公开(公告)号：US07563104B2

公开(公告)日：2009-07-21

申请号：US11896298

申请日：2007-08-30

申请人： Han Kim ,  Yang Je Lee ,  Sang Jin Oh ,  Mi Ja Han

发明人： Han Kim ,  Yang Je Lee ,  Sang Jin Oh ,  Mi Ja Han

IPC分类号： H01R12/00

CPC分类号： H01R13/2407 ,  H01R12/58 ,  H05K3/365 ,  H05K2201/10295

摘要： The Printed Circuit Board (PCB) has connectors which each include a terminal part and a connector pin. The terminal part is formed in one end of the PCB and is provided with a terminal hole. The connector pin is configured such that one end thereof is inserted into the terminal hole, and the remaining end thereof extends to protrude outside the terminal hole and is also bent several times, thus forming a contact part that is elastically deformed, and electrically connected to a pad part provided in a target PCB for connection. Thus, a desirable signal transmission characteristic is guaranteed, so that the reliability of electronic devices using the PCB can be improved and the manufacturing cost can also be reduced.

摘要翻译： 印刷电路板（PCB）具有连接器，每个连接器包括端子部分和连接器引脚。 端子部分形成在PCB的一端并设有端子孔。 连接器销被构造成使得其一端插入端子孔中，并且其剩余端延伸到端子孔外部并且也弯曲多次，从而形成弹性变形的接触部，并且电连接到 设置在目标PCB中用于连接的焊盘部分。 因此，保证期望的信号传输特性，从而可以提高使用PCB的电子设备的可靠性，并且还可以降低制造成本。

公开(公告)号：US20090071603A1

公开(公告)日：2009-03-19

申请号：US12007474

申请日：2008-01-10

申请人： Ja-Bu Koo ,  Mi-Ja Han ,  Han Kim

发明人： Ja-Bu Koo ,  Mi-Ja Han ,  Han Kim

IPC分类号： B32B38/14

CPC分类号： B32B37/02 ,  B32B38/14 ,  B32B2038/0092 ,  B32B2038/047 ,  B32B2305/022 ,  B32B2309/105 ,  B32B2311/12 ,  B32B2457/08 ,  H05K1/0236 ,  H05K1/162 ,  H05K3/007 ,  H05K3/429 ,  H05K3/4611 ,  H05K2201/09309 ,  H05K2201/09663 ,  H05K2201/09672 ,  H05K2203/0156

摘要： A method of manufacturing a 4-layered printed circuit board by one-time stacking process is disclosed. In particular, the printed circuit board manufacturing method includes adhering copper clad laminates (CCL) to both surfaces of a foam tape; forming an inner layer circuit pattern on one of both copper thin layers of the CCL, the one copper thin layer being not adhered to the foam tape; separating the CCL from the foam tape; arranging the copper thin layer in which the inner layer circuit pattern is formed to face a prepreg; compressing the CCL into the prepreg; and forming an outer layer circuit pattern on one of both copper thin layers of the CCL, the one copper thin layer being in no contact with the prepreg.

摘要翻译： 公开了通过一次堆叠处理制造4层印刷电路板的方法。 特别地，印刷电路板的制造方法包括将覆铜层压板（CCL）粘附到泡沫胶带的两个表面上; 在CCL的两个铜薄层之一上形成内层电路图案，一个铜薄层不粘附到泡沫胶带上; 将CCL与泡沫胶带分离; 将其中形成内层电路图案的铜薄层布置成面对预浸料; 将CCL压缩成预浸料; 并且在CCL的两个铜薄层之一上形成外层电路图案，一个铜薄层不与预浸料坯接触。

公开(公告)号：US08598468B2

公开(公告)日：2013-12-03

申请号：US13437254

申请日：2012-04-02

申请人： Han Kim ,  Mi-Ja Han ,  Hyo-Jic Jung

发明人： Han Kim ,  Mi-Ja Han ,  Hyo-Jic Jung

IPC分类号： H01R12/04 ,  H05K1/11

CPC分类号： H01P1/2005 ,  H01L2224/16 ,  H01P1/203 ,  H05K1/0236 ,  H05K1/0237 ,  H05K2201/09309 ,  H05K2201/09518 ,  H05K2201/096 ,  H05K2201/09627 ,  H05K2201/09663 ,  H05K2201/09681

