公开(公告)号：US20210212586A1

公开(公告)日：2021-07-15

申请号：US16743460

申请日：2020-01-15

Applicant: Medtronic, Inc.

Inventor： Rajesh V. Iyer ,  Gordon O. Munns ,  Andrew J. Ries ,  Craig L. Schmidt ,  Paul B. Young

IPC: A61B5/042 ,  A61B5/00 ,  H02J50/10 ,  H01F38/14 ,  H02J7/02 ,  H02J50/40

Abstract: Systems, devices and methods allow inductive recharging of a power source located within or coupled to an implantable medical device (IMD) while the device is implanted in a patient. The IMD may include a rechargeable battery having a battery housing; a non-metallic substrate attached to the battery housing, wherein the non-metallic substrate and the battery housing form an outer housing of the implantable medical device; control circuitry formed on the non-metallic substrate within the outer housing of the IMD; a receive coil within the outer housing of the IMD, the receive coil configured to receive energy from outside of the outer housing of the IMD; and recharge circuitry within the outer housing of the IMD and coupled to the receive coil, the recharge circuitry configured to receive the energy from the receive coil, and recharge the rechargeable battery using the received energy.

公开(公告)号：US10737099B2

公开(公告)日：2020-08-11

申请号：US15982428

申请日：2018-05-17

Applicant: Medtronic, Inc.

Inventor： James R. Wasson ,  Mark E. Henschel ,  Andrew J. Ries ,  Rachel M. Day ,  Kris A. Peterson

IPC: A61N1/372 ,  A61B5/00 ,  A61N1/375

Abstract: Systems, devices and methods are disclosed that include an antenna for an implantable medical device, the antenna including a passageway extending through the antenna windings of the antenna, the passageway providing a pathway for an electrical connector providing at least one electrical connection between a power source and electronic circuitry included within the implantable medical device.

公开(公告)号：US10040021B2

公开(公告)日：2018-08-07

申请号：US14593588

申请日：2015-01-09

Applicant: MEDTRONIC, INC.

Inventor： Andrew J. Ries ,  SuPing Lyu ,  Catherine M. Asgian ,  David Engmark ,  Ananta Pandey ,  Todd Schaefer ,  Erik Scott ,  Joachim Hossick-Schott

IPC: A61N1/375 ,  B01D53/04 ,  H01M2/10 ,  H01M10/42

Abstract: Frame structures, assemblies and methods for use in implantable medical devices. The frames may include one or more first polymeric portions and one or more second polymeric portions coupled to the one or more first polymeric portions. The one or more first polymeric portions may have a higher durometer than the one or more second polymeric portions. The one or more second polymeric portions may provide an interference fit between the one or more second polymeric portions and the housing and/or between the one or more second polymeric portions and one or more components disposed in the housing.

公开(公告)号：US12233477B2

公开(公告)日：2025-02-25

申请号：US18404992

申请日：2024-01-05

Applicant: MEDTRONIC, INC.

Inventor： David A. Ruben ,  Andreas Fenner ,  Andrew J. Ries ,  Robert A Munoz ,  Christopher T. Kinsey ,  Mark E. Henschel

IPC: B23K26/20 ,  A61N1/375 ,  A61N1/39 ,  B23K26/32

Abstract: Various embodiments of a hermetic assembly and a method of forming such assembly are disclosed. The hermetic assembly includes a dielectric substrate having a first major surface and a second major surface, a patterned layer connected to the first major surface of the dielectric substrate by a laser bond, and a ferrule having a body and a flange extending from the body. The flange is welded to a welding portion of the patterned layer that is disposed between the flange and the first major surface of the dielectric substrate such that the ferrule is hermetically sealed to the dielectric substrate.

公开(公告)号：US20240131625A1

公开(公告)日：2024-04-25

申请号：US18404992

申请日：2024-01-05

Applicant: MEDTRONIC, INC.

Inventor： David A. Ruben ,  Andreas Fenner ,  Andrew J. Ries ,  Robert A. Munoz ,  Christopher T. Kinsey ,  Mark E. Henschel

IPC: B23K26/20 ,  A61N1/375 ,  A61N1/39 ,  B23K26/32

CPC classification number: B23K26/206 ,  A61N1/3754 ,  A61N1/3968 ,  B23K26/32

Abstract: Various embodiments of a hermetic assembly and a method of forming such assembly are disclosed. The hermetic assembly includes a dielectric substrate having a first major surface and a second major surface, a patterned layer connected to the first major surface of the dielectric substrate by a laser bond, and a ferrule having a body and a flange extending from the body. The flange is welded to a welding portion of the patterned layer that is disposed between the flange and the first major surface of the dielectric substrate such that the ferrule is hermetically sealed to the dielectric substrate.

公开(公告)号：US11883673B2

公开(公告)日：2024-01-30

申请号：US17071463

申请日：2020-10-15

Applicant: Medtronic, Inc.

