mounted, a light reflection layer formed on a second area of the surface of the substrate other than a first area on which the light-emitting element is mounted, and a sealing member sealing the light-emitting element. An engagement protrusion part protruding toward the sealing member is provided at an edge part of the light reflection layer at which the light reflection layer is in contact with the area on which the light-emitting element is mounted. The engagement protrusion part juts out into the sealing member to prevent exfoliation of the sealing member.

摘要翻译： 根据一个实施例，发光装置包括其表面上安装有发光元件的基板，形成在基板表面的第二区域上的光反射层，除了第一区域之外，光源 安装元件和密封发光元件的密封件。 在光反射层与安装有发光元件的区域接触的光反射层的边缘部分设置有朝向密封构件突出的接合突起部。 接合突出部突出到密封构件中，以防止密封构件的剥离。