摘要： An electromagnetic bandgap structure including: at least three conductive plates; a first stitching via, configured to electrically connect any one of the conductive plates to another conductive plate; and a second stitching via, configured to electrically connect the one conductive plate to yet another conductive plate, wherein the first stitching via electrically connects the one conductive plate to another conductive plate by allowing a part of the first stitching via to be connected through a planar surface above or below the one conductive plate, and the second stitching via electrically connects the one conductive plate to yet another conductive plate by allowing a part of the second stitching via to be connected through a planar surface that is different from the planar surface through which the part of the first stitching via is connected, the two planar surfaces being placed in a same direction based on the conductive plates.

摘要翻译： 一种电磁带隙结构，包括：至少三个导电板; 第一缝合通孔，被配置为将任一导电板电连接到另一个导电板; 以及第二缝合通孔，其被配置为将所述一个导电板电连接到另一个导电板，其中所述第一缝合通孔将所述第一缝合通孔的一部分通过平面 表面在一个导电板的上方或下方，并且第二缝合通孔通过允许第二缝合通孔的一部分通过不同于平面的平面表面连接一个导电板到另一个导电板，通过该平面 第一缝合通孔的部分被连接，两个平面被放置在相同的方向上，基于导电板。

公开(公告)号：US08077000B2

公开(公告)日：2011-12-13

申请号：US12232463

申请日：2008-09-17

申请人： Ja-Bu Koo ,  Mi-Ja Han ,  Han Kim

发明人： Ja-Bu Koo ,  Mi-Ja Han ,  Han Kim

IPC分类号： H01P1/201

CPC分类号： H01P3/088 ,  H01L2224/16225 ,  H01P1/2005 ,  H05K1/0236 ,  H05K1/0237 ,  H05K3/429 ,  H05K2201/09309 ,  H05K2201/09663 ,  H05K2201/09681

摘要： Disclosed are an electromagnetic bandgap structure and a printed circuit board. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure can include a dielectric layer; a plurality of conductive plates; a stitching via, configured to pass through the dielectric layer and have a part electrically connecting the conductive plates to each other by connecting through a planar surface that is different from a planar surface of the conductive plates, and a through via. Here, the dielectric layer, the conductive plates and the stitching via can be placed between any two conductive layers, and the through via can be configured to pass through a clearance hole formed in the conductive layer and electrically connect the two conductive layers to each other.

摘要翻译： 公开了电磁带隙结构和印刷电路板。 根据本发明的实施例，电磁带隙结构可以包括电介质层; 多个导电板; 缝合通孔，其构造成穿过介电层并且具有通过连接通过不同于导电板的平坦表面的平坦表面和通孔而将导电板彼此电连接的部分。 这里，电介质层，导电板和缝合通孔可以放置在任何两个导电层之间，并且通孔可以被配置为穿过形成在导电层中的间隙孔并将两个导电层彼此电连接 。

公开(公告)号：US20090184782A1

公开(公告)日：2009-07-23

申请号：US12232463

申请日：2008-09-17

申请人： Ja-Bu Koo ,  Mi-Ja Han ,  Han Kim

发明人： Ja-Bu Koo ,  Mi-Ja Han ,  Han Kim

IPC分类号： H01P1/203

CPC分类号： H01P3/088 ,  H01L2224/16225 ,  H01P1/2005 ,  H05K1/0236 ,  H05K1/0237 ,  H05K3/429 ,  H05K2201/09309 ,  H05K2201/09663 ,  H05K2201/09681

摘要： Disclosed are an electromagnetic bandgap structure and a printed circuit board. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure can include a dielectric layer; a plurality of conductive plates; a stitching via, configured to pass through the dielectric layer and have a part electrically connecting the conductive plates to each other by connecting through a planar surface that is different from a planar surface of the conductive plates, and a through via. Here, the dielectric layer, the conductive plates and the stitching via can be placed between any two conductive layers, and the through via can be configured to pass through a clearance hole formed in the conductive layer and electrically connect the two conductive layers to each other.

