公开(公告)号：US4486605A

公开(公告)日：1984-12-04

申请号：US456455

申请日：1983-01-07

申请人： Haruhisa Harada ,  Hiroshi Maki

发明人： Haruhisa Harada ,  Hiroshi Maki

IPC分类号： C07C45/53 ,  C07C45/66 ,  C07C49/794 ,  C07C49/82 ,  C07C409/08

CPC分类号： C07C409/08 ,  C07C407/00 ,  C07C45/53 ,  C07C45/66 ,  C07C49/794 ,  C07C49/82

摘要： A method for producing an aromatic carbonyl compound represented by the formula (B)-1 or (B)-2: ##STR1## comprising decomposing a hydroperoxide represented by the formula (A)-1 or (A)-2: ##STR2## wherein R.sub.1, R.sub.2, R.sub.3 and R.sub.4 are defined in the specification, in an inert gas atmosphere in the presence of an aqueous layer containing an iron salt, a copper salt and an acid is disclosed. Novel m-(2-hydroxy-2-propyl)acetophenone and m-isopropenylacetophenone which are useful as an intermediate for the preparation of medicines are also disclosed. A method for producing m-isopropenylacetophenone comprising dehydrating m-(2-hydroxy-2-propyl)acetophenone in the presence of an acid catalyst is further disclosed.

摘要翻译： 一种由式（B）-1或（B）-2表示的芳族羰基化合物的制备方法：（B）-1（B）-2，包括分解由式（A ）-1或（A）-2：（A）-1图像（A）-2其中R1，R2，R3和R4在说明书中定义为在惰性气体气氛中， 公开了含有铁盐，铜盐和酸的水层。 还公开了可用作制备药物的中间体的新型的2-（2-羟基-2-丙基）苯乙酮和间 - 异丙烯基苯乙酮。 进一步公开了在酸催化剂存在下使间 - （2-羟基-2-丙基）苯乙酮脱水的制备间异丙烯基苯乙酮的方法。

公开(公告)号：US4075285A

公开(公告)日：1978-02-21

申请号：US554524

申请日：1975-03-03

申请人： Minoru Tabana ,  Shizuo Narisawa ,  Tatsuyuki Mitsuno ,  Hiroshi Maki

发明人： Minoru Tabana ,  Shizuo Narisawa ,  Tatsuyuki Mitsuno ,  Hiroshi Maki

IPC分类号： C08L53/00 ,  C08L7/00 ,  C08L21/00 ,  C08L23/00 ,  C08L25/00 ,  C08L25/06 ,  C08L51/00 ,  C08L51/02 ,  C08L51/04 ,  C08L53/02 ,  C08L77/00 ,  C08L101/00

CPC分类号： C08L25/06 ,  C08L51/04 ,  C08L53/02

摘要： A rubber-modified polystyrene resin composition consisting essentially of a rubber-modified polystyrene and a transparent, resinous styrene-butadiene block copolymer containing 65 to 95% by weight of styrene and 5 to 35% by weight of butadiene. This resin composition is excellent in impact strength, elongation, flexural stress clouding, hinging endurance, and surface gloss.

摘要翻译： 橡胶改性聚苯乙烯树脂组合物，主要由橡胶改性的聚苯乙烯和含有65-95％（重量）苯乙烯和5-35％（重量）丁二烯的透明树脂苯乙烯 - 丁二烯嵌段共聚物组成。 该树脂组合物的冲击强度，伸长率，弯曲应力混浊，铰链耐久性和表面光泽性优异。

公开(公告)号：US4073831A

公开(公告)日：1978-02-14

申请号：US545350

申请日：1975-01-30

申请人： Minoru Tabana ,  Tatsuyuki Mitsuno ,  Hiroshi Maki ,  Shizuo Narisawa

发明人： Minoru Tabana ,  Tatsuyuki Mitsuno ,  Hiroshi Maki ,  Shizuo Narisawa

IPC分类号： C08F297/00 ,  B29C51/00 ,  C08F297/04 ,  C08L23/00 ,  C08L25/00 ,  C08L25/06 ,  C08L51/00 ,  C08L51/02 ,  C08L53/00 ,  C08L53/02 ,  C08L77/00 ,  C08L101/00

CPC分类号： C08L25/06 ,  B29C51/002 ,  C08L53/02

摘要： A novel thermoplastic resin composition consisting essentially of polystyrene and a styrene-butadiene block copolymer. This resin composition is transparent, is excellent in mechanical properties, particularly in elongation, impact strength, and stiffness, is not liable to become cloudy on being bent, and is favorable in hinging endurance as well as in thermal resistance.

