公开(公告)号：US20170351181A1

公开(公告)日：2017-12-07

申请号：US15605259

申请日：2017-05-25

Applicant: NITTO DENKO CORPORATION

Inventor： Yuu SUGIMOTO ,  Hiroyuki TANABE ,  Yoshito FUJIMURA

IPC: G03F7/20 ,  H05K3/18 ,  G03F7/039 ,  H05K3/06 ,  G03F1/38 ,  G03F7/26 ,  G03F7/38 ,  H05K3/10

Abstract: In a method for producing a wired circuit board includes a step (1), in which the insulating layer having an inclination face is provided; a step (2), in which a metal thin film is provided on the surface of the insulating layer including the inclination face; a step (3), in which a photoresist is provided on the surface of the metal thin film; a step (4), in which a photomask is disposed so that a first light exposure portion and a second light exposure portion in the photoresist are exposed to light, and the photoresist is exposed to light; a step (5), in which the first light exposure portion and the second light exposure portion are removed; and a step (6), in which the first wire and the second wire are provided on the surface of the metal thin film.

公开(公告)号：US20170339786A1

公开(公告)日：2017-11-23

申请号：US15671549

申请日：2017-08-08

Applicant: NITTO DENKO CORPORATION

Inventor： Hiroyuki TANABE ,  Naohiro TERADA ,  Yuu SUGIMOTO ,  Daisuke YAMAUCHI

IPC: H05K1/05 ,  H05K1/11 ,  G11B5/48 ,  H05K3/40 ,  H05K3/44

CPC classification number: H05K1/05 ,  G11B5/4826 ,  G11B5/484 ,  G11B5/4853 ,  H05K1/0278 ,  H05K1/0393 ,  H05K1/11 ,  H05K1/18 ,  H05K1/181 ,  H05K3/4007 ,  H05K3/44 ,  H05K2201/10151 ,  H05K2201/10227

Abstract: A suspension board with circuit includes a metal supporting board, a base insulating layer disposed at one side in a thickness direction of the metal supporting board, and a conductor layer disposed at one side in the thickness direction of the base insulating layer and including a connecting terminal electrically connected to a slider. The base insulating layer has a terminal region, when projected in the thickness direction, overlapped with at least the connecting terminal and a circumferential region not overlapped with the terminal region and around the terminal region, and the thickness of the terminal region is thicker than that of the circumferential region.

公开(公告)号：US20170188453A1

公开(公告)日：2017-06-29

申请号：US15386755

申请日：2016-12-21

Applicant: NITTO DENKO CORPORATION

Inventor： Yuu SUGIMOTO ,  Hiroyuki TANABE

IPC: H05K1/02

CPC classification number: H05K1/0296 ,  G11B5/4853 ,  G11B5/486 ,  H05K1/0277 ,  H05K1/0393 ,  H05K1/056 ,  H05K3/108 ,  H05K2201/0191

Abstract: The wired circuit board includes an insulating layer and a conductive pattern provided on the insulating layer. The insulating layer has an inclined face and a flat face, and a supplementary angle y to an angle formed by the inclined face and the flat face is more than 0 degree and 20 degrees or less.

公开(公告)号：US20150382451A1

公开(公告)日：2015-12-31

申请号：US14753512

申请日：2015-06-29

Applicant: Nitto Denko Corporation

Inventor： Hiroyuki TANABE ,  Hitoki KANAGAWA

IPC: H05K1/02 ,  H05K3/18 ,  H05K3/46 ,  H05K1/09

CPC classification number: H05K3/28 ,  H05K3/244

Abstract: A write wiring trace is formed over insulating layer. A coating layer, being directly in contact with at least a first portion of a surface of the write wiring trace, is formed over the insulating layer to cover the write wiring trace. A connection terminal is formed over the insulating layer to be electrically connected to the write wiring trace and exposed from the coating layer.

Abstract translation: 在绝缘层上形成写入布线。 直接与写入布线迹线的表面的第一部分接触的涂层形成在绝缘层上，以覆盖写入布线迹线。 连接端子形成在绝缘层上以电连接到写入布线迹线并从涂层暴露出来。

公开(公告)号：US20150189742A1

公开(公告)日：2015-07-02

申请号：US14519636

申请日：2014-10-21

Applicant: NITTO DENKO CORPORATION

Inventor： Hiroyuki TANABE

IPC: H05K1/02 ,  H05K3/16 ,  H05K3/18 ,  H05K3/14

CPC classification number: H05K1/0245 ,  G11B5/484 ,  H05K1/056 ,  H05K3/44 ,  H05K2201/09245 ,  H05K2201/09254

Abstract: A suspension board with circuit includes a metal supporting layer and an insulating layer formed on the metal supporting layer. The insulating layer is made of a single layer, a concave portion is formed in the insulating layer, an opening portion that exposes the metal supporting layer is formed in the concave portion, and an electrically conductive metal portion is formed in the opening portion.

Abstract translation: 具有电路的悬挂板包括金属支撑层和形成在金属支撑层上的绝缘层。 绝缘层由单层制成，在绝缘层中形成凹部，在凹部形成露出金属支撑层的开口部，在开口部形成导电性金属部。