公开(公告)号：US20230309273A1

公开(公告)日：2023-09-28

申请号：US18020125

申请日：2020-08-13

Applicant: NEC Corporation

Inventor： Nirmal Singh RAJPUT ,  Masaki Chiba ,  Yoshinori Miyamoto ,  Junichi Miyamoto ,  Minoru Yoshikawa

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K7/20836 ,  G06F1/206 ,  H05K7/20136 ,  H05K7/20745

Abstract: The present disclosure can provide a system, method and non-transitory computer readable storage medium capable of generating a uniform airflow at a heat exchanger surface. A system includes: a cooling unit body (11, 21) having an airflow inlet (18, 28) and an airflow outlet (15, 25); a heat exchanger (12, 22) provided inside the cooling unit body; and a plurality of fans (16, 17, 26, 27) provided at the airflow inlet. The system may include air velocity sensors (265, 275) provided at the heat exchanger (22).

公开(公告)号：US20230213253A1

公开(公告)日：2023-07-06

申请号：US17788888

申请日：2021-09-13

Applicant: NEC Corporation

Inventor： Takashi OHTSUKA ,  Koichi Todoroki ,  Yoshinori Miyamoto ,  Masaki Chiba ,  Mahiro Hachiya ,  Minoru Yoshikawa

IPC: F25B49/02 ,  F25B43/00

CPC classification number: F25B49/02 ,  F25B43/006 ,  F25B2600/13 ,  F25B2700/2109 ,  F25B2700/19 ,  F25B2600/2501 ,  F25B2400/23

Abstract: A cooling device using a refrigeration cycle in which a refrigerant is circulated through a heat receiver, a compressor, a heat radiator, and an expansion valve includes: a gas-liquid separator configured to perform gas-liquid separation on the refrigerant supplied from the expansion valve; a pump configured to send a liquid phase refrigerant separated by the gas-liquid separator to the heat receiver; and a control unit configured to control opening and closing of a refrigerant flow path of the refrigeration cycle, and an operation and stop of the compressor and the pump, wherein the control unit starts the operation of the pump on condition that a net positive suction head of the pump has reached a predetermined value or more.

公开(公告)号：US10409345B2

公开(公告)日：2019-09-10

申请号：US15559885

申请日：2016-03-17

Applicant: NEC CORPORATION

Inventor： Masanori Sato ,  Minoru Yoshikawa ,  Akira Shoujiguchi ,  Arihiro Matsunaga

IPC: G06F1/20 ,  F28D15/02 ,  F28D15/06 ,  G05B15/02 ,  G05D7/06 ,  H05K7/20 ,  F28D21/00

Abstract: With a phase change cooling device, it is difficult to obtain reliable high-efficiency cooling performance due to a change in heat exchange performance. Thus, a phase change cooling device according to the present invention includes: a heat receiving apparatus that houses a coolant; a sensor that acquires heat receiving apparatus coolant information that is information relating to a liquid-gas two-phase flow interface of the coolant housed in the heat receiving apparatus; a radiator that radiates heat of coolant vapor of the coolant heat-received and evaporated in the heat receiving apparatus, and recirculates liquefied coolant liquid to the heat receiving apparatus; a valve that controls a flow rate of the coolant liquid; and a control unit that controls a degree of opening of the valve, wherein the control unit controls, based on the heat receiving apparatus coolant information, a degree of opening of the valve in such a way that a liquid-gas two-phase flow interface of the coolant is located at an end part of the heat receiving apparatus in a vertical direction.

公开(公告)号：US10182517B2

公开(公告)日：2019-01-15

申请号：US15037859

申请日：2014-11-14

Applicant: NEC Corporation

Inventor： Minoru Yoshikawa ,  Kenichi Inaba ,  Masanori Sato ,  Akira Shoujiguchi ,  Arihiro Matsunaga ,  Masaki Chiba

IPC: F28F7/00 ,  F28D15/00 ,  H05K7/20 ,  G06F1/20 ,  F28D15/02

Abstract: A vapor pipe 103 connects a heat dissipation portion 200 and each of a plurality of heat receiving portions 102. A liquid pipe 104 connects the heat dissipation portion 200 and each of a plurality of the heat receiving portions 102. A bypass pipe 105 connects the vapor pipe 103 and the liquid pipe 104. A valve 106 opens and closes a flow path of the bypass pipe 105. A first connection portion 107 connects the vapor pipe 103 and the bypass pipe 105. A second connection portion 108 connects the liquid pipe 103 and the bypass pipe 105. The first connection portion 107 is disposed at a position higher than that of the second connection portion 108. As a result, refrigerant can be efficiently transported in a short time.