摘要翻译： 一种基本上由聚苯乙烯和苯乙烯 - 丁二烯嵌段共聚物组成的新型热塑性树脂组合物。 该树脂组合物是透明的，机械特性优异，特别是伸长率，冲击强度和刚度优异，在弯曲时不容易变得浑浊，并且耐铰链性以及耐热性良好。

公开(公告)号：US08593261B2

公开(公告)日：2013-11-26

申请号：US13043820

申请日：2011-03-09

申请人： Susumu Takagi ,  Hiroshi Maki

发明人： Susumu Takagi ,  Hiroshi Maki

IPC分类号： H04Q5/22

CPC分类号： G05B19/12 ,  G05B2219/31288 ,  G05B2219/31304 ,  H01L24/75 ,  H01L2924/01019 ,  H01L2924/14 ,  Y02P90/10 ,  H01L2924/00

摘要： RFID tags are attached to tools of a preform head, a bonding head, and a push-up unit, and information related to each tool such as a dimension of a processing-target die is stored into the RFID tags. When a tool is mounted, an operator inputs manufacturing conditions related to the tool. When information related to the tool read from the RFID tag by an RFID reader/writer and the manufacturing conditions related to the tool do not match each other, a message about wrong mounting of the tool is displayed on a monitor. Further, an operation history of the tool is written into the RFID tag by the RFID reader/writer when the production is completed. The operation history is read when the next production is started, and if the values of the operation history exceed predetermined numbers of times, a message is displayed on the monitor.

摘要翻译： RFID标签附接到预成型件头，接合头和上推单元的工具，并且与诸如处理目标管芯的尺寸的每个工具相关的信息被存储到RFID标签中。 当安装工具时，操作员输入与该工具相关的制造条件。 当与RFID读写器从RFID标签读取相关的信息以及与该工具相关的制造条件不相符时，在显示器上显示有关错误安装工具的信息。 此外，当生产完成时，RFID读取器/写入器将工具的操作历史写入RFID标签。 当下次生产开始时，读取操作历史，如果操作历史的值超过预定次数，则在显示器上显示一条消息。

公开(公告)号：US08450150B2

公开(公告)日：2013-05-28

申请号：US12756178

申请日：2010-04-08

申请人： Hiroshi Maki ,  Makoto Ise

发明人： Hiroshi Maki ,  Makoto Ise

IPC分类号： H01L21/50 ,  H01L23/48 ,  H01L23/498

CPC分类号： H01L24/83 ,  H01L21/6836 ,  H01L23/3121 ,  H01L23/49838 ,  H01L24/27 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/95 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2224/05624 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2224/48824 ,  H01L2224/4945 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2224/85191 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01032 ,  H01L2924/3512 ,  H01L2224/4554

摘要： While an adhesive layer is provided over the rear surface of a semiconductor chip in die bonding, a lamination processing (main pressure bonding) is necessary for securing the adhesive state of the adhesive layer after the die bonding process (temporary pressure bonding). In this case, typically the hardening of the adhesive is developed by applying heat while pressing down the rear surface of the chip from above with a pressurization member. It has become clear that various problems exist in the lamination processing of the laminate chips by such a mechanical pressurization method as the chip becomes thinner. That is, the problems include chip damage at a part in an overhang state, a chip position shift caused by bending and non-uniform pressurization, and the like.One invention of the present application is to perform the lamination processing by static gas pressure after laminating and temporarily pressure-bonding the plurality of semiconductor chips over a circuit substrate in the die bonding process of a substrate product.

