Memory device and method for operating the same

    公开(公告)号:US12198757B2

    公开(公告)日:2025-01-14

    申请号:US17842989

    申请日:2022-06-17

    Abstract: A memory device and a method for operating the same are provided. The memory device includes a plurality of resistive memory cells and a control circuitry electrically connected to the plurality of resistive memory cells. The control circuitry provides operation modes to operate the plurality of resistive memory cells. The operation modes include a first program operation and a refresh operation. The first program operation includes applying a first program bias voltage to a selected resistive memory cell of the plurality of resistive memory cells to establish a low-resistance state in the selected resistive memory cell. The first program operation establishes a first threshold voltage in the memory device. The refresh operation includes applying a refresh bias voltage to the selected resistive memory cell to refresh the selected resistive memory cell. An absolute value of the refresh bias voltage is greater than the first threshold voltage.

    Memory device and computing method thereof

    公开(公告)号:US12094564B2

    公开(公告)日:2024-09-17

    申请号:US17817701

    申请日:2022-08-05

    CPC classification number: G11C7/1063 G11C7/1006 G11C7/109

    Abstract: The application provides a memory device and an operation method thereof. The memory device includes: a memory array, for processing model computation having a plurality of input values and a plurality of interact coefficients; and at least one calculation unit. In receiving the input values, a first part and a second part of the memory cells generate a first part and a second part of the common source currents, respectively. The first part of the memory cells is electrically isolated from the second part of the memory cells based on a diagonal of the memory array. The at least one calculation unit calculates a first part and a second part of a local field energy of the model computation based on the first part and the second part of the common source currents.

    Capped contact structure with variable adhesion layer thickness

    公开(公告)号:US11569445B2

    公开(公告)日:2023-01-31

    申请号:US17162803

    申请日:2021-01-29

    Abstract: Metal oxide based memory devices and methods for manufacturing are described herein. A method for manufacturing a memory cell includes forming a bottom adhesion layer in a via formed in an insulating layer. Forming a bottom conductive plug in the bottom adhesion layer. Forming a top adhesion layer over the bottom adhesion layer and bottom conductive plug. Forming a top conductive plug in the top adhesion layer. Wherein the thickness of the bottom and top adhesion layers may be different from one another.

    Tungsten oxide RRAM with barrier free structure

    公开(公告)号:US10811602B2

    公开(公告)日:2020-10-20

    申请号:US15836446

    申请日:2017-12-08

    Abstract: Memory devices based on tungsten oxide memory elements are described, along with methods for manufacturing such devices. A memory device includes a plug extending upwardly from a top surface of a substrate through a dielectric layer; a bottom electrode having tungsten on an outside surface, the bottom electrode extending upwardly from a top surface of the plug; an insulating material in contact with the tungsten on the outside surface of, and surrounding, the bottom electrode; a memory element on an upper surface of the bottom electrode, the memory element comprising a tungsten oxide compound and programmable to at least two resistance states; and a top electrode overlying and contacting the memory element. The plug has a first lateral dimension, and the bottom electrode has a lateral dimension parallel with the first lateral dimension of the plug that is less than the first lateral dimension.

    Memory device and operation method thereof

    公开(公告)号:US10460444B2

    公开(公告)日:2019-10-29

    申请号:US15922987

    申请日:2018-03-16

    Abstract: Disclosed is a memory device including plural bit lines, plural word lines and a control circuit. The bit lines are configured to receive pixel data of an image. Each word line includes plural factor units. The factor units of each word line are configured differently according to plural factors of a filter. When processing a first area of the image by the filter, the control circuit inputs the pixel data within the first area of the image to the bit lines, and enables one of the word lines for operation. When processing a second area of the image by the filter, the control circuit maintains the pixel data within the second area overlapping the first area on the bit lines, and inputs the pixel data within the second area which doesn't overlap the first area to the bit lines, and enables another one of the word lines for operation.

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