摘要翻译： 公开了电磁带隙结构和印刷电路板。 根据本发明的实施例，电磁带隙结构可以包括电介质层; 多个导电板; 缝合通孔，其构造成穿过介电层并且具有通过连接通过不同于导电板的平坦表面的平坦表面和通孔而将导电板彼此电连接的部分。 这里，电介质层，导电板和缝合通孔可以放置在任何两个导电层之间，并且通孔可以被配置为穿过形成在导电层中的间隙孔并将两个导电层彼此电连接 。

公开(公告)号：US20080057756A1

公开(公告)日：2008-03-06

申请号：US11896298

申请日：2007-08-30

申请人： Han Kim ,  Yang Je Lee ,  Sang Jin Oh ,  Mi Ja Han

发明人： Han Kim ,  Yang Je Lee ,  Sang Jin Oh ,  Mi Ja Han

IPC分类号： H01R12/00

CPC分类号： H01R13/2407 ,  H01R12/58 ,  H05K3/365 ,  H05K2201/10295

摘要： Disclosed herein is a Printed Circuit Board (PCB) having connectors. The PCB includes a terminal part and a connector pin. The terminal part is formed in one end of the PCB and is provided with a terminal hole. The connector pin is configured such that one end thereof is inserted into the terminal hole, and the remaining end thereof extends to protrude outside the terminal hole and is also bent several times, thus forming a contact part that is elastically deformed, and electrically connected to a pad part provided in a target PCB for connection. Thus, a desirable signal transmission characteristic is guaranteed, so that the reliability of electronic devices using the PCB can be improved and the manufacturing cost can also be reduced.

摘要翻译： 本文公开了具有连接器的印刷电路板（PCB）。 PCB包括端子部分和连接器引脚。 端子部分形成在PCB的一端并设有端子孔。 连接器销被构造成使得其一端插入端子孔中，并且其剩余端延伸到端子孔外部并且也弯曲多次，从而形成弹性变形的接触部，并且电连接到 设置在目标PCB中用于连接的焊盘部分。 因此，保证期望的信号传输特性，从而可以提高使用PCB的电子设备的可靠性，并且还可以降低制造成本。

公开(公告)号：US08314341B2

公开(公告)日：2012-11-20

申请号：US12654370

申请日：2009-12-17

申请人： Han Kim ,  Mi-Ja Han ,  Kang-Wook Bong ,  Hyo-Jic Jung

发明人： Han Kim ,  Mi-Ja Han ,  Kang-Wook Bong ,  Hyo-Jic Jung

IPC分类号： H05K9/00

CPC分类号： H05K1/0236 ,  H05K2201/09309 ,  H05K2201/09627

摘要： Disclosed is a printed circuit board into which an electromagnetic bandgap structure for blocking a noise is inserted. The electromagnetic bandgap structure can include a first conductive plate, a second conductive plate arranged on a planar surface that is different from that of the first conductive plate, a third conductive plate arranged on a planar surface that is different from that of the second conductive plate, a connection pattern arranged on a planar surface that is different from that of the second conductive plate, a first stitching via unit configured to connect the first conductive plate to one end of the connection pattern through the planar surface where the second conductive plate is arranged, and a second stitching via unit configured to connect the third conductive plate to the other end of the connection pattern through the planar surface where the second conductive plate is arranged.

摘要翻译： 公开了一种印刷电路板，其中插入用于阻挡噪声的电磁带隙结构。 电磁带隙结构可以包括第一导电板，布置在与第一导电板的平面不同的平面上的第二导电板，布置在与第二导电板不同的平面上的第三导电板 布置在与第二导电板的平面不同的平面上的连接图案，第一缝合通孔单元，被配置为通过布置第二导电板的平坦表面将第一导电板连接到连接图案的一端 以及第二缝合通孔单元，其被配置为通过布置有第二导电板的平坦表面将第三导电板连接到连接图案的另一端。