摘要翻译： 虽然在芯片接合中在半导体芯片的后表面上设置粘合剂层，但是在芯片接合处理（临时压接）之后，需要层压处理（主压接）来确保粘合剂层的粘合状态。 在这种情况下，通常通过施加热量同时通过加压构件从上方向下压着芯片的后表面来显影粘合剂的硬化。 通过这样一种机械加压方法，芯片变得更薄，层压芯片的层压处理中存在各种问题。 也就是说，这些问题包括悬伸状态下的部分的切屑损伤，由弯曲引起的切屑位置偏移和不均匀的加压等。 本申请的一个发明是在基板产品的芯片接合工艺中，通过静电气体压力进行层压处理，并在电路基板上临时压接多个半导体芯片。

公开(公告)号：US08211261B2

公开(公告)日：2012-07-03

申请号：US12836445

申请日：2010-07-14

申请人： Hiroshi Maki ,  Kazuhiro Seiki ,  Eiji Wada

发明人： Hiroshi Maki ,  Kazuhiro Seiki ,  Eiji Wada

IPC分类号： B29C65/00 ,  B32B37/00 ,  B32B38/04

CPC分类号： H01L21/67132 ,  Y10T156/1077 ,  Y10T156/1089 ,  Y10T156/1092 ,  Y10T156/1132 ,  Y10T156/1179 ,  Y10T156/1983

摘要： A manufacturing method of a semiconductor device comprising the steps of: affixing a die attach film and a dicing film to a back surface of a semiconductor wafer: thereafter dicing the semiconductor wafer and the die attach film to divide the semiconductor wafer into a plurality of semiconductor chips: thereafter pulling the dicing film from the center toward the outer periphery of the dicing film with a first tensile force to cut the die attach film chip by chip; and thereafter picking up the semiconductor chips together with the die attach film while pulling the dicing film from the center toward the outer periphery of the dicing film with a second tensile force smaller than the first tensile force.

摘要翻译： 一种半导体器件的制造方法，包括以下步骤：将芯片附着膜和切割膜固定到半导体晶片的背面上：其后，切割半导体晶片和芯片附着膜，将半导体晶片分割成多个半导体 芯片：此后以第一张力将切割膜从中心朝向切割膜的外周拉出，以切割芯片附着膜芯片; 然后以小于第一张力的第二拉伸力从切割膜的中心向外周拉动切割膜，同时与芯片附着膜一起拾取半导体芯片。

公开(公告)号：US08003495B2

公开(公告)日：2011-08-23

申请号：US12987779

申请日：2011-01-10

申请人： Hiroshi Maki ,  Tsuyoshi Yokomori ,  Tatsuyuki Okubo

发明人： Hiroshi Maki ,  Tsuyoshi Yokomori ,  Tatsuyuki Okubo

IPC分类号： H01L21/00

CPC分类号： H01L21/77 ,  H01L21/67132 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/6838 ,  H01L21/78 ,  H01L22/12 ,  H01L22/20 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/75 ,  H01L24/83 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  Y10T156/1132 ,  Y10T156/1944 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/01032 ,  H01L2924/01031 ,  H01L2924/3512

摘要： In a chip pick-up process after dicing in an assembly process during manufacture of a semiconductor integrated circuit device it is an important subject to diminish a pick-up defect caused by the reduction in thickness of each chip which is proceeding in quick tempo. Particularly, bending of the chip peripheral portion caused by a peeling operation is very likely to induce cracking and chipping of the chip. In the present invention, to solve these problems, in case of peeling a chip from a dicing tape (adhesive tape) or the like while vacuum-chucking the chip by a chucking collet, the flow rate of a vacuum chucking system in the chucking collet is monitored to check a bent state of the chip before complete separation of the first chip from the adhesive tape.

摘要翻译： 在半导体集成电路器件制造期间的组装工艺中的切割之后的芯片拾取过程中，减少由快速进行的每个芯片的厚度减小引起的拾取缺陷是重要的课题。 特别地，由剥离操作引起的芯片周边部分的弯曲很可能引起芯片的破裂和碎裂。 在本发明中，为了解决这些问题，在通过夹紧夹头对芯片进行真空夹持的情况下，在从切割带（胶带）等剥离芯片的情况下，夹紧夹头中的真空夹紧系统的流量 被监视以在第一芯片从胶带完全分离之前检查芯片的弯曲状态。

公开(公告)号：US20110097849A1

公开(公告)日：2011-04-28

申请号：US12987779

申请日：2011-01-10

申请人： Hiroshi Maki ,  Tsuyoshi Yokomori ,  Tatsuyuki Okubo

发明人： Hiroshi Maki ,  Tsuyoshi Yokomori ,  Tatsuyuki Okubo

IPC分类号： H01L21/50

CPC分类号： H01L21/77 ,  H01L21/67132 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/6838 ,  H01L21/78 ,  H01L22/12 ,  H01L22/20 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/75 ,  H01L24/83 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  Y10T156/1132 ,  Y10T156/1944 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/01032 ,  H01L2924/01031 ,  H01L2924/3512