Inventor： Andrew J. Ries ,  Chunho Kim ,  Mark E. Henschel ,  Robert A. Munoz ,  Christopher T. Kinsey ,  Jeffrey S. Voss

IPC: A61N1/375

CPC classification number: A61N1/3754 ,  A61N1/37512

Abstract: In some examples, an implantable medical device includes a battery, an electronics module electrically connected to the battery, and an elongated housing comprising a side wall positioned between the battery and an end cap, wherein the electronics module is positioned within the elongated housing between the battery and the end cap. The implantable medical device also includes an electrical contact assembly comprising a first spring contact and a second spring contact. The electrical contact assembly of the implantable medical device is positioned within the elongated housing between the electronics module and the battery or the end cap.

公开(公告)号：US20240009440A1

公开(公告)日：2024-01-11

申请号：US18251424

申请日：2021-09-28

Applicant: Medtronic, Inc.

Inventor： Kevin R. Seifert ,  Jonathan A. Hughes ,  Lisa A. Dalluge ,  Andrew J. Ries ,  Thomas J. Fick ,  Richard P. Nelson

IPC: A61M39/10

CPC classification number: A61M39/1011

Abstract: A locking mechanism for a connector to an implantable controller includes a housing of the implantable controller defining a housing bore sized to receive the connector. A set screw is releasably coupled to the housing and disposed at an oblique angle with respect to the housing, the set screw being configured to engage at least a portion of the connector when the set screw is fully inserted within the housing to lock the connector within the housing.

公开(公告)号：US11725995B2

公开(公告)日：2023-08-15

申请号：US17571825

申请日：2022-01-10

Applicant: Medtronic, Inc.

Inventor： Andreas Fenner ,  David A. Ruben ,  Andrew J. Ries ,  Chetan Patel

IPC: G01L9/00 ,  H01L23/00 ,  H05K5/06 ,  A61B5/0215 ,  B23K26/20 ,  H01L23/522

CPC classification number: G01L9/0073 ,  B23K26/20 ,  H01L23/5226 ,  H01L24/48 ,  H05K5/06 ,  A61B5/0215 ,  A61B2562/0247

Abstract: Various embodiments of a pressure sensor assembly and an implantable medical device that includes such assembly are disclosed. The assembly includes a substrate having a via that extends through the substrate along a via axis between a first major surface and a second major surface of the substrate, a membrane disposed on the first major surface of the substrate and over the via, and a patterned metal layer disposed on a first major surface of the membrane, a portion of such layer including a first capacitor plate. The assembly further includes an integrated circuit disposed adjacent to the first major surface of the membrane and electrically connected to the metal layer. The integrated circuit includes a second capacitor plate disposed on or within a substrate of the integrated circuit. The first capacitor plate and the second capacitor plate form a variable capacitor disposed along the via axis.

公开(公告)号：US11647600B2

公开(公告)日：2023-05-09

申请号：US17136242

申请日：2020-12-29

Applicant: Medtronic, Inc.

Inventor： Christian S. Nielsen ,  Rajesh V. Iyer ,  Gordon O. Munns ,  Andrew J. Ries ,  Andrew J. Thom

IPC: H05K5/06 ,  A61N1/375 ,  A61N1/378 ,  H05K5/00 ,  H05K7/14 ,  H01M50/543

CPC classification number: H05K5/069 ,  A61N1/378 ,  A61N1/3758 ,  H05K5/0086 ,  H05K7/1417 ,  H01M50/543 ,  H01M2220/30

Abstract: Various embodiments of a sealed package and a method of forming such package are disclosed. The package includes a housing having an inner surface and an outer surface, a dielectric substrate having a first major surface and a second major surface, and a dielectric bonding ring disposed between the first major surface of the dielectric substrate and the housing, where the dielectric bonding ring is hermetically sealed to both the first major surface of the dielectric substrate and the housing. The package further includes an electronic device disposed on the first major surface of the dielectric substrate, and a power source disposed at least partially within the housing and electrically connected to the electronic device.

公开(公告)号：US11607163B2

公开(公告)日：2023-03-21

申请号：US16743460

申请日：2020-01-15

Applicant: Medtronic, Inc.

Inventor： Rajesh V. Iyer ,  Gordon O. Munns ,  Andrew J. Ries ,  Craig L. Schmidt ,  Paul B. Young

IPC: A61B5/283 ,  H02J50/10 ,  H02J50/40 ,  A61B5/00 ,  H01F38/14 ,  H02J7/02

Abstract: Systems, devices and methods allow inductive recharging of a power source located within or coupled to an implantable medical device (IMD) while the device is implanted in a patient. The IMD may include a rechargeable battery having a battery housing; a non-metallic substrate attached to the battery housing, wherein the non-metallic substrate and the battery housing form an outer housing of the implantable medical device; control circuitry formed on the non-metallic substrate within the outer housing of the IMD; a receive coil within the outer housing of the IMD, the receive coil configured to receive energy from outside of the outer housing of the IMD; and recharge circuitry within the outer housing of the IMD and coupled to the receive coil, the recharge circuitry configured to receive the energy from the receive coil, and recharge the rechargeable battery using the received energy.