公开(公告)号：US20170296830A1

公开(公告)日：2017-10-19

申请号：US15464328

申请日：2017-03-20

Applicant: MEDTRONIC, INC.

Inventor： Steven T. Deininger ,  Michael J. Baade ,  Rajesh V. Iyer

IPC: A61N1/375 ,  H01R24/58 ,  H01R13/516 ,  H01R4/02 ,  H05K7/02 ,  H01G4/35 ,  H01R107/00

CPC classification number: A61N1/3754 ,  A61N1/375 ,  H01G4/35 ,  H01R4/029 ,  H01R13/516 ,  H01R13/5224 ,  H01R24/58 ,  H01R43/26 ,  H01R2107/00 ,  H01R2201/12 ,  H05K7/02 ,  H05K7/1427 ,  Y10T29/4913 ,  Y10T29/49208

Abstract: Implantable medical devices include connector enclosure assemblies that utilize conductors that are electrically coupled to feedthrough pins and that extend into a can where electrical circuitry is housed. The conductors may be coupled to the feedthrough pins and to capacitor plates within a filter capacitor by an electrically conductive bonding material and as a single bonding event during manufacturing. The base plate of the connector enclosure assembly may also include a ground pin. Ground capacitor plates may be present at a ground aperture of the filter capacitor where the ground pin passes through so that the ground pin, a ground conductor, and the ground capacitor plate may be coupled. A protective cover may be provided for the connector enclosure assembly to enclose the conductors intended to extend into the can prior to the assembly being joined to the can. Conductors may be attached to a common tab that is subsequently removed.

公开(公告)号：US20150202706A1

公开(公告)日：2015-07-23

申请号：US14260401

申请日：2014-04-24

Applicant: Medtronic, Inc.

Inventor： William M. Brosnan ,  Rajesh V. Iyer ,  George C. Johnstone ,  Susan A. Tettemer ,  Andrew J. Thom

IPC: B23K1/00 ,  H01R4/02 ,  B23K37/04

CPC classification number: B23K1/0016 ,  B23K1/008 ,  B23K3/0623 ,  B23K37/0426 ,  B23K37/0435 ,  B23K2101/38 ,  H01G4/35 ,  H01R4/027 ,  H01R43/0249 ,  H01R43/20

Abstract: A lead pin fixture is used to align and hold lead pins in place for brazing lead pins to metal contact pads of a ceramic insulator and brazing a ferrule to the ceramic insulator in a single step.

Abstract translation: 引脚固定装置用于将引脚对准并保持在适当位置，以将引脚焊接到陶瓷绝缘体的金属接触焊盘，并在一个步骤中将套圈钎焊到陶瓷绝缘体上。

公开(公告)号：US20150045861A1

公开(公告)日：2015-02-12

申请号：US13963069

申请日：2013-08-09

Applicant: Medtronic, Inc.

Inventor： Simon E. Goldman ,  Rajesh V. Iyer ,  Curtis E. Burgardt ,  James A. Martin ,  Laxmi Kanth Peddi ,  William R. Schildgen

IPC: A61N1/375

CPC classification number: A61N1/3754 ,  G01R31/1227 ,  Y10T29/49004

Abstract: Processes for manufacture and assembly of implantable medical devices are described. In particular, techniques are provided for nondestructive electrical isolation assessment of feedthrough assemblies of the implantable medical devices. The feedthrough assemblies may include an insulating structure, a plurality of terminal pins extending through the insulator and a ferrule having an inner lumen into which the insulating structure is disposed. One or more insulating seals may be disposed at the interface of the ferrule-to-insulating structure and/or the terminal pin-to-insulating structure. The electrical isolation assessments may be based on the dielectric properties of the components of the feedthrough assemblies, such as the insulating structure.

Abstract translation: 描述了用于可植入医疗装置的制造和组装的方法。 特别地，提供了用于可植入医疗装置的馈通组件的非破坏性电隔离评估的技术。 馈通组件可以包括绝缘结构，延伸穿过绝缘体的多个端子销和具有内腔的套圈，绝缘结构设置在该内腔中。 一个或多个绝缘密封件可以设置在套圈绝缘结构和/或端子销至绝缘结构的界面处。 电隔离评估可以基于馈通组件的部件的介电性质，例如绝缘结构。

公开(公告)号：US20250135211A1

公开(公告)日：2025-05-01

申请号：US18925265

申请日：2024-10-24

Applicant: Medtronic, Inc.

Inventor： Sadegh Behdad ,  Joachim Hossick-Schott ,  Rajesh V. Iyer ,  Andrew J. Thom

IPC: A61N1/375

Abstract: Feedthroughs, feedthrough assemblies, and methods of making the same for use in implantable medical devices are provided herein. Feedthroughs provided herein include a feedthrough ferrule, a feedthrough pin, and an electrically insulative metal oxide surface coating disposed on the feedthrough ferrule, disposed on the feedthrough pin, or disposed on both the feedthrough pin and the feedthrough ferrule.

公开(公告)号：US20240128568A1

公开(公告)日：2024-04-18

申请号：US18470721

申请日：2023-09-20

Applicant: Medtronic, Inc.

