公开(公告)号：US09145425B2

公开(公告)日：2015-09-29

申请号：US13639412

申请日：2011-04-04

申请人： Shinya Hisakawa ,  Yasushi Hasegawa ,  Toshiaki Aoki ,  Hiroki Kusano ,  Masayuki Sano ,  Jun Sato ,  Kenji Yamawaki

发明人： Shinya Hisakawa ,  Yasushi Hasegawa ,  Toshiaki Aoki ,  Hiroki Kusano ,  Masayuki Sano ,  Jun Sato ,  Kenji Yamawaki

IPC分类号： C07D471/08 ,  C07D501/56 ,  C07D505/24 ,  C07D501/46 ,  C07D519/06

CPC分类号： C07D505/24 ,  C07D471/08 ,  C07D501/46 ,  C07D501/56 ,  C07D519/06

摘要： This invention provides Cephem compounds having the formula: or an ester, a protected compound at the amino on the ring in the 7-side chain, a pharmaceutically acceptable salt, or a solvate thereof, a pharmaceutical composition thereof, and a method for treating a bacterial infectious disease with the compound, the ester, the protected compound, the salt, or the solvate thereof, wherein the symbols in the formula are defined in the specification. The compounds exhibit potent antimicrobial spectrum against a variety of bacteria including Gram negative bacteria and/or Gram positive bacteria, preferably beta-lactamase producing Gram negative bacteria, more preferably, multi-drug resistant microbials, in particular, Class B type metallo-beta-lactamase producing Gram negative bacteria, and still preferably extended-spectrum beta-lactamase (ESBL) producing bacteria. The compounds most preferably do not exhibit cross-resistance against known Cephem drugs or Carbapenem drugs.

摘要翻译： 本发明提供具有下式的Cephem化合物：或酯，7-侧链上的环上的氨基上的被保护的化合物，其药学上可接受的盐或溶剂合物，其药物组合物和 化合物，酯，受保护化合物，盐或其溶剂化物的细菌感染性疾病，其中式中的符号在说明书中定义。 该化合物对各种细菌（包括革兰氏阴性细菌和/或革兰氏阳性细菌，优选β-内酰胺酶产生革兰氏阴性细菌，更优选多药耐药性微生物，特别是B类金属β- 产生革兰氏阴性细菌的内酰胺酶，更优选延长的β-内酰胺酶（ESBL）产生细菌。 该化合物最优选不表现出对已知的Cephem药物或碳青霉烯类药物的抗药性。

公开(公告)号：US08698004B2

公开(公告)日：2014-04-15

申请号：US12499311

申请日：2009-07-08

申请人： Yasushi Hasegawa

发明人： Yasushi Hasegawa

IPC分类号： H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K1/14

CPC分类号： H05K3/0097 ,  H05K3/0052 ,  H05K3/225 ,  H05K2201/10598 ,  H05K2203/162 ,  Y10T29/49126

摘要： A fabrication method for a multi-piece board includes: checking whether pieces (printed wiring boards) are defect-free or not; forming a first recess in a joint portion between a defective piece and a frame; forming a first fitting portion at the frame by separating the defective piece; cutting out a defect-free piece having a second fitting portion from another board; forming a second recess in the second fitting portion; fitting the second fitting portion into the first fitting portion; flattening a joint portion; and filling an adhesive in a third recess which is formed by the first recess and the second recess, and curing the adhesive to adhere the frame and the defect-free piece.

摘要翻译： 多片板的制造方法包括：检查片（印刷线路板）是否无缺陷; 在缺陷片和框架之间的接合部分中形成第一凹部; 通过分离缺陷件在框架上形成第一装配部分; 从另一个板切割具有第二装配部分的无缺陷部件; 在所述第二装配部分中形成第二凹部; 将所述第二装配部分装配到所述第一装配部分中; 压平接头部分; 以及将粘合剂填充在由所述第一凹部和所述第二凹部形成的第三凹部中，并且固化所述粘合剂以使所述框架和所述无缺陷部件粘合。

公开(公告)号：US08259467B2

公开(公告)日：2012-09-04

申请号：US12537586

申请日：2009-08-07

申请人： Yasushi Hasegawa

发明人： Yasushi Hasegawa

IPC分类号： H05K7/02

CPC分类号： H05K3/0097 ,  H05K1/0269 ,  H05K3/0052 ,  H05K3/225 ,  H05K3/30 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2201/10598 ,  H05K2203/0169 ,  H05K2203/161 ,  Y10T29/49126

摘要： A method of fabricating a multi-piece board includes: adhering a first frame element connected to multiple piece portions to a second frame element, the first frame element forming a board main portion of a multi-piece board, the first frame element and the second frame element forming a frame portion of the multi-piece portion, thereby yielding the multi-piece board; mounting multiple electronic components on the piece portions, respectively; separating the piece portions from the frame portion; separating, from the first frame element, the second frame element adhered thereto; and adhering the second frame element to a first frame element of another board main portion.