公开(公告)号：US07944320B2

公开(公告)日：2011-05-17

申请号：US12076650

申请日：2008-03-20

申请人： Mi-Ja Han ,  Han Kim ,  Ja-Bo Koo

发明人： Mi-Ja Han ,  Han Kim ,  Ja-Bo Koo

IPC分类号： H01P1/20 ,  H01P5/08

CPC分类号： H05K1/0236 ,  H05K2201/09309 ,  H05K2201/09627 ,  H05K2201/09663

摘要： An electromagnetic bandgap structure and a printed circuit board that intercepts to transfer a signal having a predetermined frequency band are disclosed. In particularly, the electromagnetic bandgap structure includes a first metal layer and a second metal layer; a metal plate, placed between the first metal layer and a second metal layer; a multi-via, penetrating the first metal layer, passing through the same planar surface as an outer metal layer and turning toward the first metal layer to connect the metal plate and the first metal layer; and a dielectric layer, stacked in between the first metal layer and the metal plate, between the metal plate and the second metal layer and between the first metal layer and the outer metal layer. With the present invention, a bandgap frequency can be decreased without increasing the size of the metal plate.

摘要翻译： 公开了一种电磁带隙结构和用于传送具有预定频带的信号的印刷电路板。 特别地，电磁带隙结构包括第一金属层和第二金属层; 金属板，放置在第一金属层和第二金属层之间; 穿过第一金属层的多通孔，穿过与外部金属层相同的平面，并朝着第一金属层转动以连接金属板和第一金属层; 以及电介质层，层叠在所述第一金属层和所述金属板之间，所述金属板与所述第二金属层之间以及所述第一金属层与所述外部金属层之间。 通过本发明，可以在不增加金属板的尺寸的情况下降低带隙频率。

公开(公告)号：US20110069470A1

公开(公告)日：2011-03-24

申请号：US12654371

申请日：2009-12-17

申请人： Kang-Wook Bong ,  Han Kim ,  Mi-Ja Han

发明人： Kang-Wook Bong ,  Han Kim ,  Mi-Ja Han

IPC分类号： H05K9/00

CPC分类号： H05K1/0236 ,  H05K2201/09309 ,  H05K2201/09627

摘要： An EMI noise reduction board is disclosed. The electromagnetic interference (EMI) noise reduction board having an electromagnetic bandgap structure for shielding a noise includes a first area having a ground layer and a power layer, a second area placed in a side portion of the first area having an electromagnetic bandgap structure therein. The electromagnetic bandgap structure includes a plurality of first conductive plates placed along the side portion of the first area, a plurality of second conductive plates placed on a planar surface that is different from the first conductive plates so as to overlap with the first conductive plates, and a via configured to connect the first conductive plate and the second conductive plate.

摘要翻译： 公开了一种EMI降噪板。 具有用于屏蔽噪声的电磁带隙结构的电磁干扰（EMI）降噪板包括具有接地层和功率层的第一区域，放置在其中具有电磁带隙结构的第一区域的侧部中的第二区域。 电磁带隙结构包括沿着第一区域的侧面部分放置的多个第一导电板，多个第二导电板，放置在与第一导电板不同的平面上，以与第一导电板重叠， 以及经配置以连接第一导电板和第二导电板的通孔。

公开(公告)号：US20100134200A1

公开(公告)日：2010-06-03

申请号：US12478965

申请日：2009-06-05

申请人： Ja-Bu KOO ,  Mi-Ja Han ,  Han Kim

发明人： Ja-Bu KOO ,  Mi-Ja Han ,  Han Kim

IPC分类号： H04B3/28 ,  H05K1/11

CPC分类号： H05K1/0236 ,  H05K2201/09309 ,  H05K2201/09627 ,  H05K2201/09681

摘要： An electromagnetic bandgap structure is disclosed. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure can include a dielectric layer, a plurality of conductive plates, placed on a planar surface which is different from that of the dielectric layer, vias, of which each is connected to each of the conductive plates, respectively, and penetrates through the dielectric layer from one end part that is connected to the conductive plates, and a conductive trace, which connects the other end parts of the vias with each other such that all of the conductive plates are electrically connected.

摘要翻译： 公开了电磁带隙结构。 根据本发明的实施例，电磁带隙结构可以包括介电层，多个导电板，放置在与电介质层不同的平面表面上，每个导电板各自与每个导电板连接 的导电板，并且从连接到导电板的一个端部穿过电介质层，以及导电迹线，其将通孔的另一个端部彼此连接，使得所有的导电板是 电连接。