公开(公告)号：US09968003B2

公开(公告)日：2018-05-08

申请号：US15110888

申请日：2015-01-15

Applicant: NEC Corporation

Inventor： Hitoshi Sakamoto ,  Minoru Yoshikawa ,  Mahiro Hachiya

IPC: H05K7/20 ,  H01L23/427 ,  H01L23/467 ,  F28D15/02

CPC classification number: H05K7/20336 ,  F28D15/0266 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H05K7/20136 ,  H05K7/20327 ,  H05K7/20409 ,  H05K7/20436 ,  H05K7/20809 ,  H01L2924/00

Abstract: A cooling device 100 includes a first heat receiving unit 400, a second heat receiving unit 410, a first heat dissipating unit 700, and a second heat dissipating unit 710. The first heat dissipating unit 700 and the second heat dissipating unit 710 have a flat plate shape and have a structure in which air passes in a direction approximately perpendicular to a principal surface having a flat plate shape and a first principal surface 730 that is a principal surface having a flat plate shape in the first heat dissipating unit 700 and a second principal surface 740 that is a principal surface having a flat plate shape in the second heat dissipating unit 710 are arranged so as to face to each other. As a result, the size of the cooling device 100 can be reduced without degrading a heat dissipation performance to dissipate heat generated by a heat generating element.

公开(公告)号：US09696068B2

公开(公告)日：2017-07-04

申请号：US14427487

申请日：2013-07-19

Applicant: NEC Corporation

Inventor： Arihiro Matsunaga ,  Minoru Yoshikawa ,  Hitoshi Sakamoto ,  Akira Shoujiguchi ,  Masaki Chiba ,  Kenichi Inaba

IPC: F25B39/02 ,  H01L23/427 ,  B23P15/26

CPC classification number: F25B39/028 ,  B23P15/26 ,  H01L23/427 ,  H01L2924/0002 ,  Y10T29/49359 ,  H01L2924/00

Abstract: In order to maintain a high cooling capability even in a case where a heating element has a lower calorific value, a boiling section of a heat receiving section in a phase change cooling apparatus includes a comb-shaped structure and a porous layer provided on a bottom portion of the comb-shaped structure between fins of the comb-shaped structure. With such a boiling section, a liquid film of a liquid phase refrigerant is forcedly made thinner. Thus, the liquid phase refrigerant is changed in phase into a gaseous phase refrigerant even in a case of a small difference between the temperature of the gaseous phase refrigerant and the temperature of the heat receiving surface.

公开(公告)号：US09433129B2

公开(公告)日：2016-08-30

申请号：US14401282

申请日：2013-05-10

Applicant: NEC Corporation

Inventor： Arihiro Matsunaga ,  Minoru Yoshikawa ,  Hitoshi Sakamoto ,  Akira Shoujiguchi ,  Masaki Chiba ,  Kenichi Inaba

IPC: H05K7/20 ,  B23P15/26 ,  H01L23/427 ,  F28D15/02 ,  G06F1/20 ,  H01L23/40

Abstract: It is impossible in a cooling device using a phase-change system, seeking high heat transport performance, to obtain sufficient cooling performance due to the increase in thermal resistance with a heating element to be cooled, therefore, a connecting structure of a cooling device according to an exemplary aspect of the present invention includes a connecting board with an opening; a pressing plate of thin plate elastically deformable; first fixing means for fixing the pressing plate to the connecting board with the pressing plate disposed covering heat receiving means composing the cooling device; and second fixing means for fixing the connecting board to a substrate with the heat receiving means abutting against a heating element mounted on the substrate and disposed in the opening.

公开(公告)号：US20150062821A1

公开(公告)日：2015-03-05

申请号：US14385754

申请日：2013-03-14

Applicant: NEC CORPORATION

Inventor： Minoru Yoshikawa ,  Hitoshi Sakamoto ,  Akira Shoujiguchi ,  Masaki Chiba ,  Kenichi Inaba ,  Arihiro Matsunaga

IPC: H05K1/02 ,  H05K7/20

CPC classification number: H05K1/0203 ,  F28D15/0266 ,  F28F7/02 ,  G06F1/20 ,  G06F2200/201 ,  H01L23/427 ,  H01L2924/0002 ,  H05K7/20309 ,  H05K7/20318 ,  H05K7/20327 ,  H05K7/20809 ,  H01L2924/00