摘要： In a chip pick-up process after dicing in an assembly process during manufacture of a semiconductor integrated circuit device it is an important subject to diminish a pick-up defect caused by the reduction in thickness of each chip which is proceeding in quick tempo. Particularly, bending of the chip peripheral portion caused by a peeling operation is very likely to induce cracking and chipping of the chip. In the present invention, to solve these problems, in case of peeling a chip from a dicing tape (adhesive tape) or the like while vacuum-chucking the chip by a chucking collet, the flow rate of a vacuum chucking system in the chucking collet is monitored to check a bent state of the chip before complete separation of the first chip from the adhesive tape.

摘要翻译： 在半导体集成电路器件制造期间的组装工艺中的切割之后的芯片拾取过程中，减少由快速进行的每个芯片的厚度减小引起的拾取缺陷是重要的课题。 特别地，由剥离操作引起的芯片周边部分的弯曲很可能引起芯片的破裂和碎裂。 在本发明中，为了解决这些问题，在通过夹紧夹头对芯片进行真空夹持的情况下，在从切割带（胶带）等剥离芯片的情况下，夹紧夹头中的真空夹紧系统的流量 被监视以在第一芯片从胶带完全分离之前检查芯片的弯曲状态。

公开(公告)号：US06844979B2

公开(公告)日：2005-01-18

申请号：US10452227

申请日：2003-06-03

申请人： Hiroshi Maki ,  Tetsuo Hattori ,  Takuya Shimbo

发明人： Hiroshi Maki ,  Tetsuo Hattori ,  Takuya Shimbo

IPC分类号： G02F1/13 ,  G02F1/1333 ,  G03B21/00 ,  G03B21/16 ,  H04N9/31 ,  G02B27/14 ,  G03B21/26 ,  G03B21/22 ,  G02F1/1335

CPC分类号： H04N9/3105

摘要： A projection display apparatus in which a light emitted from a reflective light valve is made incident on a prism member and a light having passed through the prism member is projected by a projection lens, comprises a dust proofing cover that provides a seal between an emergence surface of the reflective light valve and an incidence surface of the prism member.

摘要翻译： 一种投影显示装置，其中从反射光阀发射的光入射到棱镜部件上，并且穿过棱镜部件的光被投影透镜突出，包括防尘罩，其在出射表面 的反射光阀和棱镜部件的入射面。

公开(公告)号：US20050009299A1

公开(公告)日：2005-01-13

申请号：US10812869

申请日：2004-03-31

申请人： Takashi Wada ,  Noriyuki Oroku ,  Hiroshi Maki

发明人： Takashi Wada ,  Noriyuki Oroku ,  Hiroshi Maki

IPC分类号： H01L21/52 ,  H01L21/00 ,  H01L21/301 ,  H01L21/304 ,  H01L21/78 ,  H01L21/46

CPC分类号： H01L21/48 ,  H01L21/304 ,  H01L21/67132 ,  H01L21/78 ,  H01L2224/32145 ,  H01L2224/45144 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/00

摘要： The present invention provides a manufacturing method of a semiconductor device which can speedily peel extremely thin chips which are laminated to an adhesive tape without generating cracks or chippings. A head of a vibrator is brought into contact with a back surface of an adhesive tape to which a plurality of semiconductor chips obtained by dividing a semiconductor wafer are laminated. By applying longitudinal vibrations having a frequency of 1 kHz to 100 kHz and an amplitude of 1 μm to 50 μm, the chip is peeled from the adhesive tape. In applying the longitudinal vibrations to the adhesive tape, a tension in a horizontal direction is applied to the adhesive tape.

摘要翻译： 本发明提供一种半导体器件的制造方法，该半导体器件可以快速剥离层叠在胶带上的极薄片，而不产生裂纹或碎屑。 将振动器的头与粘合带的背面接触，通过分割半导体晶片获得的多个半导体芯片被层压到该粘合带的背面上。 通过施加频率为1kHz至100kHz和振幅为1m至50um的纵向振动，将芯片从胶带剥离。 在向纵向振动施加纵向振动时，向胶带施加水平方向的张力。