Inventor： Rajesh V. Iyer ,  Andrew J. Thom ,  Paul B. Young ,  Gaurav Jain ,  Venkat R. Gaddam ,  Ashutosh Mehra ,  Craig L. Schmidt

IPC: H01M50/227 ,  A61N1/378 ,  C08G61/10 ,  H01M50/117 ,  H01M50/233 ,  H01M50/247 ,  H01M50/296

CPC classification number: H01M50/227 ,  A61N1/3787 ,  C08G61/10 ,  H01M50/117 ,  H01M50/233 ,  H01M50/247 ,  H01M50/296 ,  H01M2220/30

Abstract: An example medical device includes a device housing configured to be implantable within a patient, the device housing including an internal surface in contact with a voltaic cell of the battery, and a battery external to the device housing and comprising a battery housing configured to be hermetically sealed. The battery is configured to provide electrical power to an electrical component housed within the device housing, and the battery housing is configured to be attached to the device housing. The battery housing includes an internal surface in contact with a voltaic cell of the battery, and an external surface in contact with the biocompatible electrical insulator. an external surface in contact with the biocompatible electrical insulator.

公开(公告)号：US11896830B2

公开(公告)日：2024-02-13

申请号：US17164998

申请日：2021-02-02

Applicant: Medtronic, Inc.

Inventor： Andrew J. Thom ,  Rajesh V. Iyer ,  Gordon O. Munns ,  Christian S. Nielsen ,  Andrew J. Ries

IPC: A61N1/375 ,  A61N1/372 ,  H02J50/10 ,  H02J7/00 ,  H02J50/00

CPC classification number: A61N1/37223 ,  A61N1/3754 ,  A61N1/3758 ,  A61N1/37518 ,  H02J7/00034 ,  H02J50/10 ,  H02J50/005

Abstract: Various embodiments of a hermetically-sealed package and a method of forming such package are disclosed. The package includes a housing that extends along a housing axis between a first end and a second end, where the housing includes first and second opaque portions and a transparent portion disposed between the first and second opaque portions. The first opaque portion is hermetically sealed to a first end of the transparent portion and the second opaque portion is hermetically sealed to a second end of the transparent portion. At least one of the first and second opaque portions is hermetically sealed to the transparent portion by a weld ring. The package further includes a power source disposed within the housing, and an inductive coil disposed at least partially within the transparent portion of the housing and electrically connected to the power source.

公开(公告)号：US11762031B2

公开(公告)日：2023-09-19

申请号：US17410269

申请日：2021-08-24

Applicant: Medtronic, Inc.

Inventor： Rajesh V. Iyer ,  Gordon O. Munns ,  John M. Pantazis ,  Anthony David Calderoni ,  Laura E. McCalla ,  Eric Wigforss

IPC: G01R31/392 ,  G01R31/367 ,  H02J7/00

CPC classification number: G01R31/392 ,  G01R31/367 ,  H02J7/0029

Abstract: An electrochemical cell charging apparatus includes a charger to charge one or more electrochemical cells and a computing apparatus. The computing apparatus includes one or more processors and is operatively coupled to the charger. The computing apparatus is configured to charge an electrochemical cell using the charger, determine one or more indicators of the state of health of the electrochemical cell, and determine the state of health of the electrochemical cell based on the determined one or more indicators.

公开(公告)号：US20210154484A1

公开(公告)日：2021-05-27

申请号：US17164998

申请日：2021-02-02

Applicant: Medtronic, Inc.

Inventor： Andrew J. Thom ,  Rajesh V. Iyer ,  Gordon O. Munns ,  Christian S. Nielsen ,  Andrew J. Ries

IPC: A61N1/375

Abstract: Various embodiments of a hermetically-sealed package and a method of forming such package are disclosed. The package includes a housing that extends along a housing axis between a first end and a second end, where the housing includes first and second opaque portions and a transparent portion disposed between the first and second opaque portions. The first opaque portion is hermetically sealed to a first end of the transparent portion and the second opaque portion is hermetically sealed to a second end of the transparent portion. At least one of the first and second opaque portions is hermetically sealed to the transparent portion by a weld ring. The package further includes a power source disposed within the housing, and an inductive coil disposed at least partially within the transparent portion of the housing and electrically connected to the power source.

公开(公告)号：US10918874B2

公开(公告)日：2021-02-16

申请号：US16021177

申请日：2018-06-28

Applicant: Medtronic, Inc.

Inventor： Andrew J. Thom ,  Rajesh V. Iyer ,  Gordon O. Munns ,  Christian S. Nielsen ,  Andrew J. Ries

IPC: A61N1/375

Abstract: Various embodiments of a hermetically-sealed package and a method of forming such package are disclosed. The package includes a housing that extends along a housing axis between a first end and a second end, where the housing includes first and second opaque portions and a transparent portion disposed between the first and second opaque portions. The first opaque portion is hermetically sealed to a first end of the transparent portion and the second opaque portion is hermetically sealed to a second end of the transparent portion. At least one of the first and second opaque portions is hermetically sealed to the transparent portion by a weld ring. The package further includes a power source disposed within the housing, and an inductive coil disposed at least partially within the transparent portion of the housing and electrically connected to the power source.

公开(公告)号：US10821292B2

公开(公告)日：2020-11-03

申请号：US16021059

申请日：2018-06-28

Applicant: Medtronic, Inc.

Inventor： Rajesh V. Iyer ,  Gordon O. Munns ,  Christian S. Nielsen ,  Craig L. Schmidt ,  Paul B. Young

IPC: A61N1/378 ,  A61N1/375 ,  A61N1/372 ,  H01F5/04 ,  H01F38/14 ,  H01F41/10 ,  H02J7/00 ,  H01F5/02

Abstract: Systems, devices and methods allow inductive recharging of a power source located within or coupled to an implantable medical device while the device is implanted in a patient. The implantable devices in some examples include a multi-axis antenna having a plurality of coil windings arranged orthogonal to one another. The multi-axis antenna configured to generate at least a minimum level of induced current for recharging a power source of the implanted medical device regardless of the orientation of a direction of a magnetic field imposed on the multi-axis antenna relative to an orientation of the implanted medical device and the multi-axis antenna for a given energy level of the imposed magnetic field.