摘要翻译： 一种制造多片板的方法包括：将连接到多片部分的第一框架元件粘附到第二框架元件，第一框架元件形成多片板的板主体部分，第一框架元件和第二框架元件 框架元件形成多片部分的框架部分，从而产生多片板; 分别在零件上安装多个电子部件; 将所述片部分与所述框架部分分离; 从第一框架元件分离粘附到其上的第二框架元件; 以及将所述第二框架元件粘合到另一个板主体部分的第一框架元件。

公开(公告)号：US20070276832A1

公开(公告)日：2007-11-29

申请号：US11802902

申请日：2007-05-25

申请人： Masaomi Teranishi ,  Yasushi Hasegawa ,  Hiroyuki Morozumi

发明人： Masaomi Teranishi ,  Yasushi Hasegawa ,  Hiroyuki Morozumi

IPC分类号： G06F7/00

CPC分类号： G06F11/3404

摘要： Aiming at enabling an analysis of relationship between a task transition and performance information such as mis-caching in a multiprocessor system and clearly identifying a relationship between a degree of parallelism and the task transition of the system processing, trace information and performance information corresponding to the trace information are obtained from memory, and the task transition state and performance information based on the trace information are displayed by superimposing on the transition chart. A degree of parallelism corresponding to an operation state of a plurality of processors is calculated on the basis of the trace information, and the degree of parallelism is displayed by being temporally synchronized with the task transition chart.

摘要翻译： 为了能够分析任务转换与诸如多处理器系统中的错误缓存的性能信息之间的关系，并且清楚地识别并行度与系统处理的任务转换之间的关系，跟踪信息和对应于 从存储器获取跟踪信息，并且通过叠加在转换图上显示基于跟踪信息的任务转换状态和性能信息。 基于跟踪信息计算与多个处理器的操作状态对应的并行程度，并且通过与任务转移图进行时间同步来显示并行度。

公开(公告)号：US20070052074A1

公开(公告)日：2007-03-08

申请号：US11510598

申请日：2006-08-28

申请人： Yasushi Hasegawa

发明人： Yasushi Hasegawa

IPC分类号： H01L23/495

CPC分类号： H01L31/125 ,  H01L31/18 ,  H01L2224/49111 ,  H01L2224/49175

摘要： After a light emitting element is mounted to a header of a light emitting lead frame, a light receiving element is mounted to a header of a light receiving lead frame and a power element is mounted to a header of a power lead frame, the light emitting element, the light receiving element and the power element are connected to respective lead portions with wires, and in a state with the light emitting element, and the light receiving element and the power element, disposed facing each other, they are entirely coated with a primary molding resin, and the primary molding resin and a heat sink formed in a heat dissipating lead frame are coated with a secondary molding resin. Also, a structure is adopted in which the lead terminal of the power element and the heat dissipating lead frame are stacked together, and joined at this stacked portion.

摘要翻译： 在将发光元件安装到发光引线框架的头部之后，光接收元件安装到光接收引线框架的头部，并且功率元件安装到电源引线框架的头部，发光 元件，光接收元件和功率元件通过导线连接到相应的引线部分，并且在与发光元件以及光接收元件和功率元件相对置的状态下，它们被完全涂覆有 初级模制树脂和形成在散热引线框架中的初级模制树脂和散热器涂覆有二次模塑树脂。 此外，采用将功率元件的引线端子和散热引线框架堆叠在一起的结构，并且在该堆叠部分处接合。

公开(公告)号：US20060055991A1

公开(公告)日：2006-03-16

申请号：US11108207

申请日：2005-04-15

申请人： Jun Minakuti ,  Yasushi Hasegawa ,  Hiroaki Kubo

发明人： Jun Minakuti ,  Yasushi Hasegawa ,  Hiroaki Kubo

IPC分类号： G03F3/08

CPC分类号： H04N5/2352 ,  H04N5/202 ,  H04N2101/00

摘要： A digital camera (10a) is placed in any of three photographing modes labeled a “narrow mode”, a “normal mode”, and a “wide mode”. An operating point setter (903) variably sets an operating point of a CCD (26) defining a brightness range of a subject which falls within a dynamic range of an image sensor, based on a photographing mode as set. A LUT setter (902) variably sets a gradation correction LUT which is a concrete representation of gradation correction characteristics in gradation correction performed by a γ correction circuit (55) (characteristics in γ correction), based on the photographing mode as set. The operating point set by the operating point setter (903) and the gradation correction LUT set by the LUT setter (902) are changed in synchronism with each other in accordance with change in the photographing mode.