Abstract: The size of an electronic device using a cooling structure for an electronic circuit board is increased when using a heating element with a large amount of heat generation, therefore, a cooling structure for an electronic circuit board according to an exemplary aspect of the present invention includes an evaporator with an evaporation container storing a refrigerant; a condenser condensing and liquefying a vapor-phase refrigerant vaporized in the evaporator and radiating heat; and a pipe connecting the evaporator to the condenser, wherein the evaporator includes a heat receiving area, on one side of the evaporation container, thermally connecting to a heating element disposed on the electronic circuit board, and a plurality of flow path plates, in an area including the heat receiving area, extending in the direction parallel to the electronic circuit board; and a vapor-liquid interface of the refrigerant is positioned above or at the level of a lower end and below an upper end of the heat receiving area in the vertical direction, in the arrangement condition that the drawing direction of the flow path plates is approximately parallel to the vertical direction.

Abstract translation: 当使用具有大量发热量的加热元件时，使用电子电路板的冷却结构的电子设备的尺寸增加，因此，根据本发明的示例性方面的电子电路板的冷却结构包括 具有储存制冷剂的蒸发容器的蒸发器; 冷凝和液化在蒸发器中蒸发并蒸发热的气相制冷剂的冷凝器; 以及将蒸发器连接到冷凝器的管道，其中所述蒸发器包括在所述蒸发容器的一侧上的热接收区域，其热连接到设置在所述电子电路板上的加热元件，以及多个流路板， 包括受热面积的区域，沿与电子电路板平行的方向延伸; 并且在流路板的拉拔方向为大致的布置条件下，制冷剂的汽 - 液界面位于上下方向的下端的上方并位于热接收区域的上端的下方 平行于垂直方向。

公开(公告)号：US20140366572A1

公开(公告)日：2014-12-18

申请号：US14370185

申请日：2012-12-12

Applicant: Arihiro MATSUNAGA ,  Minoru YOSHIKAWA ,  Hitoshi SAKAMOTO ,  Akira SHOUJIGUCHI ,  Masaki CHIBA ,  Kenichi INABA ,  NEC Corporation

Inventor： Arihiro Matsunaga ,  Minoru Yoshikawa ,  Hitoshi Sakamoto ,  Akira Shoujiguchi ,  Masaki Chiba ,  Kenichi Inaba

IPC: F25B39/00 ,  F25B39/04 ,  F25B39/02

CPC classification number: F25B39/00 ,  F25B23/006 ,  F25B39/028 ,  F25B39/04 ,  F25B2339/02 ,  F25B2339/041 ,  F28D15/0266 ,  F28D2021/0028 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

Abstract: [Problem] When a size of a cooling device using a boiling cooling system is reduced, a cooling performance decreases.[Means for solving the problems] It is characterized in that an evaporation unit which stores refrigerant, a condensing unit which condenses a gas-phase refrigerant produced by vaporizing the refrigerant in the evaporation unit to a liquid and dissipates heat, a vapor pipe which conveys the gas-phase refrigerant to the condensing unit, and a liquid pipe which conveys a liquid-phase refrigerant obtained by condensing the gas-phase refrigerant in the condensing unit to the evaporation unit are included, the condensing unit includes a heat dissipation flow path, an upper header which connects the vapor pipe and the heat dissipation flow path, and a lower header which connects the heat dissipation flow path and the liquid pipe, the upper header includes a flow path header portion connected to the heat dissipation flow path and an upper header extension portion located around the flow path header portion, and the upper header extension portion has a connection port connected to the vapor pipe in a face to which the heat dissipation flow path is connected.

Abstract translation: [问题]当使用沸腾冷却系统的冷却装置的尺寸减小时，冷却性能降低。 解决问题的手段其特征在于，存储制冷剂的蒸发单元，将通过将蒸发单元中的制冷剂蒸发而产生的气相制冷剂冷凝成液体并散热的冷凝单元，传送蒸发管 包含冷凝单元的气相制冷剂和将冷凝单元中的气相制冷剂冷凝至蒸发单元而获得的液相制冷剂的液体管，包括散热流路， 连接蒸气管和散热流路的上部集管和连接散热流路和液体管的下部集管，上部集管包括与散热流路连接的流路集管部，上部 头部延伸部分位于流动路径头部分周围，并且上部标题扩展部分具有连接到蒸气pi的连接端口 pe在散热流路连接的面上。