摘要翻译： 将数字照相机（10a）放置在标记为“窄模式”，“正常模式”和“宽模式”的三种拍摄模式中的任一种中。 操作点设定器（903）基于设定的拍摄模式，可变地设定限定被摄体的亮度范围的CCD（26）的工作点，其位于图像传感器的动态范围内。 LUT设定器（902）基于设定的拍摄模式，可变地设置灰度校正LUT，其是由伽马校正电路（55）执行的灰度校正（伽马校正的特性）的灰度校正特性的具体表示。 由操作点设定器（903）设置的操作点和由LUT设定器（902）设置的灰度校正LUT根据拍摄模式的变化而彼此同步地改变。

公开(公告)号：US20050168624A1

公开(公告)日：2005-08-04

申请号：US11043773

申请日：2005-01-26

申请人： Yasushi Hasegawa

发明人： Yasushi Hasegawa

IPC分类号： G03B7/16 ,  G02B7/28 ,  G03B7/097 ,  G03B7/28 ,  G03B15/03 ,  G03B15/05 ,  G03B17/12 ,  G03B17/14 ,  H04N5/225 ,  H04N5/235 ,  H04N5/238 ,  H04N101/00

CPC分类号： H04N5/2256 ,  H04N5/2354

摘要： An image capturing apparatus having a light emission section for emitting flash and to which a close-up lens is mounted. The image capturing apparatus further includes a detecting section which detects that the close-up lens is mounted to the image capturing apparatus, and a controller which switches a flash shooting control of the light emission section from a dimmer control to a flashmatic control when the detecting section detects that the close-up lens is mounted to the image capturing apparatus.

摘要翻译： 一种具有用于发射闪光并且安装有特写镜头的光发射部分的摄像装置。 该摄像装置还包括：检测部件，其检测到特写镜头被安装到摄像装置;以及控制器，其将检测到的发光部分的闪光拍摄控制从调光器控制切换到闪光控制 部分检测到特写镜头被安装到图像捕获设备。

公开(公告)号：US06562817B1

公开(公告)日：2003-05-13

申请号：US09600790

申请日：2000-07-21

申请人： Norihiko Tanimoto ,  Yasushi Hasegawa ,  Nobuhiro Haga

发明人： Norihiko Tanimoto ,  Yasushi Hasegawa ,  Nobuhiro Haga

IPC分类号： C07D21302

CPC分类号： C07D401/10 ,  C07C43/20 ,  C07C43/23 ,  C07C215/76 ,  C07C215/82 ,  C07C217/54 ,  C07C217/58 ,  C07C217/84 ,  C07C217/86 ,  C07C217/90 ,  C07C233/25 ,  C07D213/30 ,  C07D213/61 ,  C07D213/64 ,  C07D213/73 ,  C07D213/74 ,  C07D213/75 ,  C07D213/76 ,  C07D231/12 ,  C07D237/12 ,  C07D237/14 ,  C07D239/26 ,  C07D239/36 ,  C07D241/12 ,  C07D261/08 ,  C07D263/32 ,  C07D277/06 ,  C07D307/38 ,  C07D333/06

摘要： The present invention provides a compound of the formula (I):   wherein A ring, B ring and C ring are each independently optionally substituted aromatic carbocycle or optionally substituted 5- or 6-membered heterocycle which may fuse with benzene ring, W1, W2 and/or W3 represents a bond when A ring, B ring and/or C ring is optionally substituted 5-membered heterocycle, X is —O—, —NR1— wherein R1 is hydrogen, lower alkyl etc. or the like, Y is hydrogen, lower alkyl, lower alkenyl or the like, one of V1 and V2 is a bond, and the other is a bond, —O— or the like, and a pharmaceutical composition comprising the same.

摘要翻译： 本发明提供式（I）的化合物：其中A环，B环和C环各自独立地是任选取代的芳族碳环或任选取代的可与苯环，W1，W2和 当A环，B环和/或C环为任选取代的5元杂环时，X为-O-，-NR 1 - ，其中R 1为氢，低级烷基等，Y为氢 低级烷基，低级烯基等，V1和V2之一是键，另一个是键或-O-等，以及包含它们的药物组合物。

公开(公告)号：US06264761B1

公开(公告)日：2001-07-24

申请号：US09214635

申请日：1999-01-06

申请人： Yasushi Hasegawa ,  Eiji Tsuru ,  Yuichi Sato ,  Shigekatsu Ozaki

发明人： Yasushi Hasegawa ,  Eiji Tsuru ,  Yuichi Sato ,  Shigekatsu Ozaki

IPC分类号： C22C1903

CPC分类号： B23K35/3033 ,  B23K35/0233 ,  Y10T428/12431

摘要： The present invention provides liquid phase diffusion bonding alloy foils capable of bonding in an oxidizing atmosphere, which can ensure joints with a homogeneous structure and adequate tensile strength in air in a short period of time using various alloys or Fe-based materials as materials to be bonded; specifically, they are Ni-based liquid phase diffusion bonding alloy foils with compositions comprising as essential components in terms of atomic percent, the diffusion elements B or P at 1.0-20.0% or B and P each at 1.0-20.0%, and Si at 0.5 to ≦15% or 0.5 to

摘要翻译： 本发明提供能够在氧化气氛中结合的液相扩散接合合金箔，其可以使用各种合金或Fe基材料作为材料在短时间内确保接头具有均匀的结构和足够的抗拉强度 保税 具体地说，它们是Ni基液相扩散接合合金箔，其组成包括原子百分数，扩散元素B或P为1.0-20.0％或B和P各自为1.0-20.0％的必要组分，Si为 0.5至<= 15％或0.5至<10％，V为0.1-20.0％，余量基本为Ni和不可避免的杂质，厚度为3-100μm。 如果需要，可酌情选择性地包括一种或多种Cr，Mn或Mo，Co和/或一种或多种W，Nb和Ti。 具有基本无定形晶体结构的组合物是最有效的。

公开(公告)号：US5759300A

公开(公告)日：1998-06-02

申请号：US716314

申请日：1996-09-27

申请人： Yasushi Hasegawa ,  Hisashi Naoi ,  Yuuichi Satoh ,  Hiroshi Ukeba

发明人： Yasushi Hasegawa ,  Hisashi Naoi ,  Yuuichi Satoh ,  Hiroshi Ukeba

IPC分类号： B23K20/00 ,  B23K35/02 ,  B23K35/30 ,  C22C19/05 ,  C22C45/04

CPC分类号： B23K35/0233 ,  B23K35/3033 ,  B23K35/304 ,  Y10T428/12431 ,  Y10T428/12937 ,  Y10T428/12944

摘要： Alloy foils for liquid-phase diffusion bonding of heat-resisting metals in an oxidizing atmosphere comprise 6.0 to 15.0 percent silicon, 0.1 to 2.0 percent manganese, 0.50 to 30.0 percent chromium, 0.10 to 5.0 percent molybdenum, 0.50 to 10.0 percent vanadium, 0.02 to 1.0 percent niobium, 0.10 to 5.0 percent tungsten, 0.01 to 0.5 percent nitrogen, 0.10 to 5.0 percent boron, plus 0.005 to 1.0 percent carbon, and/or either or both of 0.01 to 5.0 percent titanium and 0.01 to 5.0 percent zirconium, all by mass, with the balance comprising nickel and impurities, and have a thickness of 3.0 to 300 .mu.m. Alloy foils for liquid-phase diffusion bonding of heat-resisting metals in an oxidizing atmosphere are also available with substantially vitreous structures.

摘要翻译： PCT No.PCT / JP95 / 00594 Sec。 371日期1996年9月27日第 102（e）1996年9月27日PCT 1995年3月29日PCT PCT。 出版物WO95 / 26419 日期：1995年10月5日耐热金属在氧化性气氛中的液相扩散接合用合金箔包含6.0〜15.0％的硅，0.1〜2.0％的锰，0.50〜30.0％的铬，0.10〜5.0％的钼，0.50〜10.0 0.01-0.0％的铌，0.10〜5.0％的钨，0.01〜0.5％的氮，0.10〜5.0％的硼，0.005〜1.0％的碳，和/或0.01〜5.0％的钛和0.01〜5.0 百分比的锆，质量均匀，余量包括镍和杂质，并且具有3.0至300μm的厚度。 用于在氧化气氛中耐热金属的液相扩散接合的合金箔也可用于基本上玻璃质结构。